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NEW    –    International Wireless Industry Consortium
Technology Exchange Forum

 

Limited to 100 seats
First Registered, First Served

 

 

 

Table of Contents

 

Agenda

 

Register

 

Deadline for Presentation Materials

 

Costs/Registration Fee for Members

 

Hotel Information

 

Directions to Hotel

 

Dress Code

 

Handout Material Options for Members

 

 

Preliminary Agenda - Subject to Changes

 

 

 

Enclosure and Cooling Technologies for
Outdoor Base Stations

Low Cost, Light Weight and Efficient Options

 

 

July 31, 2007

Chicago, Illinois, USA

 

Hyatt Regency Woodfield
1800 E. Golf Road
Schaumburg, IL  60173
Phone: 847-605-1234

Fax: 847-605-8641

 

 

 

 

Click HERE to Register

 

Moderated by:
Don Brown, Director, IWPC
Joe Madden, Senior Project Manager, IWPC

 

 

Workshop Background:   With increasing focus on size, weight, and efficiency of outdoor base stations, several IWPC members have expressed interest in a workshop to examine new cooling and enclosure technology.  This Technology Exchange Forum is intended to allow for new ideas to be shared among multiple members to spark partnerships and technology insertion opportunities.

 

July 31, 2007

9:00 AM

Registration
and
Continental Breakfast

 

10:00 AM

Opening Remarks

 

10:15 AM

Self Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

10:30 AM

Base Station & Enclosure OEM presentations

  • Base Station equipment OEMs present their needs and requirements for Outdoor Mechatronics

  • OEM trends in enclosures and packaging for bulletproofing, earthquake safety, sensors/alarms, cooling

  • Trends in use of higher temperature components

  • Lighter enclosure materials with high strength

  • Ideas for heat management and innovative heat exchanger cores

Key Challenges for Outdoor Wireless Enclosures:  from Macro to Micro systems

Sr. Manager, Infrastructure

Nortel

 

Enclosure and Cooling Technologies for Outdoor Base Stations

          Sr. Business Manager
          
Motorola
 

Next Generation Enclosures for Outdoor Base Stations

Mechanical Engineer
Flextronics

 

Reducing Cost per Watt with Advanced Cooling Technologies

Engineering Manager
Dantherm Air Handling

12:20 PM

Networking Lunch

 

Hosted by W.l. Gore and Associates

 

1:20 PM

Enclosure/Environmental Technologies

(Continued)

  • How to lighten an enclosure and maintain robustness

  • Salt fog, wide temperature swings, humidity and other harsh environmental conditions

  • Lightning protection trends

  • Innovative materials and techniques

High Reliability with Direct Air Cooling 

Senior Engineer
and
R&D Technical Leader

WL Gore & Associates

 

Lightning Protection and Grounding Solutions for Communication Sites

VP Business Development & Technology

Polyphaser Inc.

2:20 PM

Cooling Technologies

  • Passive Cooling technologies

  • Heat Management technologies

  • Backup cooling systems (for temporary use in power outages)

  • Heat management technologies and materials

  • Advances in cooling technology and applicability of new techniques

Advanced Heat Management Technology

Staff Scientist, R&D
Graftech

 

Expanding the Thermal Management Tools for RF Base Stations - Low Loss Thermally Conductive PTFE Laminates

           OEM Technical Sales

Arlon, Materials for
Electronics Division

 

Enclosure and Cooling Technologies for Outdoor Base Stations

           President

Supercool, a unit of Laird Technologies

3:50 PM

Networking Break

 

4:20 PM

Panel Session

  • How does the United States regulatory environment drive up costs for outdoor base stations?    What can be done to harmonize the regulatory environment and reduce cost through globally standardized products?

  • What are the best ways to save on OPEX in addition to CAPEX savings?

  • What will change in the Mechatronics industry as base stations migrate toward picocell/femtocell architectures?

  • What types of applications are best suited to adopting new materials and techniques?

  • What will the industry need to do for operators to become comfortable with tower-mounted electronics?

Confirmed

  • Almatec AG

  • Flextronics

  • GrafTech

  • Motorola

  • Nortel Networks

  • T-Mobile

  • WL Gore & Associates

5:20 PM

Take Aways & Closing Remarks

 

 

6:00 PM

Adjourn

 
7:00 PM

Social Reception
 

(and Registration for BaseStation Overlay Workshop)

 

 

DEADLINE FOR HANDOUT MATERIALS:

Deadline for electronic version of handout materials: 

July 13, 2007

 

COSTS/REGISTRATION FEE:

ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus Breaks), booklet copying, audio/visual costs, etc.

 

We estimate that these costs will be $ 325.00 (USD) per person. (For IWPC Members, only.)

 

ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL:

Hyatt Regency Woodfield
1800 E. Golf Road
Schaumburg, IL  60173
Pone: 847-605-1234

Fax: 847-605-8641

 

 

Please contact the hotel directly for reservations. Mention the IWPC room block rate of $165. USD single occupancy.

 

Cut-off date for reservations is July 13,  2007. After that date rooms cannot be guaranteed at the IWPC rate.

 

TRAVEL OPTIONS FROM AIRPORT TO HOTEL:  The hotel is only 9 miles from O'Hare Airport.  For transportation details:  Click Here

 

AUDIO VISUAL:

A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.

 

BUSINESS CARDS:

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS:

Business casual suggested. No ties, please !!

 

HANDOUT MATERIALS:

IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

 

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.

 

Please send electronic materials (any size file) to:

[email protected]

 

or use one of these FREE FTP Sites

IF your email system cannot send large files:

www.SendThisFile.com

www.DropLoad.com

www.avvenu.com

 

 

Click HERE to Register