Author: Don Brown
The Future Economics of Wireless and RF Communications Packaging An Ongoing Journey...
Founding Members of Consortium Research
Goal of the International Wireless Packaging Consortium
Research Conducted to Date
IWPC Research to-date has...
Examples of Wireless Products
Communication Networks
Some Interesting Numbers (1)
Some Interesting Numbers (2)
Some Interesting Numbers (3)
Some Interesting Numbers (4)
Some Interesting Numbers (5)
OEM-Supplier Food Chain Model
RF & Wireless Packaging Issues to Consider
Considerations When Designing a Wireless or RF Product
“Air Interface” Alphabet Soup
RF vs Digital Packaging Trends
Typical Example of Matching Networks needed for 2400 MHz ISM Band Power Amplifier for Wireless Applications Source: Pacific Monolitics PM2107
Digital Phone Design Cycle for New and Derivative RF Circuit
Example of Desired Future Design Cycle Requirements for Point-to-Point Radio
Discrete vs Integrated Packaging Solution Tradeoffs
Integrated Packaging vs Design Effort
The Economics of Integrated Passive Component Technologies Two VERY SPECIFIC HYPOTHETICAL Examples...
Integrated Packaging Project worth $20 Million/year
Integrated Antenna Project for Point-to-Point Radio
Integrated Antenna Applications
Pros and Cons of Discrete vs Integrated Design Solutions
Materials and Manufacturing Tolerance Implications
CDMA Signal Envelope
Linear Power Amplifiers Needed for a CDMA Signal
Implications of Future Software Phone
Current Design Tool Behavior
Potential Cost Savings with Advanced Design Tool System
Proposed Advanced Design Tool System
Partial List of Future Developments Needed to Improve Performance and Reduce Costs of Wireless & RF Communications Products
Conclusions
Future Conferences Planned for IWPC Members
And the journey continues...