Considerations When Designing a Wireless or RF Product

• Regulatory Issues

• Service Providers Needs

• Air Interface Standards

• Antenna Issues (health issues)

• Semiconductor Technologies

  • CMOS
  • GaAs
  • SiGe
  • LDMOS
  • Bipolar
  • HBT
  • HEMT
  • PHEMT
  • Si on Sapphire
  • MBIC - modular bipolar IC
  • InP

• Thermal Issues

• Product Design

  • size
  • weight
  • reliability

• Materials

  • Organic materials
    • FR4
    • GTECH
    • PTFE
    • Composites
    • others
  • Ceramics including LTCC
    • thin film
    • thick film
    • photoimagable thick film
    • others

• RF Front End Reqm’ts

• Digital Back End Reqm’ts

• Battery Technology

• Ergonomics and Shielding

• Time to Market

• COST, COST, COST

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