Conclusions
To meet “time to market” pressures, OEM’s require a very close communication channel to packaging technology suppliers - THIS IS A NEW PARADIGM!
Wireless and RF packaging engineers of the future, must become “deeply” knowledgeable about newly available materials systems, materials properties, and new design tool systems
The Future Economics of Wireless & RF Packaging require:
- precision, stable materials
- often, a more expensive material provides a lower overall cost product, because it is easier and faster to model, design and build
- precision manufacturing processes, depend on:
- frequency, power and environment of product
- substantial improvements in “integrated packaging” technologies at all levels
- ongoing and substantial knowledge gains by design and manufacturing persons