Integrated Antenna Applications

• Low dielectric loss

• High thermal conductivity

• Low resistivity interconnects

• Capability of tailored ?r layers

• Thermally stable dielectrics

PLANAR ANTENNA REQUIREMENTS

Source: Sarnoff Labs

MMIC Chip

Filter

Thermal Vias

Electrical Vias

Antenna Elements

Metal Core

• Dimensional Stability

• High feed line density
  • fine layers, many layers, many vias

• High strength and toughness

• Good shrinkage control

• Low cost
  • low incremental layer cost

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