IWPC Gigabit Wireless

NEW – International Wireless Packaging Consortium
Interactive Technical Workshop

Emerging 60 and 70-90 GHz
“GigaBit Wireless" Communications

What are the Target Applications and Markets?

and

Will the Projected Market Volumes be High Enough to
Drive Semiconductor and Packaging Costs Down?

&
Tour of Cisco Facilities

Hosted by:

With Co-Hosts

and

San Jose, California

January 18-21, 2004

Sheraton San Jose Hotel
1801 Barber Lane
Milpitas, CA 95035
Phone: 408-943-0600
Fax: 408-943-0484

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials: January 9, 2004

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc.
We estimate that these costs will be approximately $445. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL

Sheraton San Jose Hotel
1801 Barber Lane
Milpitas, CA 95035
Phone: 408-943-0600
Fax: 408-943-0484

Please contact the hotel directly for reservations. Mention the IWPC room block rate of $109. Cut-off date for reservations is Monday, January 12, 2004. After that date rooms cannot be guaranteed at the IWPC rate.

AUDIO VISUAL

All projector formats will be available for the speakers.

· Computer projector

· Overhead projector

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS

Business casual suggested. No ties, please !!

HANDOUT MATERIALS

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file or Power Point files.

Please send materials to:

[email protected]

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA 18974 USA

Click HERE to Register for Workshop

Workshop Background The FCC has recently ruled to require link licenses for usage of the 71-76 GHz and the 81-86 GHz bands for GigaBit wireless communications systems. Such systems as well as the unlicensed 60 GHz and Free Space Optics systems will permit very high datarate communications such as might be required for Internet and Intranet hub interconnectivity over campuses without the need for costly trenching to lay fiber. A key impediment to large scale development and deployment of such systems is the high cost of MMICs and other semiconductor devices and packages for use in these bands. This in turn is a consequence of the relatively low volumes of semiconductor devices presently produced and demanded for applications at millimeterwave frequencies. As well, other technologies such as testing, design and assembly are not as mature as at lower frequencies.
Workshop Goal The GOAL of this workshop is to bring together senior leaders from THE ENTIRE SUPPLY CHAIN to facilitate and stimulate breakthrough thinking on emerging technologies and manufacturing methods which, when coupled with market needs and timings, and an understanding of key system cost drivers, can substantially drive down the cost of the millimeterwave devices and equipment associated with these emerging "GigaBit Wireless" systems. In short, the goal of this workshop is to create an open, interactive environment, where the entire supply chain can communicate, network, share technology requirements and capabilities, and achieve mutually desired goals.
Sunday, January 18, 2004
7:00 PM	Social and Networking Reception & Registration	Sheraton San Jose
Monday, January 19, 2004
7:00 AM	Breakfast & Registration
8:00 AM	Opening Remarks
8:15 AM	Introductions	Each person will be asked to introduce him/herself and share how they can contribute to this process
REQUIREMENTS AND SYSTEM SOLUTIONS OFFERED
8:45 AM	Keynote PresentationS OVERVIEW Service Applications and Requirements Market Assessment Cost Targets Required for Feasibility Overview of FCC Ruling Pros and Cons of Wireless Options Key Technology Issues Generic Specifications Low Cost MMIC Packaging and Interconnection Issues Antennas LO Technologies	E-Band: Overview, Opportunity and Challenges Jonathan Leary Product Line Manager for Outdoor Wireless Wireless Networking Business Unit Cisco Systems E-Band Radio Applications - A View from 95,000 Feet Doug Lockie Consultant Endwave
10:00 AM	BREAK
10:30 AM	CUSTOMER PERSPECTIVES on and markets FOR GIGABIT WIRELESS COMMUNICATION Service Applications and Requirements Performance and Coverage Requirements Installation and Maintenance Concerns Licensed vs. Unlicensed Needs Market Timing and Growth Forecasts Do and don'ts of campus and WAN systems Views on Fiber vs. GigaBit Wireless How and who do they deal with in purchasing and implementing such systems?	Gigabit Wireless - Who Needs it and Why... Frank D. Trovato World Wide Solutions Exec Advanced Infrastructure Services IBM Global Services Broadband Wireless Access Market Romeo Premerlani Project Manager Comm. Equipment Components Huber+Suhner
11:15 AM	PANEL KEYNOTES AND USER COMMUNITY GigaBit Communications System Users and Keynote Speakers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.	Previous Speakers Plus: City of San Jose E-Government Manager Strategic Support and Planning Cisco Chief Network Architect Sprint Distinguished Member of Technical Staff Network Hardware Integration Research Terabeam Chief Technology Officer Others Invited as Panelists Alcatel City of San Francisco Motorola
12:15 PM	NETWORKING LUNCH
1:15 PM	SYSTEM and SUBSYSTEM SUPPLIER OPTIONS AND PERSPECTIVES Representative System Configurations and Solutions 70-90 GHz Systems 60 GHz Systems Free Space Optics (FSO) Systems Perceptions of Markets Key Technology Issues Semiconductor and MMIC Requirements Packaging and Interconnection Issues Antennas Testing LO Technologies Representative RF Frontend Configurations and Requirements	Packaging to Increase Placement Options and Reduce Ongoing OPEX Ted Abrams Vice-President, Technology Spectrasite Communications Commercial Applications of Gigabit Optical Wireless Systems based on Free-Space Optics (FSO) Technology Lawrence B. Prior III Chief Operating Officer LightPointe E-Band -- From Chips to Radios: A Technology Roadmap Ed Stoneham Senior Scientist Endwave A 60 GHz Wireless Transceiver Link for Optical Fiber Systems Yonghoon Kim President Millisys Inc. Subsystem Drivers for MMIC Chips for 1 to 10 Gb/s+ Links Ed Weatherwax VP/Business Development Xytrans
3:15 PM	BREAK
3:45 PM	SYSTEM and SUBSYSTEM SUPPLIER OPTIONS AND PERSPECTIVES (Cont'd)	A Gigabit Wireless Link in the Upper E-Band. Oya Sevimli Research Leaders Gigabit Wireless Personal Area Networks CSIRO A 75 GHz Data Transmission Prototype Antenna Module Using Automotive Radar Chips Carsten Metz Member of Technical Staff Lucent Technologies Bell Labs Innovation
4:30 PM	PANEL or OPEN DISCUSSION GigaBit System and Subsystem Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.	system and subsystem Providers
5:30 PM	Adjourn
7:00 PM	Dinner *San Jose Style*	Bus Transportation provided to and from hotel
Tuesday, January 20, 2004
7:00 AM	Breakfast
SEMICONDUCTOR DEVICE SOLUTIONS
8:00 AM	MMIC and MILLIMETERWAVE SEMICONDUCTOR DEVICE CO-HOSTS, SUPPLIERS and PACKAGERS What are the technology options and what are their pros and cons? InP vs. GaAs vs. SiGe and derivatives Discrete vs. Integrated MMIC Hybrid solutions vs. single semiconductor Packaged vs. Unpackaged What are the key issues affecting the cost? Volumes and volume breakpoints Dependence on frequency of operation Commonality with other markets. Limiting performance parameters Cost of processing and testing infrastructure Packaging Options Module and Assembly technologies Packaging technologies	Silicon MMWave Integrated Circuits for Wireless Applications Modest Oprysko Departmental Group Manager IBM Research Present Capabilities of SiGe HBT Technology in the 60-90 GHz range Rudolf Lachner Director Technology Development Infineon Aggregate High Frequency Niche Markets to Spread Fixed Costs Mike Sanna Vice President/Business Development TriQuint Semiconductor Design Challenges Above 60 GHz Using MMICs Pierre Quentin Product Marketing Manager UMS Making 70/80 MMIC's a Reality Frank Kropschot Chief Operating Officer NGST Velocium
9:50 AM	NETWORKING BREAK
10:10 AM	MMIC and MILLIMETERWAVE SEMICONDUCTOR DEVICE CO-HOSTS, SUPPLIERS and PACKAGERS (Cont'd)	Lowering mm-wave Transceiver Costs through Higher Levels of Integration Dr. Jim Harvey Chief Technology Officer Mimix Broadband Millimeterwave W-Band Packaging Dr. Timothy T. Childs President TLC Precision Wafer Technology Surface Mount 3D Integrated Millimeterwave Modules Rocco De Lillo Vice President, Research & Development Merrimac Industries Liquid Crystalline Polymer Materials Colleen Murphy Market Development Manager Rogers Corporation 100 GHz Connector for Ceramic Substrates Bernard Rosenberger Head, Research & Development Rosenberger Hochfrequenztechnik
12:00 PM	LUNCH
1:00 PM	Set Up Break Out Sessions Working Groups Questions to be answered: 1. What are the gaps in: Technology ? Communication ? 2. What is needed from the supply chain to address these gaps ? 3. What can IWPC do to assist ?	The group will interactively discuss and identify opportunities for future fruitful development. We will break into small working groups and allow members to interact with like and no-so-like minded professionals. The goal of this process is to clarify the needs and identify new opportunities for development. Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group.
2:00 PM	Breakout Sessions
4:00 PM	Breakout Session Reports	Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders. This process dramatically expands the thinking of the attendees.
5:00 PM	Take Aways & Closing Remarks
5:30 PM	Adjourn
7:00 PM	Dinner (Dutch)	For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes
Wednesday, January 21, 2004
9:00 AM - 12:00 AM	Tour of Cisco Facilities (TBC)	Bus Transportation provided from and to hotel.

San Jose, California

Sunday, January 18, 2004

Monday, January 19, 2004

Introductions

Dinner

Tuesday, January 20, 2004

Breakfast

MMIC and MILLIMETERWAVE SEMICONDUCTOR DEVICE CO-HOSTS, SUPPLIERS and PACKAGERS

Wednesday, January 21, 2004