Partial List of Future Developments Needed to Improve Performance and Reduce Costs of Wireless & RF Communications Products
Significantly improved design tools, combining mechanical, thermal AND electrical capabilities
Create standardized circuit simulation model library, for all types of structures and manufacturing processes
Complete and accurate materials properties data, as a function of frequency and temperature
Fast RF prototyping services
Tunable filters, for multi-band phones
Integrated packaging technologies brought into the mainstream of suppliers capabilities
Low cost air-cavity packaging with built-in tuning circuits, both in ceramic and plastic
High gain, low cost, planar antenna systems
Printable conductive inks, with at least 50% the conductivity of bulk copper, for RF ID tag industry
Quasi-hermetic chip coating with a dielectric constant as close to 1 as possible