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The International Wireless Industry Consortium

NEW    –    Interactive Technical Workshop

 

Limited to 100 seats
First Registered, First Served

 

 

Technology Partnering Opportunities
for
Global Mobile Broadband Infrastructure Equipment

WiMAX (802.16e), UMTS, WCDMA, HSDPA, TD-SCDMA, Proprietary


From chip sets to antennas
From Asian, European and North American Suppliers


Including ZTE Partnership Opportunities Round Tables


With Tour:  ZTE R&D Facilities
(Restrictions may apply - subject to ZTE approval.)


Hosted by:  ZTE
December 5-9, 2005
Shenzhen,China

 
Simultaneous Chinese < -- > English Translation Available


Crowne Plaza Hotel
SHENZHEN

9026 SHENNAN RD, OCT
SHENZHEN, 518053
CHINA
Tel: 86-755-26936888
Fax: 86-755-26936999
Email: cpsz@cpsz.com
Room Reservations: web site
 


Organized by the International Wireless Industry Consortium

(Click HERE to read why we changed our name.)

 

Click HERE to Register for Workshop


Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

 

Workshop Background

The IWPC’s international membership recognizes the global nature of the wireless industry and has requested that we engage with our colleagues in China

Mobile Broadband has the promise of becoming a major source of revenue for the Wireless Service Providers.

There are many Mobile Broadband technology choices (WiMAX (802.16e), UMTS, WCDMA, HSDPA, TD-SCDMA, Proprietary) – each of which will be adopted by Service Providers, worldwide, based on their legacy systems and future requirements.

 Major OEM’s who are planning to provide these technologies cannot develop all of these technologies on their own.  To meet the needs of the many Service Providers, worldwide, a Global EcoSystem of Suppliers must be developed.

Workshop Goal

The Goal of this Workshop is to bring together North American, European and Asian leaders from Mobile Broadband wireless technology companies to identify Mobile Broadband opportunities and requirements and to form Partnerships and Relationships needed to create and enhance a  Global Wireless Industry Ecosystem.

Monday, December 5, 2005

7:00 PM

Social and Networking  

Reception & Registration

At Hotel

(Mixed Western & Chinese Buffet)

Tuesday, December 6, 2005

7:00 AM

Networking Breakfast & Registration

 

8:00 AM

Opening Remarks

8:20 AM

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

9:00 AM

Chinese Government Office of the
MINISTRY OF INFORMATION INDUSTRY (
MII
)

  • What Role does the Chinese Government see for Mobile Broadband in China?  Timetable?  Hurdles?

Harmonic Development Strategy Considerations on WIMAX with 3G, Wi-Fi and WBMA following NGN Concept

Professor Ruming Chen

Vice Chairman of MII Science & Technology Committee 

and

Chairman of Radio Frequency Planning Consultative Committee in China

 

9:30 AM

BROADBAND IN CHINA

The Development of Broadband Wireless Access Technologies in China

Professor Song Junde

Beijing University of Posts and Telecom

10:00 AM

Networking Break   

 

10:30 AM

ZTE KEYNOTES

 

Primary Topics to be covered by ZTE

  • What key technologies and “eco-system” relationships would ZTE like to see to develop its Mobile Broadband further?

  • How would the basestation characteristics differ for fixed vs. Mobile Broadband?

  • What does ZTE see as the key hurdles to implementation?  Technology? Business/market forces?

 

Secondary Topics to be covered by ZTE, IF time permits

  • What does ZTE see as a Mobile Broadband Network architecture?  Mesh? Star? Other?

  • What would be representative Mobile Broadband Basestation requirements and specifications?  Overlay vs. new network roll out?

  • Would the Mobile Broadband equipment be an “add-on” to other basestation equipment or a totally new and independent system? 

  • What services does ZTE see as driving the need for Mobile Broadband?

 

Keynote Presentations

Dr. Shouchen Wang

General Manager of ZiMAX China

ZTE Corp.)

 

Ling Xu

Senior System Engineer of ZiMAX China

ZTE Corp.

 

 

11:30 AM

 NETWORKING LUNCH

 

12:45 PM

MOBILE BROADBAND
SERVICE PROVIDERS

  • What do the Mobile Broadband Carriers see as the usage model for Mobile Broadband services?

  • VOIP?

  • Data Services?

  • How will it complement/overlay fixed Mobile Broadband and Cellular services?

  • How do the Carriers see Mobile Broadband? As a competitor or complementary service to voice?

  • What timetable do the Mobile Broadband Carriers have for deployment?

  • What do the Mobile Broadband Carriers see as the key hurdles to implementation?

  • What services do the Carriers see as driving the need for Mobile Broadband?

  • Others?

 

 

Broadband Wireless Access in China

Mr. Jianyu Li

Senior Manager Broadband Wireless Project

China Netcom

 

Evolution and Synchronizing of Telecom

Mr. Zhengqiang Sun

Director of Beijing Technology Research Center

China Telecom

 

 

1:45 PM 

PANEL OF GOVERNMENT OFFICIALS,
HOSTS
AND SERVICE PROVIDERS

All Government Officials, Host Keynotes and Service Providers Present

2:45 PM

Networking Break 

  

3:15 PM

MAJOR SUBSYSTEM PROVIDERS-- 1
--Power Amplifiers, Transceivers and DAS

System Agnostic Transceivers – for Whichever Wideband Wins

Tian Zhao
Andrew Corp.

 

High Linearity GaAs Power Amplifiers for WiMAX

Damian McCann
Vice President

Mimix Broadband

 

DAS as a Coverage Solution for Wireless Broadband Technologies

Prakash Punjabi
Senior Product Mgr., APAC

ADC Telecommunications

 

Maximizing Efficiency Using Predistortion and Doherty

Irtiza Zaidi
Product Marketing Engineer

PMC-Sierra

 

5:15 PM

Adjourn

7:00 PM

ZTE Hosted Dinner

& Toast by ZTE Management

ZTE Hosted Dinner 

at Local Restaurant

(Chinese Dinner, Sit Down, Bus provided)

Wednesday, December 7, 2005

7:00 AM

Networking Breakfast

In Hotel

8:00 AM

MOBILE BROADBAND SYSTEM OEMs

  • What will be the Mobile Broadband Network Architecture?  Mesh? Star? Other?

  • What would be representative Mobile Broadband Basestation requirements and specifications?  Overlay vs. new network roll out?

  • Would the Mobile Broadband equipment be an “add-on” to other basestation equipment or a totally new and independent system? 

  • How would the basestation characteristics differ for fixed vs. Mobile Broadband?

  • What will be the key hurdles to implementation?  Technology? Business/market forces?

  • What services are seen as driving the need for Mobile Broadband?

  • What key technologies and relationships are needed to develop a Global Mobile Broadband EcoSystem?

 

Economic Delivery of Broadband Wireless Services

Dr. Anil Kripalani
Senior Vice-President

Qualcomm

 

Mobile Communication with 3G LTE and B3G

Dr. Wan Lin Li
Senior Vice-President/CTO

Siemens China

 

Present:

 

  • Lucent

  • Motorola

 

 

9:30 AM

Networking Break

 

10:00 AM

SYSTEM OEM PANEL

Previous OEM speakers, ZTE and other OEMs present  

11:00 PM

MAJOR SUBSYSTEM PROVIDERS-- 2
--Antenna Subsystems

Contribution of Broadband and Multiband Antenna Systems to Migration to 3G

Patrick Nobileau

VP Base Station Antennas

Radio Frequency Systems

 

Performance BSA for Optimized Wireless System Performance

George Xu

Andrew Corporation

 

12:00 PM

Networking Lunch

 

1:00 PM

KEY ADVANCES IN ENABLING TECHNOLOGIES-- 1
--Signal Processing and Conversion Chipsets

 

  • Baseband chipsets

  • FPGAs

  • ADC and DAC Chipsets and Design Modeling

 

IWPC Members

 

Advances in Mixed Signal Devices and the Role of Modeling of Data Converters

Brad Brannon

Systems Engineering

High-speed converter Product

Analog Devices

 

Addressing Complete Life Cycle of Wireless Base Stations

Edgar Wong

Communications Technical Marketing Engineer

Asia Pacific

Altera

 

FPGA – Ideal Signal Processing Solutions for Wireless Infrastructure

Andy Miller
Senior Marketing Manager

Xilinx

 

RF System Design for 3G/WiMAX

Dr. Francesco Dantoni, 

Senior System Manager

High Performance Analog Solutions

Texas Instruments Inc.

 

3:00 PM

Networking Break

 

3:30 PM

PANEL

KEY ADVANCES IN ENABLING TECHNOLOGIES-- 2
--Power Amplifier Semiconductor Options

 

  • Power semiconductor suppliers will debate the relative pros and cons of the different device technology options for Cellular and WiMAX Basestation applications.

  • A brief presentation will be made on the results of the November IWPC PA Semiconductor Workshop. 

  • Following this, each technology will be “Championed” by a selected speaker in a brief presentation.  This will be followed by open discussion with all power device suppliers present.

    • SiC- Cree

    • GaAs- Filtronic

    • LDMOS- Infineon

    • GaN-RF MicroDevices

 

WBG Transistors Products for WiMax

Tom Dekker

Global Sales Director

Cree Microwave

 

Other Speakers:

  • Infineon-- Gordon Ma

  • RF MicroDevices-- Naiqian Zhang

  • Filtronic-- Wolfgang Bosch

 

Others Confirmed present:

  • Philips

  • Freescale

  • TriQuint

5:30 PM

Adjourn

 

7:00 PM

Networking DinneR

Restaurant Outside Hotel

Thursday, December 8, 2005

7:00 AM

Networking Breakfast

In Hotel

8:00 AM

KEY ADVANCES IN ENABLING TECHNOLOGIES -- 3
--Components for the TX/RX Chain

  • Filters

  • Combiners

  • Diplexers

  • Dividers

  • Oscillators

  • Lightning protection

 

IWPC Members

 

Lightning Protection for Wireless Systems

Art Peltier

VP Engineering

PolyPhaser

 

Filtering Technologies for Today and Tomorrow's Crowded Airwaves

Tommy Cheng

MicroPhase Corporation

 

9:00 AM

KEY ADVANCES IN ENABLING TECHNOLOGIES -- 4
--Module Integration and Materials Technologies

  • Materials

  • Packaging and assembly technologies

  • Integration options

 

IWPC Members

 

Module Integration Technology for Wireless Systems

Richard Sheridan

STATSChipPAC

 

Electrically Conductive Adhesives
and Thermal Interface Materials for the Assembly of High Reliability, Wireless Telecommunications Equipment

Rosa Lau

Regional Marketing Manager, Asia 

Emerson & Cuming

 

10:00 AM

 Networking Break

10:30 AM

KEY ADVANCES IN ENABLING TECHNOLOGIES -- 4
--Module Integration and Materials Technologies

(Cont'd)

  • Materials

  • Packaging and assembly technologies

  • Integration options

 

Getting Ready for RoHS and WEEE: Is Your High Frequency Material Ready for Exposure to Lead-Free Solder Processing

Young Gao

Market Manager

Advanced Circuit Materials Division

Rogers Corporation

 

Integrating PCB Technology into Wireless Infrastructure System Requirements

Gary Pollard

Director Business Development

RF & Wireless Applications

Merix Corporation

 

Title TBD (Hi Q Ceramic Products)

Simon Mao

Key Account Manager

Dielectric Labs

Dover Ceramic Products Group

 

12:00 PM

 Networking Lunch

1:00 PM