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International Wireless
Industry Consortium
NEW – Technology Exchange Forum
Limited to 100 seats
First Registered, First Served
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Table of Contents
Deadline for Presentation Materials
Costs/Registration Fee for Members
Travel Options from Airport to Hotel
Handout Material Options for Members
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High Efficiency, High Linearity Semiconductor Devices for
Basestation Power Amplifiers -- II Devices and Packaging for
Basestation RF Power Generation,
Co-Hosted by:
Terminalstrasse Mitte 20
December 11-12, 2006 Munich, Germany
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Organized by the
International Wireless Industry Consortium
Click HERE to Register for Workshop
Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC
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BACKGROUND An IWPC workshop was held in November 2005 to discuss semiconductor devices for basestation power amplifiers. This workshop is a sequel to that one. Semiconductors and the semiconductor packaging are the key and limiting elements in basestation power amplifiers. This workshop will focus on these to address how they are evolving to meet the stringent demands being imposed both by the need for higher efficiency and powers, but also for use in mast head located radios. Alternative semiconductors are challenging the traditional hold of LDMOS for b |
