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NEW    –    International Wireless Packaging Consortium
Technology Exchange Forum

 

Limited to 100 seats
First Registered, First Served

 


Preliminary Agenda

 

High Efficiency, High Linearity Power Amplifiers 
for 3G+ Basestations

 

Power Devices and
Linearization and Thermal Management Techniques

 Co-Hosted by: 
      

 

 September 20-21, 2004

London, UK

Hilton Watford  
Elton Way, Watford, Hertfordshire, U.K.  WD25 8HA
Phone: 01923-235881
Fax: 01923-220836


Organized by the International Wireless Packaging Consortium

 

Click HERE to Register for Workshop

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

TECHNOLOGY EXCHANGE FORUM BACKGROUND

At the last IWPC Workshop on basestations hosted by O2, several participants requested the IWPC organize a focus session on Power Amplifiers for Basestations to dialogue on where, how much and when efficiency and linearity improvements might be anticipated and what the emerging needs of the Operators would be.

This event has been organized to in response to this request.

TECHNOLOGY EXCHANGE FORUM GOALS

The goals of this Technology Exchange Forum are:

For the power amplifier developers to get a better understanding of the future requirements of Operators and System OEMs for Power Amplifiers for emerging 3G and beyond basestations

For the Operators and OEM cellular system suppliers and network integrators to get a better understanding of power amplifier improvements and expected developments to meet their emerging needs

For the supply chain to better understand the key technology and procurement needs for future 3G+ basestation power amplifiers

For the supply chain to share their current and key technologies, with special attention to digital and analog chipsets, packaging and thermal management.

Monday, September 20, 2004

7:00 PM

Social and Networking 

Reception & Registration

 Hilton Watford

Tuesday, September 21, 2004

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks

Don Brown

8:15 AM  

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

THE NEEDS AND THE CHALLENGES  

9:00 AM

KEYNOTES

Power Amplifier Supplier Host speakers will address the major developments and issues in enhancing the performance and reducing the costs of Basestation Power Amplifiers for 3G+.

 

Optimising Cost and Efficiency of PAs for 3G+ Base Stations

Eric Hawthorn

Managing Director, Power Amplifiers
Filtronic

 

High-efficiency for 3G: A numbers game?"

Peter Kenington

Director, Advanced Technology

Andrew Technology

 

 9:40 AM

PANEL OF CO-HOSTS  

Co-hosts PA suppliers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and panelists will be given the opportunity to ask each other and the audience questions.

 

 

Co-Hosts 
Filtronic, Andrew, Powerwave and Remec 

10:20 AM

BREAK

 

OPERATORS

10:40 AM

SERVICE OPERATOR SPEAKER and PANEL

Invited Service Operators will join in a dialogue on key power amplifier requirements and what they consider the driving considerations.

    *      Numbers of Channels

    *      Implications of HSDPA on Power Amplifier requirements

    *      Balancing of major basestations with smaller

    *      Implications of antenna remoting on Power Amplifiers

    *      Options for reconfiguring power amplifiers

    *      Timing of roll out

    *      CAPEX Costs

    *      OPEX Costs (including energy)

 

 

The Power Amplifier Challenge
Issues for the cellular operator

Getting over the efficiency and linearity  hurdles…

Joe O'Reilly

Principal Engineer

Hardware Engineering and Design

T-Mobile

Additional Panelists

Tony Conlan

UTRAN Vendor Manager

O2

 

Phil Cowap

Technical Specialist

Vodafone

 

SYSTEM INTEGRATORS

11:30 AM  

SYSTEM INTEGRATOR SPEAKER and PANEL

System Integrators will join in a dialogue on key power amplifier requirements and what they consider the driving considerations.

    *      Power

    *      Bandwidth

    *      Linearity

    *      Efficiency

    *      Flexibility

    *      CAPEX Issues

    *      OPEX Issues

    *      Implications of HSDPA on Power Amplifier requirements

    *      Implications of OBSAI/CPRI Initiatives on Power Amplifiers

    *      Options for reconfiguring power amplifiers and for testing of same

 

Linear Amplifiers from an OEM Perspective

John Potocki

Senior Product Manager
GTSS

Motorola

Plus Panelists:

    *      Ericsson

    *      Huawei

    *      Nokia

    *      Siemens

    *      Others

12:30 AM

 NETWORKING LUNCH

  

TECHNOLOGY SUPPLIERS

 1:30 PM

KEY ENABLING TECHNOLOGY PRESENTATIONS

Suppliers will address the most important technologies and their key developments and expectations to address the emerging Power Amplifier requirements.

    *      Power amplifier devices 

      *      LDMOS

      *      GaN

      *      SiC

      *      GaAs

    *      Linearization techniques and electronics

    *      Thermal management techniques

    *      Power amplifier packaging

    *      Discrete vs. Module level

 

 

Freescale LDMOS IC and Plastic Packages: A Powerful Combination for Cost and Performance

Pascal Gola

RF Applications Engineering

RF Divison, NCSG

Freescale

 

High Efficiency GaAs PAs for 3G Base Stations

Richard Ranson

Chief Engineer, 

Filtronic ICS

 

High Power GaAs, GaN Power Amplifier for W-CDMA Base Station Applications

Seigo Sano

Assistant Group Leader

RF Infrastructure Device Group

Eudyna Japan

 

Thermally enhanced  LDMOS transistor  developments designed to deliver greater linear efficiency

Paul Scsavnicki

Sr. Application Engineer

Infineon

 

3:00 PM

NETWORKING BREAK

 

3:30 PM

KEY ENABLING TECHNOLOGY PRESENTATIONS  

(CONT'D)

 

Digital Base band Linearization for Private Mobile Radio Narrowband Channels

Dr. Jean Pierre Lanteri

Director, Technology

Corporate R&D

M/A-COM, Tycoelectronics

 

Survey of performance of Various Semiconductor Technologies for Digital Predistortion

Brian Zingle

Product Applications Engineer

Wireless BTS

PMC-Sierra

 

Thermally Enhanced Packaging for RF Power Transistors

Hernan Santos

Kyocera

 

4:30 PM

OPEN DISCUSSIONS

and

TAKEAWAYS

 

5:30 PM

Adjourn

 

 

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  September 7, 2004

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $289. (US) per person.
(Based on $1.82 = 1 British Pound)
(final cost to be determined as we get closer to the actual workshop date)

 

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL

Hilton Watford  
Elton Way, Watford, Hertfordshire, U.K.  WD25 8HA
Phone: 01923-235881
Fax: 01923-220836

Please contact the hotel directly to make reservations at the IWPC room block rate of 105 pounds.  Please make reservations before September 1, 2004.

 

Directions to Hilton Watford:

 

The nearest train station is Watford Junction and trains leave the central London station of Euston.

 

From M1, Junction 5:

Follow directions to London/Harrow (A41). At first roundabout, go straight across and the hotel is immediately on your left.

From M25 Clockwise, Junction 19:

At first roundabout, follow directions to North Watford. Go under underpass. At second roundabout, go straight across. Go under M1 underpass. At third roundabout, go straight across. The hotel is immediately on your left.

From M25 Anti-clockwise, Junction 21A:

Join the A405 and follow signs to Harrow/Watford. At first roundabout, turn left onto the A41 (North Western Avenue). At second roundabout, go straight across. Go under M1/Junction 5 underpass. At third roundabout, go straight across. The hotel is immediately on your left.

AUDIO VISUAL

All projector formats will be available for the speakers.

·         Computer projector

·         Overhead projector

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.    No ties, please !!

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file or Power Point files.

Please send materials to:

manager@iwpc.net

 

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA  18974      USA

 

 

Click HERE to Register for Workshop