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NEW    –    International Wireless Packaging Consortium
Interactive Technical Workshop

 

Limited to 100 seats
First Registered, First Served

 

 

 


Millimeterwave
Automotive Radars, RF Sensors
and
Communications Equipment

Exploring Synergies in 
Millimeterwave Technologies and Markets

Plus

Tours

 E-Class Mercedes Plant with Distronic Integration 

AND

Mercedes Museum

 Hosted by: 

Stuttgart, Germany

October 18-21, 2004  

Millennium Hotel Stuttgart

Plieninger Strasse 100

Stuttgart, Germany  70567

Phone: 49-711-7210

Fax: 49-711-2009

 


Organized by the International Wireless Packaging Consortium

 

Click HERE to Register for Workshop

 

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

 

Workshop Background

In May 2003, the IWPC held a workshop to address the status of millimeterwave devices for automotive sensor applications which are beginning to emerge and be adopted in up-scale vehicles.  At the same time, the opportunity was taken to review the changes and developments taking place in the broadband millimeterwave communications equipment sectors. Both are seeking breakthroughs in semiconductor devices and packaging and assembly technologies.

Since that workshop, significant changes have been and are taking place in this equipment sector. Firstly, the FCC recently endorsed the use of the 71-76 GHz and 81-86 GHz bands for high-speed broadband communications with somewhat relaxed rules for their usage. Similarly, there are very active efforts underway to allocate the 76-81 GHz bands for use in automotive sensors and adaptive cruise control systems.

This workshop will address the implications of these changes for the automotive and communications markets, technology  and equipment.

Automakers and communications systems providers continue to look for low cost solutions which can survive the very stringent demands of electronics at such high frequencies.  A key element of this is the availability of low cost millimeterwave semiconductors and integration and packaging technologies.

If your business is anywhere in the supply chain for future millimeterwave automotive or communications applications, you MUST actively participate in this unique IWPC Interactive Technical Workshop.

 

Workshop Goal

 

The GOAL of this workshop, is to bring together senior leaders from THE ENTIRE SUPPLY CHAIN to facilitate and stimulate breakthrough thinking on emerging technologies and manufacturing methods which, when coupled with market needs and timings, and key system cost drivers, can substantially drive down the cost of the equipment needed for millimeterwave automotive and communications systems.

In short, the goal of this workshop is to create an open, interactive environment, where the entire supply chain can communicate, network, share technology requirements and capabilities, and achieve mutually desired goals.

 

Monday, Evening October 18

7:00 PM

Social and Networking 

Reception & Registration

 

Tuesday, October 19, 2004

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks

 

8:15 AM

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

MILLIMETERWAVE AUTOMOTIVE OVERVIEW

9:00 AM

 

DaimlerChrysler Keynote

DaimlerChrysler and Guest Auto Suppliers will address the key Business, Market and Technology Issues from their point of view in the supply chain and will review changes in the regulatory environment.

What are varieties of MMWave Automotive Sensors?

  • ACC
  • Pre-crash applications
  • Side-looking
  • New functions

Status of regulatory issues

  • New spectrum proposals and future frequency planning
  • How will the bandwidth will be allocated?
  • Key effects on hardware and architecture
  • Timing for introduction of new rules.
Market Issues
  • What are the volume projections? 
  • Price movements, cost targets and development time
  • Update on adoption by other OEMs
  • Status and prospectus for 24 GHz systems
  • Migration strategies from 24 GHz to 77/79 GHz
  • Competitive technologies (e.g. infrared)

What are the key technical challenges, Requirements and expectations: 

  • Reliability?
  • Cost?
  • Size?
  • Environmental Factors?
  • "Green" Issues
  • Volume production techniques?
  • NRE Costs?
  • Perceived common technologies with the communications sector
Other key groups and their roles in auto sensors (e.g. SARA, ETSI, EU, ADARS II, etc.)

 

Radar Sensors for Automotive Applications - Update on Status and Future Perspectives

Dr. Josef Wenger

Senior Manager, Radar Systems

DaimlerChrysler

 

Stefan Bujnoch

Traffic and Environment

BMW

 

 
9:40 AM

PANEL

AUTOMOBILE OEMS 
 

The Auto OEMs and Equipment Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

 

DAIMLERCHRYSLER and additional OEMs

Other Auto OEMs Present

Volkswagen

 

10:20 AM

BREAK  

 
10:40 AM

MMWave AUTOMOTIVE SUBSYSTEM SUPPLIERS

What are the current features and challenges demand in radar sensors? 

How will the proposed changes in spectrum allocations and timing affect their implementation? 

What technologies are considered critical?
  • Collision Warning Systems
  • Adaptive cruise control
  • Side detection systems
  • Reverse warning detectors
  • Lane control systems
  • Short Range High Definition Radars
  • Car-to-car, car-to-roadside, car-to-infrastructure systems

 

24 GHz UWB Sensor Realization and Implications of Migration to 79GHz

Jeff Schaefer

Engineering Manager

Wireless Automotive Systems Group

Tyco/M/A-COM

 

Trends and Needs for Automotive Radar Technology: The View of a Tier 1 Supplier for Safety Systems

Rolf Adomat

Senior Manager

ADC Conti Temic

 

Future Trends and Technologies for Automotive Long Range Radars

Dr.-Ing Thomas Walter

Driver Assistance Business Unit

Robert Bosch GmbH

Also Present

Siemens

Groeneveld/Roadeye
TRW Autocruise
 

12:00 PM

NETWORKING LUNCH  

 

MILLIMETERWAVE COMMUNICATIONS SYSTEMS

1:00 PM

PANEL

AUTOMOTIVE SENSOR SUPPLIERS 
 

The Automotive Sensor Equipment Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

 

Sensor SupplierS 

 
ADC Conti Temic

Groeneveld/Roadeye
Robert Bosch
Siemens
TRW Autocruise
Tyco/M/A-COM

 

1:50 PM

MMWave COMMUNICATIONS SYSTEM KEYNOTES 

What are target applications for MMWave wireless communications? 
  • Basestation Backhaul 
  • Gigabit Building to building (PTP)
  • Gigabit PANs
  • Antenna remoting
What are the competitive alternatives for these applications and what are their advantages and disadvantages?
  • 71-86 GHz
  • 60 GHz
  • FSO

What are possible market sizes?

Requirements and expectations: 

  • Reliability and availability?
  • OPEX vs CAPEX issues
  • Siting issues
  • Cost?
  • Size?
  • Environmental Factors?
  • "Green" Issues
  • Volume production techniques?
  • NRE Costs?
 

 

70GHz Point-to-Point and FSO Technologies: Comparison in Access Network Applications

Claudio Colombo

ALCATEL - WTD Product Management

Mario Frecassetti

Microwave Radio System Engineer Dalmazio Mandich

Wireless Transmission Division

 

58 GHz in Mobile Network Backhauling

FrancescoTammaro

Product Manager

Siemens SMC

 
2:40 PM

BREAK

  

3:00 PM

OTHER MMWave COMMUNICATIONS SYSTEM 

and 

SUBSYSTEM SUPPLIERS

Complementary Market Opportunities for Commercial & Military mm-Wave MMIC Devices  

Roberto Alm

Technical Director

Raytheon

 

Millimeter-wave Circuit and Packaging Technologies -- a Comparative Business Perspective of Available Options 

Anthony Sweeney

Director of Engineering

Endwave

 

GigaPhy Communications Wireless Datacomm in the 60 GHz Band 

Ullrich Pfeiffer

RSM/Manager

IBM Research

 

60 vs. 70/80 vs. 94 GHz 
(and don't forget FSO) 

Wayne Pleasant

Vice President, Millimeterwaves

Terabeam/YDI

 

High Frequency Broadband Communications

Rudy Emrick

Manager, Millimeter-Wave Applied Research

Motorola Labs, ESPS

 

4:40 PM

PANEL or OPEN DISCUSSION 

Millimeterwave Communications System and Subsystem Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

Keynotes, Speakers and additional system and subsystem suppliers

 

5:30 PM

Adjourn  

 

7:00 PM

Dinner 

Stuttgart Style

Bus Transportation provided to and from hotel

Wednesday, October 20, 2004

7:00 AM
Breakfast  

 

 

MILLIMETERWAVE ENABLING TECHNOLOGIES

8:00 AM

MILLIMETERWAVE SEMICONDUCTOR DEVICES, MODULES, and PACKAGING

Advances In Millimeterwave Semiconductor Technologies
  • SiGe
  • GaAs
  • InP
Typical Millimeterwave functional blocks
  • Sensors
  • Low noise Devices and MMICs
  • Power amplifier devices and MMICs
  • Receiver/Transmitter Chips 
  • Switching and tuning elements
  • Integrated Systems
Millimeterwave Semiconductor Device Modules and Packaging Technologies
  • High Frequency Packages
  • Module Techniques
  • Chip attachment techniques
  • Linearization techniques and modules

  • Receiver/Transmitter Modules

Silicon MillimeterWave Integrated Circuits for Wireless Applications 

Dr. Modest Oprysko

Dept. Group Mgr.

IBM Research

 

Status and Prospects of Si/SiGe based MMWave Technologies

Rudolf Lachner

Director Technology Dev.

Infineon

 

Future Trends for MMICs in Automotive Radars and MM-wave Communication Systems - A View from a GaAs MMIC Manufacturer

Marc Camiade

Head of Design Department

UMS

 

Development to Production of Unique GaAs and InP MMICs for 24 to 100 GHz Applications

Dr. Timothy T. Childs

Director, Marketing

TLC Precision Wafer Technology Inc.

 

Millimeter Wave Packaging Concepts Applicable to 77-GHz Radars for Automotive

Dr. Jim Carroll

Advanced Technology Design Manager

TriQuint Semiconductor

 

10:00 AM  

NETWORKING BREAK

 

10:30 AM

MILLIMETERWAVE SEMICONDUCTOR DEVICES, MODULES, and PACKAGING
(Cont'd)

Enabling Affordable ACC Front-ends

Dave Bannister

Business Stream Manager

QinetiQ

 

Millimeterwave Modules & Resonators in Low-K Ceramic

Martin Seth

European Business Manager

Dielectric Laboratories Inc

 

Ceramic Package for Millimeter-wave Radar

Shinichi Koriyama

Development Engineer

Communication Devices R&D Div.

Kyocera Corp.

 

A Millimeter-Wave Compact Transceiver Module Based On Planar Integration And Packaging with Broadband Loss Performance

Dr. Yonghoon Kim

President

Millisys

 
12:00 PM

 LUNCH

  

1:00 PM

PANEL

MILLIMETERWAVE SEMICONDUCTOR AND PACKAGING SUPPLIERS


Millimeterwave semiconductor Suppliers SPEAKERS 

and

other Participating semiconductor and packaging Suppliers 

2:00 PM

OTHER KEY ENABLING TECHNOLOGIES

Antennas

Environmental management

New RF materials

EMI/EMC Techniques

Testing and assembly issues
Cables and connectors

Metallized Plastics Antennas and Filters for High Volume Millimetre wave Communication and Sensor Applications

Uhland Goebel

Head, R&D

Huber + Suhner

 

Shielding Materials and Microwave Absorbers for EMI Applications in Automotive Radar and MMWave Communications

Richard Johnson

Product Manager Microwave Absorbers

Laird Technology

 

Base Material Solutions for Millimeter wave Automotive Applications

Manfred Huschka

General Manager

Advanced Dielectric Division

Taconic

 
3:20 PM

NETWORKING BREAK

  

3:40 PM

PANEL

HOSTS DISCUSS IF/HOW THE WORKSHOP MET THEIR EXPECTATIONS

 
DaimlerChrysler
Alcatel
Siemens

4:10 PM

Take Aways

Participants state their appreciation and interpretation of the workshop results and to what extent the workshop met their expectations.

 
5:30 PM  

Adjourn

  
7:00 PM  

Dinner (Dutch) 

 For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes

Thursday, October 21, 2004
9:00 AM

 and

2:15 PM

 

Guided Tour 

of

Mercedes - Benz Museum

and

Tour of Mercedes E-Class Assembly Including Distronic Integration

 

Bus Transportation provided from and to hotel.

 

 

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

 

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  Wednesday, October 6, 2004

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $565. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)

 

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL

Millennium Hotel Stuttgart

Plieninger Strasse 100

Stuttgart, Germany  70567

Phone: 49-711-7210

Fax: 49-711-2009

 

 

Please contact the hotel directly for reservations.  Mention the IWPC room block rate of €125.  Cut-off date for reservations is September 30, 2004.  After that date rooms cannot be guaranteed at the IWPC rate.

 

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.    No ties, please !!

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]

 

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA  18974      USA

 

 

Click HERE to Register for Workshop