IWPC_Handset_Workshop_Haier

NEW – International Wireless Industry Consortium
Interactive Technical Workshop

Michael Mullineaux, Sr. Program Manager, IWPC
Rene Douville, Technical Director, IWPC

Workshop Background: China has emerged as the largest market for handsets Globally and as a result has fostered the creation of world leading handset manufacturers. These manufacturers are now looking to increasing their share of market outside China. Haier is the world’s 4th largest white goods manufacturer and one of China’s Top 100 electronics and IT companies and currently has a substantial handset manufacturing operation (10-12 million units annually). Haier's vision is to expand their handset activities and Brand to support not only markets in Asia, but elsewhere in the World. Haier is inviting the IWPC Membership and global Mobile Phone Carriers to this very first international supply-chain wide handset workshop in China.
Workshop Goals: The Goal of this workshop is to build global win-win relationships at ALL levels of the mobile phone supply chain. International carriers will share their expectations and objectives in developing supplier relationships with domestic Chinese handset makers. EMSs, and ODMs will learn what is expected of them in working with Haier And Subsystems, component and materials suppliers will learn what relationships they are expected to develop with Haier, EMSs and ODMs as well as other suppliers to these companies as customers or partners.
Monday, June 26, 2006
7:00 PM	Social Reception, Registration and Toasting Ceremony	At Crowne Plaza Hotel
Tuesday, June 27, 2006
7:00 AM	Registration and Breakfast
8:00 AM	Opening Remarks	IWPC
8:15 AM	Self Introductions	Each person is asked to introduce themselves to tell us their name, company, job title and what they are hoping to learn at this workshop.
9:00 AM	Haier Keynote Presentations	How Haier can Provide Carriers with Value Added Handsets Mr. Yu Xin Shan General Manager of Oversea Department in Haier Telecom and Dr. Guo Jun Min General Manager of Haier Mobile Design
9:55 AM	Networking Break
10:15 AM	Chinese Government Representative	China Handset Market Mr Xie Yi VP MII Academy
10:55 AM	Carrier Presentations What do Carriers wish for in forming and retaining a relationship with Chinese Handset Makers? Cost Brand Flexibility in choice of features and function sets and manufacturing capability Time to market Software development: OS and/or application development Regional market knowledge of consumer desires and preferences What are Carrier expectations and plans for Ultra Low-cost or Feature-Rich 3G/or 3G+ Handsets? What are the differentiators a handset OEM must be able to offer to earn a Carrier’s business? Business differentiators Technology differentiators Fast design-in of new Handset features Low power consumption designs Other? What are the regional Market Requirements and how do they differ? Chinese market North American market European market Indian market Russian market	Handset Requirements for the Indonesian Market Ronald Simanjuntak VP, Product & Business Development Mobile-8 France Telecom (Orange) Terminal Innovation Mr. Haila Wang CTO France Telecom
12:15 PM	Networking Lunch
1:30 PM	Carrier Panel Carriers will discuss to further clarify their requirements and answer questions from the audience. The Carriers will also have an opportunity to ask each other questions. What issues need to be added or clarified from the previous Carrier presentations? What experiences have each Carrier had in dealing with Chinese handset OEMs? What can the industry learn from these experiences? What are the key areas of improvement needed in these relationships in the future? What are the areas of technology that the entire global supply chain should focus on to meet Carriers requirements? What does Ultra-Low Cost handsets mean to each Carrier? What is the continuum of features needed from Ultra-Low Cost to Feature Rich handsets? Do Ultra low-cost and Feature-Rich Handsets "look and feel" the same regardless of the market? What should the global supply chain do to meet very differing market requirements at the same time? Are industry hardware and software and testing standards meeting your requirements? OMTP, OMA, FMCA etc. If not, what is needed in the future?	Previous speakers and other Carriers present *Confirmed to date: () China Mobile, China France Telecom, China/Europe Mobile-8, Indonesia Vibo Telecom, Taiwan** () subject to change*
3:00 PM	Break
3:20 PM	ODM/EMS Session What are the future business & technology relationships between OEMs, ODMs, EMSs and the Supply Chain to meet Carriers’ needs? Who is the customer? What can the ODM/EMS companies do to help reduce cost of handsets and time to market? Which competencies can these companies offer? Design Services Manufacturing processes (F/C, CSP etc.) Testing Services Assembly Automation Sourcing and “Cluster Management” After-market repair services Recall and Rework Operating Systems Applications	EMS Design Services for Mobile Communications Jerry Zhou Business Unit Manager Jabil Circuit, Shanghai Ltd. The Right Phone in the Right Market at the Right Time at the Lowest Cost - Post Manufacturing Logistics Mark Lacy Business Development Celestica
4:20 PM	Handset Operating System Session	SavaJe Mobile Platform Mr. Samuel Li VP, Product Marketing & 3G Program Lead SavaJe Technologies, Inc.
4:50 PM	Adjourn for Day
7:00 PM	Haier Dinner with special Toast by the Vice Mayor of Qingdao Mr. Zhang Xu Ming welcoming IWPC	Dinner at Crowne Plaza Hotel
Wednesday, June 28, 2006
7:00 AM	Breakfast
	Enabling Technology Sessions In the following Enabling Technology Sessions, IWPC Members will share their insights into their handset technologies and how they can interact, win-win, with Chinese Handset OEMs, ODMs and EMS' to meet the needs of Carriers, worldwide. Ultra-low Cost Solutions.
8:00 AM	Receiver/Transmitter Session Cost-reduction opportunities New Approaches to Multi-mode, Multi-band Receivers/Transmitters: Power amplifiers - one or many? Linearization Techniques of PAs Architectures? Low IF or zero IF (ZIF) Other? What is the impact of reconfigurability on Transceiver design? RF Front-Ends Integration options Combined Cellular/WLAN/WiFi Front-Ends Views on standardization New Solutions to meet changing market requirements	Radio Front Ends for Cell Phones, PDAs & Laptops Jose Harrison Director, Cellular/PA Products SiGe Semiconductor High Integration Transceiver Module Richard Wang Mgr. AE, Greater China RFMD RF Component and Module Technologies for Mobile Handsets Chen Ning General Manager Development Group PED Technical Center of China Panasonic R&D Center China Co., Ltd. Improving Talk Time, Data Rates and Link Margin; using a Novel Adaptive Impedance Matching Module in the Radio Greg Mendolia Senior VP, Mobile Wireless Products Paratek
10:00 AM	Networking Break
10:30 AM	Base-band & Memory Session New Architectures Is there a way to future-proof Base-Band? Future Integration Paths Pros and Cons Digital and Analog Base-band - both on one chip or two separate chips? Will Analog circuits disappear in the Base-Band? Views on impact on cost reduction attributable to integration Memory Technology Roadmaps External versus Internal Memory Solutions Pros & Cons	Baseband Architectures and Partitioning Trade-Offs Ms. Hong Fan Marketing Manager, RF & Wireless Systems Business Unit Analog Devices Future Memory Architectures for Mobile Handsets Tom Arnold Director, Market Development Memory Innovation Micron Technology Multiple Antenna Signal Processing for Enhanced Handset & Network Performance Xin Huang Sr. Product Manager ArrayComm
12:00 PM	Networking Lunch
1:00 PM	Multi-Media Sub-Systems Session Camera Modules GPS Modules TV Tuners/Demodulators MP3 players	"Proven Performance" DVB-H Receivers Benefit on Networks Infrastructure Cost Gerard Pousset V.P. Marketing / Business Development DibCom Integration of Position Technology into Handset (GPS, Aiding, Hybrid) Adrian Tan VP Sales Asia Pacific u-Blox How Multimedia Chipset Solution Designs Address Market-Specific Issues Steven Hsu Sr. Director, Greater China Skyworks
2:30 PM	Networking Break
3:00 PM	Materials, Substrates and Packaging Session Solutions to reduce both costs and size of handsets to be discussed Device Packaging System Packaging Advanced materials	Material Solutions to Meet Design Challenges and Value-Chain Needs Mike Sobota Product Manager W.L. Gore Associates New Developments in Copper-Beryllium Alloys for High Performance Applications Mr. Jimmy Johnson V.P. Asia Marketing and Technology Brush Engineered Materials Inc. Mobile Phone Thermal Management - Increased Carrier and OEM Revenues Through Improved User Experience Pekka Rintala District Sales Manager, Nordic Countries GrafTech
5:00 PM	Adjourn for Day
7:00 PM	Dinner at Qingdao Beer Brewery	Transportation will be provided to/from Hotel/Restaurant
Thursday, June 29, 2006
7:00 AM	Networking Breakfast
8:00 AM	Mechanical, Electro-Mechanical Sub-Systems and User Interface Sub-Systems Loudspeakers and microphones Plastics Connectors (low-cost, FPC connectors, elastomer) Space reduction solutions and price trends RF Shielding Integrated Antenna Modules (Multi-Band and Smart Antennas etc.) Displays (including Touch-Screens, Stylus Pens, Handwriting Recognition) Standardized LCDs Price Trends Voice and Palm Print Recognition Keypads	Integrating Mechanics & Electronics in Handheld Devices Thomas Tang Senior Manager Product Design, APAC Perlos Handset Displays for Ultra Low-Cost to Full Feature Devices Dr. David Hind VP Global Business CDMA Developers Group (CDG)
9:00 AM	Managing Intellectual Property in China	Mr. Doug Clark, Esq. Lovells
9:30 AM	Partnering Sessions During this Session, Haier Experts will sit at tables with interested parties to discuss potential partnership requirements and opportunities for developing a Global Mobile Handset Ecosystem. Partnership Topic Tables hosted by Haier Experts: Power Management Chip-Sets, Dynamic Power Management Techniques Multi-Media, User-Interface and Electro-Mechanical Modules RF Chip-Sets Base-Band Chip-Sets and Memory Technology Packaging, Materials and Substrates	One or more Haier Expert(s) per Table Translation Services Made Available
11:00 AM	Partnering Session Reports The leader of each Partnering Session Table will give a short report of the results of their table discussion.
11:45 AM	Host Closing Panel Did the workshop meet Haier's expectations and objectives? What is further needed by the industry to meet these needs? What can the IWPC do to assist in moving this process forward?
12:15 PM	Takeaways, Next Steps & Closing Remarks
1:00 PM	Adjourn
1:00 PM	Networking Lunch
2:15 PM	Depart from Hotel to Tour the Haier Handset Manufacturing Facility Haier Product Showroom Lao Shan - Mountain View (Restrictions may apply)	Bus transportation is provided to/from the hotel to/from the Haier Facility
7:00 PM	Return to Hotel
7:30 PM	Dinner	Not included in the Workshop registration fee.
Friday, June 30, 2006
To be announced	Optional - Qingdao City Tour	Details to be announced. Not included in the Workshop registration fee.

VISA OPTIONS TO TRAVEL TO CHINA

If you need a Visa to travel to China, please click HERE to send request Visa invitation letter.

DEADLINE FOR HANDOUT MATERIALS:

Deadline for electronic version of handout materials:

Monday, June 12, 2006

COSTS/REGISTRATION FEE:

ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus First Day breakfast/lunch/dinner plus Second Day breakfast/lunch plus 4 Breaks), booklet copying, audio/visual costs, etc.

We estimate that these costs will be $997. (USD) per person. (For IWPC Members, only.)

ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, MasterCard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL:

Crowne Plaza Qingdao
76, Xiang Gang Zhong Road
Qingdao 266071, China
Phone: 86-532-85718888
Fax: 86-532-85716666

cpqingdao@public.qd.sd.cn

Please contact the hotel directly for reservations. Mention the IWPC room block rate of 848.00 RMB. Cut-off date for reservations is June 12, 2006. After that date rooms cannot be guaranteed at the IWPC rate.

TRAVEL OPTIONS TO/FROM QINGDAO AIRPORT TO/FROM HOTEL

Qingdao Liuting International Airport (TAO)

Distance: 30 KM/ 18.64 MI NE
Taxi Fee: CNY 100.0
Time by Taxi: 40 minutes

Qingdao Railway Station

Train Station Name: Qingdao Railway Station
Train Station Distance: 8 KM/ 4.97 MI E
Taxi Fee: CNY 100.0

AUDIO VISUAL:

A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.

BUSINESS CARDS:

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS:

Business casual suggested. No ties, please !!

HANDOUT MATERIALS:

IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.

Please send electronic materials (any size file) to:

manager@iwpc.net

or by snail mail to:

IWPC

600 Louis Drive, Suite 104
Warminster, PA 18974 USA

Click HERE to Register