|
|
International Wireless
Industry Consortium
NEW – Technology Exchange Forum
Limited to 100 seats
First Registered, First Served
|
Table of Contents
Deadline for Presentation Materials
Costs/Registration Fee for Members
Travel Options from Airport to Hotel
Handout Material Options for Members
|
Power Amplifier Devices for Devices and Packaging for
Basestation RF Power Generation,
Co-Hosted by:
Kongresshotel Europe
October 19, 2007 Stuttgart, Germany
|
Organized by the
International Wireless Industry Consortium
Click HERE to Register for Workshop
Moderated by
Don Brown, Director, IWPC
and
Joe Madden, IWPC
|
BACKGROUND An IWPC workshop was held in December 2006 to discuss semiconductor devices for base station power amplifiers. This workshop is a sequel to that one.
Semiconductors and the semiconductor packaging are the key and limiting elements in base station power amplifiers. This workshop will focus on these to address how they are evolving to meet the stringent demands being imposed by the emerging 3G+ wideband delivery options-- WiMAX, 3GPP (LTE) and UMB.
Alternative semiconductors are challenging the traditional hold of LDMOS for basestation power amplifiers. How competitive are they and and can they meet these new challenges? Has GaN evolved enough in cost and performance to sideline LDMOS? Will GaAs continue to have a role? What advances are there in linearization and advanced thermal management schemes and what roles will they play in this competition?
|
||
