IWPC Home Page

NEW    –    International Wireless Packaging Consortium
Interactive Technical Workshop


GigaBits to the Desktop  
Convergence of
Millimeterwave Radio &
Opto-Electronics
Packaging
at 10's of GigaBits per Second

Co-Hosted by:


January 16-18, 2001

Following IMAPS High Speed Digital Advanced Technology Workshop

Radisson Resort Scottsdale
7171 N. Scottsdale Road
Scottsdale, AZ  85253-3696
TEL: 480-991-3800
Fax: 480-948-9843

 

Organized by the International Wireless Packaging Consortium

 

Click HERE to Register for Workshop

 

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

 

Workshop Goal

 

GigaBit (Broadband) Speed Communications is coming to our desktop, faster than many thought possible.

 

The GOAL of this workshop is to explore the convergence of millimeterwave radio and microwave/millimeterwave opto-electronic packaging technologies, across the supply chain (devices, materials, products, equipment and services) which will be needed to support future GigaBit per second speeds to the Desktop.

 

This IWPC Workshop is one of our "Overview Series", where we have a chance to look into the near future and explore what applications and markets are going to require advanced packaging technologies.

 

 

 

 

 

GigaBits to the Desktop 
Convergence of
Millimeterwave Radio &
Opto-Electronics
Packaging
at 10's of GigaBits per Second


Co-Hosted by:


January 16-18, 2001


Radisson Resort Scottsdale
7171 N. Scottsdale Road
Scottsdale, AZ  85253-3696
TEL: 480-991-3800
Fax: 480-948-9843

 

Very Preliminary Agenda
subject to changes

 


Tuesday, January 16, 2001

 

7:00 PM

 REGISTRATION

SOCIAL RECEPTION

At Radisson Resort Scottsdale Hotel


Wednesday
, January 17, 2001

 

7:00 AM

REGISTRATION
&
BREAKFAST

 

8:00 AM

OPENING REMARKS

Don Brown
Director, IWPC

8:20 AM

SELF INTRODUCTIONS

Each person will be asked to introduce him/herself and share how they can contribute to this process.

9:00 AM

KEYNOTE PRESENTATIONS

 

Our hosts will share with us their vision of GigaBits to the Desktop markets, products and applications, AND the needs of future broadband millimeterwave radio packaging and how this packaging technology is converging for future broadband opto-electronic packaging at 10's of GigaBits per second.

Title TBD

Doug Lockie
Founder and Executive Vice President
EndWave

Title TBD

Dr. Louis Manzione
Director, Wireless and Opto-Electronic Packaging Research Dept.
Lucent Technologies

 

HIGH SPEED WIRELESS AND 
OPTICAL NETWORK 
Service PROVIDERS

 
10:00 AM

 

3 speakers at 20 minutes each

 

MARKETS, APPLICATIONS and REQUIREMENTS

 

  • What is Gigabit Radio to the Desktop?

  • What are the similarities and differences from the System Requirements of Gigabit Optoelectronics and 20-100 GHz Radios?

  • What are the target markets and applications?

  • What is the Deployment Schedule?

  • System Overview

  • Expected Performance and Costs Targets

  • Market Sizes

 

 

Invited but not yet confirmed

  • 360 Networks

  • AT&T

  • Bell Canada

  • Enron

  • Global Crossing

  • Hitachi

  • Level 3

  • NTT

  • Qwest

  • SBC

  • Telus

  • Touch America

  • UUNet Worldcom

  • Williams Communications

  • others...

 

 

Break

11:00 AM

PANEL SESSION

HIGH SPEED WIRELESS AND OPTICAL
SERVICE PROVIDERS

 

Panel members are speakers from previous session and other selected experts.

 

12:00 PM

LUNCH

 

 SYSTEM AND SUBSYSTEM COMPANIES

 

1:00 PM

 

 

wireless 
SYSTEM AND SUBSYSTEM COMPANIES

  • What equipment systems and sub-systems are being developed to support gigabits to the desktop?

  • What are the "wish lists" of these suppliers to the packaging industry?

  • How will this equipment manage harmonics in the 200-400 GHz range, to support GigaBits to the desktop?

  • What devices, materials, antennas, testing, thermal management and antennas are desired to support the development of this equipment?

  •  

 

Title TBA

Dr. Christian Borgwardt
Head of Sales and Marketing - Microwave Factory
EADS Deutschland GmbH

 

 

 

Invited but not yet confirmed

  • Alcatel Telecom Research Division

  • Bellcore

  • Fujitsu

  • GEC-Marconi Materials

  • IBM

  • Lucent/Bell Labs

  • Marvell Technology Group Ltd

  • NEC

  • Nokia (WAND)

  • Nortel Networks

  • Perelli

  • Sandia

  • SMC Networks

  • Toshiba 

  • Western MultiPlex

  • others...

 

BREAK

3:00 PM

 

5  speakers at 15 minutes each

OPTO-ELECTRONIC
SYSTEM AND SUBSYSTEM COMPANIES

  • What equipment systems and sub-systems are being developed to support gigabits to the desktop?

  • What are the "wish lists" of these suppliers to the packaging industry?

  • How will this equipment manage harmonics in the 200-400 GHz range, to support GigaBits to the desktop?

  • What devices, materials, antennas, testing, thermal management and antennas are desired to support the development of this equipment?

  • Packaging implications for opto-electronic modulators and demodulators

 

 

 

Multi Giga Bit Network Electronics -- Trends and Needs

Jeff Cain
Hardware Engineering Mgr - Optics & GigaBit Signals
Cisco Systems

 

Evolution to all Optical Switching

Speaker TBA
Tellium, Inc.

 

Requirements for High Speed Integrated Optical Transciever Module Packaging

Dr. Steve Marsh
Principal Engineer
Marconi Caswell Limited

 

 

Invited but not yet confirmed

  • ADC

  • Alcatel

  • Cienna

  • Corvis

  • EG&G

  • Fujitsu

  • IBM Zurich

  • JDS Uniphase

  • Microelectronics

  • Marvell Technology Group

  • Novalux 

  • NEC

  • Nokia

  • Nortel Networks

  • Perelli

  • PMC Sierra

  • SDL

  • SMC Networks

  • Toshiba

  • others...

 

4:30 PM

PANEL SESSION

OPTO-ELECTRONIC
SYSTEM AND SUBSYSTEM COMPANIES

 

Panel members are speakers from previous session and other selected experts.

 

5:00 PM

End of Day

7:00 PM

Dinner and Entertainment

Scottsdale Style

 

 

Transportation provided from/to hotel


Thursday
, January 18, 2001

 

7:00 AM

BREAKFAST

8:00 AM

 

15 short 5-7 minute presentations

KEY ADVANCES IN MICRO/MILLIMETERWAVE DEVICES, PACKAGING AND MATERIALS TECHNOLOGY FOR GIGABIT WIRELESS AND OPTO-ELECTRONIC APPLICATIONS

  • Micro/Millimeterwave Optoelectronic modulators and drivers

  • Tunable dielectrics for in-process tuning

  • Substrate issues (e.g thermal)

  • Novel Multilayer Integrated Structures

  • Antennas- Lenses for millimeterwave and optics

  • Shielding and EMI Control

  • Harmonic control techniques

  • Unconventional packaging technologies for over 40-200 GHz

  • Other topics...

 

 

High Speed Packaging Needs for Optoelectronic Components

Bob Boudreau
Technical Program Manager, High Speed Pkg
Corning Incorporated - Science and Technology

 

Ceramic Substrate Design for GigaBits to the Desktop

Speaker TBA
Ceramic Interconnect Initiative

 

Designing a Hermetic, Leaded Amplifier Package for OC-192 Data Rates

Arne Knudsen, Paul Garland, Jerry Aquirre, Mark Eblen, Mark Patterson and Ben Velsher
Kyocera America Inc.

 

Value Analysis for a 10 GigiBit Package

Miriam Ludwig
Member of Technical Staff
Lucent Technologies

 

Wire Bond Performance at 10-40 GHz

Dr. Alan Lyons
MTS
Lucent Technologies - Bell Labs

 

Gigabit/second IC Package Analysis and Design Using Ansoft's Full-Wave Spice and Symphony for Transient and BER Prediction

Speaker, TBA
Ansoft Corp.

 

Title TBA

Dr. Dwight C. Streit
Director
TRW, Space & Electronics Group

 

Title TBA

Speaker TBA
HEI Corp.

 

Effects of Coaxial Interconnects to Substrates and Optical Structures up to the 40 GBit/s

Bernhard Rosenberger
Head Of Research And Development
Rosenberger Hochfrequenztechnik

 

Opto-Electronics Packaging Roadmap

Speaker TBA
Amkor

 

New Opto-Electronic Packaging Platforms - A Roadmap

Steve Anderson
CEO
Silicon Bandwidth

 

 

 

Invited but not yet confirmed

 

Devices

  • Alpha Semiconductor

  • AMCC

  • Filtronic

  • GCS

  • Hitachi

  • Hughes Research Labs

  • IBM

  • Infineon

  • Intel (Giga)

  • Mitsubishi

  • Raytheon

  • TI

  • Toshiba

  • TriQuint

  • UMS

  • Vitesse

  • others...

 

Materials

  • Arlon

  • Ceramic Interconnect Initiative

  • Holl Technologies

  • Metclad

  • Rogers Corp

  • Taconic

  • others

 

Packaging

  • Kyocera

  • others...

 

Thermal Management

  • Aavid

  • others...

 

Shielding

  • Boldt

  • Instrument Specialties

  • Metex

  • others

 

Antennas

  • TBA

 

MEMs

  • MemsCAP SA

  • Microcosm

 

Contract Assembly

  • Celestica

  • CTS

  • Flextronics

  • Innovacomm Technologies, Inc.

  • Xetel

  • others...

 

Testing Equipment

  • Agilent

  • Anritsu

  • Maury

  • Rhode & Schwartz

  • SHF

  • Tektronix

  • others...

 

Design Tools

  • Agilent

  • Zeland

  • Zuken

  • others...

 

10:00 AM

BREAK

10:20 AM

KEY ADVANCES IN MICRO/MILLIMETERWAVE DEVICES, PACKAGING AND MATERIALS TECHNOLOGY FOR GIGABIT WIRELESS AND OPTO-ELECTRONIC APPLICATIONS
(Cont'd)

11:00 AM

PANEL SESSION

NOON

LUNCH

 

1:00 PM

SET UP BREAKOUT SESSIONS

 

Topics to be determined during workshop

1:30 PM

BREAKOUT SESSIONS

3:30 PM

BREAKOUT SESSION SUMMARY REPORTS

4:30 PM

 WRAP UP 

WHAT'S NEXT

  

·          Set Up Advisory Board  ?

·         Set up Working Groups ?

·         Attendee closing remarks

·    Closing remarks

 

5:00 PM

ADJOURN

7:30 PM

Dinner - Dutch

 

 For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes.

 

PRESENTATIONS

 

We have limited time slots available, but want to extend invitations to those people who wish to make a presentations.

 

PLEASE MAKE CONTACT WITH RENE DOUVILLE  OR DON BROWN ASAP TO DISCUSS THE DETAILS OF YOUR PRESENTATION AND TO MAKE CERTAIN THAT THERE WILL BE TIME AVAILABLE FOR YOUR PRESENTATION.

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

rene.douville@iwpc.org
or

donbrown@iwpc.org

 

or by snail mail to:

IWPC

1745 Appaloosa Rd.

Warrington, PA 18976       USA

If your file is larger than 3 MB, please use http://www.middlewire.net

(formerly Click2Send.com)

Call or email Don Brown for instructions on how to use middlewire.net

 

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

 

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  Monday, January 8, 2001

 

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. We estimate that these costs will be $250-300 (US) per person.

 

Attendees AND pre-approved guests will be asked to pay this fee at registration (or in advance) with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.  No ties, please !!

 

HOTEL

We have blocked 30 rooms on Tuesday January 16 and 50 rooms on Wednesday January 17 at the The Radisson Resort Scottsdale
at a Room Rate of $194.

 

Radisson Resort Scottsdale
7171 N. Scottsdale Road
Scottsdale, AZ  85253-3696
TEL: 480-991-3800
Fax: 480-948-9843


Please call or fax hotel for reservations

 

Please call the hotel before December 20, 2000 to make your reservations at this rate.  

 

After December 20, 2000 the hotel will release the un-reserved rooms and you may be charged full hotel rates.

   

Click HERE to Register for Workshop