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International Wireless
Industry Consortium
NEW – Technology Exchange Forum
Limited to 100 seats
First Registered, First Served
Table of Contents
Deadline for Presentation Materials
Costs/Registration Fee for Members
Travel Options from Airport to Hotel
Handout Material Options for Members
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High Efficiency, High Linearity Semiconductor Devices for
Basestation Power Amplifiers -- II Devices and Packaging for
Basestation RF Power Generation,
Co-Hosted by:
Terminalstrasse Mitte 20
December 11-12, 2006 Munich, Germany
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Organized by the
International Wireless Industry Consortium
Click HERE to Register for Workshop
Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC
BACKGROUND An IWPC workshop was held in November 2005 to discuss semiconductor devices for basestation power amplifiers. This workshop is a sequel to that one. Semiconductors and the semiconductor packaging are the key and limiting elements in basestation power amplifiers. This workshop will focus on these to address how they are evolving to meet the stringent demands being imposed both by the need for higher efficiency and powers, but also for use in mast head located radios. Alternative semiconductors are challenging the traditional hold of LDMOS for basestation power amplifiers. How competitive are they and what can we expect in future? What roles will linearization and advanced thermal management schemes play in the evolution of the competition? |
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GOALS The goals of this Technology Exchange Forum are:
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Monday December 11, 2006 |
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7:00PM |
Social and Networking Reception & Registration |
At Kempinski Hotel |
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Tuesday December 12, 2006 |
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7:00AM |
Breakfast & Registration |
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8:00AM |
Opening Remarks |
Don Brown |
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8:15AM |
Introductions |
Each person will be asked to introduce him/herself and share how they can contribute to this process |
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THE PA SEMICONDUCTOR TYPES AND PERFORMANCE |
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9:00 AM |
Panel
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10:00 AM |
BREAK |
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10:30 AM |
RF Power Semiconductor Device Suppliers Power Amplifier Semiconductor Supplier Co-Host speakers will address the latest developments and achievements. Speakers from manufacturers of the major device alternative semiconductor technologies:
Topics they will address will include the specific characteristics and advantages/disadvantages of their options and how they are expected to evolve:
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Eric Toulouse Product Manager RF Division Freescale
Semiconductor LDMOS in High Efficiency Linear PA Concepts for W-CDMA & WIMAX John Gajadharsing Principle Engineer/Concept Development Basestations Strategy & Innovation NXP
Semiconductors
Pushing the Boundaries with
Paul
Scsavnicki Infineon
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12:00 PM |
NETWORKING LUNCH |
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1:00PM |
RF Power Semiconductor Device Suppliers (Cont'd)
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An Overview of GaN HEMTs for Next Generation Basestation Applications - Shifting the Paradigm Ray Pengelly Manager, Wide Bandgap Business Development Cree
Wireless Devices High Efficiency, High Linearity Semiconductor Devices for Base Station Power Amplifiers Matthew Poulton Director/Design Engineering Infrastructure Product Line RFMD NRF1 GaN-on-Silicon Technology Qualification, Reliability and Production Readiness for Wireless Infrastructure Applications Kevin Linthicum VP Engineering and CTO Nitronex
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THERMAL MATERIAL SUPPLIERS |
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2:30 PM |
thermal management Options
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Facing Thermal Challenges-Metal Backed HF Materials Dr. Albert Angstenberger Technical Sales Manager Advanced Dielectric Division Taconic
Ceramic Loaded PCB Materials: Thermal Impact on Design, Fabrication and Reliability Arturo Aquayo Manager, Market Development Microwave Materials Division Advanced Circuit Materials Group Rogers Corporation
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3:30 PM |
NETWORKING BREAK |
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4:00 PM |
PANEL OF CO-HOST DEVICE SUPPLIERS Where do the various technologies stand now and what does the future hold? Co-hosts
PA device suppliers will be given the opportunity to clarify their needs,
requirements and views and will engage in a panel session where the audience is
invited to ask questions and panelists will be given the opportunity to ask
each other and the audience questions. The Co-hosts will be asked to recap the extent to which the workshop has addressed their wish lists.
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All Co-Hosts
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5:00 PM |
TAKEAWAYS |
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5:30PM |
Adjourn |
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7:00 PM |
Social and Networking Reception & Registration for Workshop on Reconfigurable
Radios for |
At Hotel |
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Wednesday, December 13, 2006 |
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Workshop on
Reconfigurable
Radios for Power Amplifiers, Transceivers, Antennas (Click here for agenda and registration)
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DEADLINE FOR HANDOUT MATERIALS Deadline for electronic version of handout materials: December 1, 2006
ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus One Day breakfast/lunch/2 Breaks), booklet copying, audio/visual costs, etc.
We estimate that these costs will be $595. USD per
person. (For IWPC Members, only.) Make checks payable to IWPC.
Terminalstrasse Mitte 20
Please contact the hotel directly for room reservations. Mention the IWPC room block rate of 188,00 Euros.
Cut-off date for reservations is Monday, November 27, 2006. After that date rooms cannot be guaranteed at the IWPC rate.
AUDIO VISUAL A Computer Projector will be available for the speakers.
In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.
BUSINESS CARDS Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.
Business casual suggested. No ties, please !!
IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.
For ALL IWPC members:
For all companies who will be making a presentation at the Workshop:
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