Don Brown

Director, IWPC

	BS, Mechanical Engineering, Penn State University
	MS, Mechanical, Aerospace and Biomedical Engineering, University of Delaware
	MBA Coursework, Temple University
	Awarded 3 US Patents on Electronic Assembly Equipment and Materials
	1 US Patent Pending

Authored, co-authored or edited:

	The Future Economics of Wireless & RF Communications Packaging ™
	Electronic Packaging Strategies of the 80’s ™ (multi-client study)
	VLSI & the Substrate Connection ™ (multi-client study)
	Electronic Packaging in Japan ™ (multi-client study)
	Surface Mount Technology - How to Get Started ™
	The Journal of SMT Standards ™
	The Surface Mount Shopper ™
	Surface Mounting Directory ™ (6 editions)
	The Hybrid Facilities Directory ™
	Dozens of trade newspaper and magazine articles

Conducted Industry Forums/Workshops on:

	The Economics of Surface Mount Technology ™
	Surface Mount Standards ™
	The Economics of Buried Passive Components ™
	The Future Economics of Electronic Packaging ™
	The Future Economics of Wireless Packaging ™
	Electronic Product Design System (tm) Initiative, Workshops 1, 2, 3, 4
	Microwave/Millimeter Wave Antenna and Subsystem Technologies
	Breakthrough Packaging for Local Multipoint System (LMDS) Equipment
	Next Generation Handset Packaging
	Fanless Base Station Packaging
	Future Bluetooth, Home RF, WLAN and Automotive Wireless Packaging
	Broadband Millimeterwave Service Providers & Packaging Supply Chain Summit

Chaired or Co-Chaired:

	IMAPS Integrated Passives Workshop, 1996, '97, '98
	IMAPS Low Cost Packaging Workshop, 1996
	MMRC Wireless Technology Workshop, 1997
	MMRC Future Computing Workshop, 1998
	MMRC Future Testing Workshop, 1998
	MMRC Future Telecommunications Infrastructure, 1999
	MMRC Future Electronics Outsourcing, Jan 2000
	MMRC Future Automotive Electronics, June 2000
	IMAPS Future Digital Interconnections over 500 MHz, 1999
	Integrated Packaging for Wireless Products Sessions, 1998,'99 (Wireless & Portable by Design Conference, Penton Publications)

Conducted Private Consulting Studies on:

	Advanced Ceramic Materials
	BGA/Flip Chip Inspection Equipment
	Solder Paste Inspection Equipment
	Electronic Fuses
	Component Price Forecast
	Complete Market Research Study for Odd Form Automation in North America
	Worldwide Technology Shifts in [client’s name] Electronics Environment
	Market Survey on New Concept for Tape Bonding and Flip Chip Assembly
	Market Study on the Metal Lead Frame Industry
	Trends in Military Electronics Constructions – Short & Long Range Planning Options
	Technical Market Study on TAB/BTAB Tape, Flexible Circuits and Photo Chemical Machining
	Market Research – Hybrid Industry in the USA
	Market Research - Miniature Refrigeration Systems to Cool Electronic Systems
	many more…

Has interviewed more than 30,000 users since 1988 to ascertain their needs for electronic components, design and assembly equipment, materials, design and assembly services.

Lectured Worldwide

Member, Professional Societies

	IMAPS (life member)
	IEPS (past national director)
	SMTA (past corporate member)
	IEEE
	SAE
	ITSA