RF & Wireless Packaging Issues to Consider

• Operating Frequency

• Band Pass Design and Tolerance requirements

• Transmitted RF Power

• Received RF Power

• Dissipated Power

• Desired system gain and link budget

• Shielding Issues

• Matching Networks

• Insertion Loss

• Return Loss

• Dielectric Constant of interconnect

  • stability more important than actual value -- very product specific

• Loss Tangent of interconnect

  • as low as needed - very product specific

• Thermal Stability of Material Properties

• Q

• Hermeticity requirements

• Time to Market (prototype and production)

• OOOP’s Factor

  • how quickly can the designer make changes, get a prototype built and get changes into production

• Multiple Suppliers

• COST, COST, COST

• Many other factors, to numerous to mention

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