Handset Packaging

NEW – International Wireless Packaging Consortium
Interactive Technical Workshop

Workshop Background The IWPC has held 8 previous workshops on advanced packaging and assembly for handsets. We have learned about design philosophies, spec-creep, integration vs. margin-stacking, manufacturing issues, integration options, materials issues, OEM/EMS/ODM Supply Chain relationships and environmental design and manufacturing challenges. Handsets continue to increase in functionality and decrease in size and there is continuing pressure to reduce the cost of the handsets even further, annually. The handheld device packaging community needs to respond and adapt by developing and adopting the “appropriate” new technologies and establishing new relationships with their suppliers as well as their customers, worldwide. This workshop will enable suppliers from all levels of the supply chain to better understand their current and future roles in responding to these pressures and to establish the relationships which they will need to maintain their positions.
Workshop Goal The GOAL of this workshop is to continue the process of bringing the wireless industry supply chain together to explore the needs and available technologies of advanced packaging for handsets… AND Explore breakthrough thinking about supply chain partnering in this global industry… TO ACHIEVE: Appropriate cost and size effective handset packaging technologies AND supply chain partnering/relationship requirements with a clearer understanding of current and future integration vs margin-stacking tradeoffs. OUTPUT: Establish a group to cooperate in reviewing the handset packaging and assembly business model and how the various contributors in the supply chain can be better integrated for more efficient and cost effective handset production.
Monday, January 17, 2005
7:00 PM	Social and Networking, Reception & Registration	At
Tuesday, January 18, 2005
7:00 AM	Breakfast & Registration
8:00 AM	Opening Remarks
8:15 AM	Introductions	Each person will be asked to introduce him/herself and share how they can contribute to this process
HANDSET MAKERS REQUIREMENTS
9:00 AM	KeynoteS Handset oem OVERVIEW of the NEEDS From an OEM perspective: What are the anticipated form, fit, function changes to future handsets which will require changes in packaging and assembly? SmartPhones, Mid-Level, Low-End phone designs Will there be “cheap” versions versus sophisticated versions for different worldwide markets? Tradeoffs between commodity components vs custom components and modules? What are the expected changes in key specifications for future handsets Which Frequency bands of operation? Are multiple bands necessary per handset? Single, dual, tri-band for voice, 802.11x, Bluetooth, GPS, WiMAX, others? Power consumption requirements Are multiple access formats necessary? How will they accommodate the variability of worldwide specifications and needs? What are the key expectations and anticipated requirements for future packaging in the handset industry? What do they see as the impact of “ecologically sound” regulations and how will this affect their procurement? What is the role responsibility of ODM/EMS’s in the specification and production of handheld devices?	Handset Market : What the future Holds Walt Marcinkiewicz Sr. Technical Advisor CTO Office SonyEricsson and OEM Sourcing Challenges in the Consumer Electronics World Ken Schmidt Procurement Executive SonyEricsson
10:00 AM	BREAK
10:30 AM	Panel of OEM’s Previous speakers and other OEMs present will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.	OEMs Present SonyEricsson RIM
11:00 AM	service providers' views and Panel There is a need for the ability to assess the affect on the battery lifetime of a handset based on the choice of functions, features and suppliers -- so called "Autonomy" time. A modeling system to allow such predictions will be described. From a Service Providers' perspective, what are some usage models, which will drive the handset functionality, utility, power consumption and size? Do Service Providers foresee need for or use of Software Defined Radios in handsets? When? Will the benefits of SDR be sufficient to offset cost or power consumption consequences?	Handset System Level Power Usage Model Development Project John Seeman Member Technical Staff Verizon Wireless Present Bell Mobility Nextel
12:00 Noon	NETWORKING LUNCH
1:00 PM	KEYNOTES DEVICE PACKAGING AND ASSEMBLY OVERVIEW of the SOLUTIONS and CHALLENGES From volume packager and assembler perspectives, What are the key challenges? What are the technologies and solutions being proposed for packaging at the device, module and assembly levels in the handset industry What is needed from the OEMs/ODMs? What is needed from the supply chain? What elements of the supply chain do the co-hosts interface with and how do they contribute to margin stacking and responsibility sharing? Issues to be addressed: Margin stacking vs. integration (the REAL costs of integration?) Environmental Issues and timing – (Lead-free/halogen free, materials declaration forms) Stacked packaging vs. stacked die packaging vs. system in a package Wafer level packaging (issues: known-good-die vs. known-tested-die vs. packaged devices) Custom vs. commodity devices – a procurement managers point of view Electro-mechanical integration (connectors, antennas, etc embedded in the plastics) Shielding Design tools Testing and acceptance Wideband vs. narrow band antennas – cost, performance Globalization issues for packaging design and manufacturing (who is the customer? Similarities and differences in packaging and assembly for different markets sectors such as: Cell phones PDAs WiFi WiMAX Zigbee UWB Low Power Radio Automotive Telematics Impact of SDR on implementation of handsets; what should the supply chain anticipate in developing volume packaging and assembly processes and facilities?	Enabling Cost Effective Integration through Package Stacking Gordon Gray Product and Technical Marketing Manager Tessera Integration of the Handset: Advanced Packaging Design and Supply Chain Solutions Lee Smith Senior Director Amkor Integration for Reducing Total Cost of Ownership Ric Roetering VP Marketing & Sales Perlos The Virtual Vertical Solution Bill Coker Director Sales & Marketing Elcoteq
2:40 PM	BREAK
3:10 PM	OTHER DEVICE PACKAGING AND ASSEMBLY SUPPLIERS	Title TBD Doug Mathews Member of Technical Staff StatsChipPac Title TBD Speaker TBD Flextronics
4:00 PM	PANEL DEVICE PACKAGING AND ASSEMBLY SUPPLIERS Speakers and other packaging and assembly suppliers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.	Packagers and Assemblers Speakers
5:15 PM	Adjourn
7:00 PM	Dinner *Southern Style*	Bus Transportation provided to and from hotel
Wednesday, January 19, 2005
7:00 AM	Breakfast
8:00 AM	MODULE SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING What are the implications of higher level functional integration on margins? Who takes responsibility for reliability and liabilities? What are the options for higher level integrated packages? What is the business case for integrated packaging? Is higher level integration worth more than the cost of the discrete parts? Tradeoffs arguments between stacked die, stacked packages, SIP and SoC, and Integrated Passives What are the consequences in responsibility and reliability?	Title TBD Jim Chamberlin Sales and Marketing Jacket Micro Devices Margin Stacking -- Is Integration worth more than the cost of the discrete parts? Mike Alferman Director of Application Engineering EPCOS Integrated Low- Cost Thin-Film RF Filters on Glass-- A ‘Moore’s Law’ Platform for Passive Integration Richard Ernest Demaray CTO Symmorphix Thin Film Integrated Passive Components for Handsets Andrew Cervin-Lawry Manager, Technology R&D Gennum
9:40 AM	NETWORKING BREAK
10:10 AM	MODULE SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING (ConT'D)	Turnkey WLCSP: Why should you care? David Hays VP Strategic Marketing & Business Development Unitive The Impact of System in Package on the Handset Supply Chain Joe Adam VP Strategic Marketing Skyworks Solutions
11:00 AM	INTEGRATED device SUPPLIERS' views ON REDUCING MARGIN STACKING What are the implications of higher level functional integration on margins? Who takes responsibility for reliability and liabilities? What are the options for chip level integration? What components make sense for integration at the chip level? Tradeoffs arguments between stacked die, stacked packages, SIP and SoC? Is higher level integration worth more than the cost of the discrete parts? Tradeoffs arguments between stacked die, stacked packages, SIP and Integrated Passives What are the consequences in responsibility and reliability?	Silicon Transceiver Improvements drives Cost Reductions and Economic Destruction? Tom Gratzek Director, Product Line RF and Wireless Systems Analog Devices Size, Cost, and Flexibility Trade-offs for Package Integration of Digital and Memory Products in Cell Phones Deborah Kaller Manager/PCG Packaging Strategies Intel
12:15 PM	LUNCH
1:15 PM	Panel DEVICE SUPPLIERS and packagers views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING Device suppliers and packagers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.	Previous Speakers
2:15 PM	Other Enabling Technology Solution Suppliers' views Enabling technology suppliers will be asked to describe their contributions to components, packaging and assembly of handsets and where they see their interfaces are to customers and suppliers. Automatic testing and diagnostic techniques Antennas and antenna integration techniques Board processing Displays Material options Design Tools	Next Generation Small Displays: The Power Challenge Tony Botzas Director, System Applications Clairvoyante Miniature antennas: a platform technology for handsets’ Mark Dowsett Director of Product Management & Applications Sarantel Scalable Discrete Models as Consideration Factor in Level of Integration Trade-off Larry Dunleavy President Modelithics
3:15 PM	NETWORKING COFFEE BREAK
3:45 PM	PANEL Co-HOSTS DISCUSS IF/HOW THE WORKSHOP MET THEIR EXPECTATIONS	SonyEriccson RIM Amkor Elcoteq

Monday, January 17, 2005

Tuesday, January 18, 2005

Introductions

Dinner

Wednesday, January 19, 2005

Panel

Other Enabling Technology Solution Suppliers' views

Other Enabling Technology
Solution Suppliers' views