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NEW    –    International Wireless Packaging Consortium

Limited to 100 seats
First Registered, First Served


Implementing Environmental Compliance
in the
Wireless Industry Supply Chain

Materials, Processes & Logistics for the RoHS 2006 Deadline

Are you ready?



And Tour:  
Celestica Lead-Free Labs and 
Infrastructure Equipment Assembly Area

(Restrictions may apply - subject to Celestica approval.)

 Hosted by: 

 August 10-13, 2004  

Toronto, Ontario, Canada

Inn on the Park
1100 Eglinton Avenue East
Toronto, Ontario, Canada M3C 1H8
Tel: (416) 444-2561
Fax: (416) 446-3308

Organized by the International Wireless Packaging Consortium


Click HERE to Register for Workshop

Moderated by
Don Brown, Director, IWPC
Rene Douville, Technical Director, IWPC



The WEEE and RoHS directives are being imposed worldwide and they are aimed at: 

reducing electrical waste, increasing recovery and recycling, and minimizing environmental impacts due to electrical equipment, and

eliminating certain uses of targeted (banned) substances in products put on the market.

These directives will significantly affect the responsibilities and roles of  wireless industry suppliers and manufacturers and their interactions.


At  the previous IWPC Workshop, "Next Generation “Ecological” Handset Design & Manufacturing", focused on the Handset industry, the issue of the impact of these directives on the handset industry and steps which are being taken to address them were discussed.


Varying degrees of exemptions to the directives exist and do not apply uniformly to all sectors of the wireless industry.


This Workshop has been organized to address the issues which will effect the entire wireless industry, as the industry transitions from pre Directive to post Directive requirements.




The goals of this Workshop are:

To better understand the RoHS and WEEE directives and their impact on the wireless equipment design and manufacturing, from the point of view of Celestica, Lucent, RIM and other industry leaders.

To better understand the role of EMS's in implementing these directives.

To assist the industry in preparing for future product design and manufacturing in terms of materials and component specifications.

To assist the industry in understanding the impact of merging in lead free qualified components with leaded components -- this implies a MASSIVE set of engineering change order logistics to manage the "cut-in" and management of new with old components

To share state of the art lead free solder processes and the effect these processes have on materials, logistics, design and manufacturing.

For suppliers to better understand their roles and responsibilities in meeting the requirements of the directives and the EMSs.

To learn who the major players are who will be charged with recovery and recycling of wireless industry equipment and materials.

For suppliers to better understand the expectations of Celestica's procurement offices in implementing these directives.


Tuesday, August 10, 2004

7:00 PM

Social and Networking 

Reception & Registration

At Hotel

Wednesday, August 11, 2004

7:00 AM



8:00 AM


Don Brown

8:15 AM


Each person will be asked to introduce him/herself and share how they can contribute to this process

9:00 AM


  • Celestica will provide an overview of the WEEE and RoHS Directives and how environmental regulations are being applied to 3 major equipment design and manufacturing sectors:

    • wireless infrastructure (base stations),

    • handsets and 

    • short range radio equipment manufacturing (WLAN, Bluetooth, etc.)

  • How is Celestica handling the differences in these different industry sectors, in terms of materials reporting documentation, exemptions and timing of various banned materials, against the design cycle differences between handsets, infrastructure and short range radio products?

  • What processes have been developed for lead free solders and how what else do those processes effect?

    • products requiring short term vs long term design cycles

    • mixed component selection (the impact of mixing components which are designed for lead free with components designed for lead solders)

    • repair/rework (how are the components marked?)

    • board material selection including board finishes

    • solder reflow technology implications for:

      • wave soldering

      • IR soldering

      • vapor phase soldering

  • What IT systems exist and/or need development?

    • how will the relationships between suppliers and customers will be managed?

  • Who is responsible for component and materials selections?

    • OEMs

    • ODMs 

    • EMSs


The Reliability Impact of the RoHS Directive on Wireless Infrastructure Equipment

Dan Shea, Chief Technology Officer


Product Conversion Strategies for RoHS Compliance

Mike Andrade
Sr. VP and General Manager of Telecom Group

10:30 AM



11:00 AM



To support the RoHS and WEEE Directives, what are the differences of timing, logistics, exemptions and technologies required for:

  • Handset equipment manufacturing

  • Infrastructure equipment manufacturing

  • WLAN and other short range radio equipment manufacturing


RoHS Implementation of Telecommunications Infrastructure Products

Jeff Davis
Director of Supply Chain Engineering
Lucent Technologies


RIM's Lead-Free Supply Chain Challenges 

Bev Christian, PhD
Manager, Materials Interconnect Lab
Research In Motion


Data Requirements to Cope with the Complexity of Environmental Legislation and Technology Challenge

Kurk Kan
Principal Staff Engineer


12:30 PM



1:30 PM

Procurement Logistics


What logistics systems are currently available which will connect EMSs and Suppliers to support the need for:


EIA's Material Composition Declaration Guide - Status Report

John Burkitt
Environmental Program Manager
Electronic Industries Alliance


E Day: Forever changing Supply Chain Management & Supplier Relationship Management

Peter Lachapelle
VP Content, Executive Sponsor for HAZMAT Program


Managing Exemptions

German Avila
Product Manager, Environmental Solutions 
Synapsis Technology, Inc.


2:30 PM


Panel session


All Previous speakers plus selected others.









Synapsis Technology


3:15 PM



3:45 PM

Materials, Components and Process Suppliers will Present their plans 
for compliance 
with the RoHS and WEEE Directives


  • Status of plans to support the RoHS and WEEE directives?

  • Reliability data for lead free solder technology associated with each suppliers products?

  • Status of plans to manage part numbers for old vs new products.

  • Experience with homogeneous materials declaration forms

  • How to manage the supplier/EMS/OEM relationship for mixed technology designs?



  • Materials

    • Organic board materials

    • Ceramic board/substrate materials

    • Board/substrate finishes

    • Solders

    • Adhesives

    • Plastics

    • Metals

  • Passive and integrated passive components

  • Active components

  • High density packaging

  • Cables and connectors

  • Thermal management

  • Enclosures




Lead Free Materials and Testing 2004

Doug Trobough
Director of Engineering Development
John Stephens


RoHS Impact on the Organic Substrate World

Arturo Aguayo
Market Development Manager
Rogers Corp.



Continued next day...

4:30 PM


Adjourn for day



4:45 PM

...Meet celestica's management...

Social Reception 
courtesy of Celestica


At Hotel

6:30 PM


Toronto Style

Bus transportation will be provided from/to hotel to/from restaurant.

Thursday, August 12, 2004

7:00 AM



8:00 AM

Materials, Components and Process Suppliers will Present their plans 
for compliance 
with the RoHS and WEEE Directives


(continued from previous day)



Lead-Free Convergence, Bump Alloy Challenges, and 2nd Level of Reliability to Support RoHS

           Dan Gerlach

        Technical Manager

        Package Quality

        & Reliability



WEEE & RoHS - A Component Supply Perspective

Steve Butcher
Business Manager, Capacitor Products

Dielectric Laboratories


Reliability of Ceramic Modules in a Lead-free Environment

Dr. Chris Hoffman
Director/New Technologies

EPCOS OHG, Deutschlandsberg, Austria


DuPont Product Stewardship Program

John D. Voultos
Market Development Manager




10:00 AM





10:30 AM


Fluoropolymers - Is it banned, is it not banned, who decides and how is it declared?

Ed Sandor,
Manager Applications Engineering,


RoHS Compliance from a Device Assembler Point of View

Flynn Carson
Director of Engineering


RoHS: If not now, When? Dealing with Customers and Markets for Cables and Electronic Materials

John Mosko
Associate/New Bus. Dev.

WL Gore


11:30 AM






12:30 PM

Set Up Break Out Sessions Working Groups


The group will interactively discuss and identify opportunities for future fruitful development.

We will break into small working groups and allow members to interact with like and not-so-like minded professionals.

12:45 PM

Breakout Sessions


Questions to be answered:


1.  What are the gaps in:

Technology ?

Communication ?


2.  What is needed from the supply chain to address these gaps ?


3.  What can IWPC do to assist ?



The goal of this process is to clarify the needs and identify new opportunities for development.

Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group. 

4:30 PM

Breakout Session Reports

Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. 


Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.


This process dramatically expands the thinking of the attendees.

5:15 PM

Wrap up and Take-Aways


6:00 PM



7:00 PM

Dinner -- Dutch

Join good friends for 
good food, good wine and really bad jokes


Friday, August 13, 2004


Tour - Celestica Facility

(Restrictions may apply - 
subject to Celestica approval.)


  • Test Laboratory for lead free solder

  • Infrastructure Assembly Area


Bus transportation provided to/from hotel from/to Celestica facility



Noranda Recycling
275 Steelwell Road
Brampton, Ontario L6T 5P3


Noranda Recycling is the largest electronics recycling company in North America, with 2 plants in US and 1 plant in Canada.


They do 100% destructive recycling of ~ 6,000 pounds per hour of electronics equipment.


After an introductory presentation, they will give us a tour of their shredding facility which separates electronics equipment into the many streams of materials, many of which are then shipped off to smelters for final processing.







IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.



Deadline for electronic version of handout materials:  July 28, 2004


ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $XXX. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)


Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



Inn on the Park
1100 Eglinton Avenue East
Toronto, Ontario, Canada M3C 1H8
Tel: (416) 444-2561
Fax: (416) 446-3308


Please contact the hotel directly to make reservations at the IWPC room block rate of CAD/$129.00.  Please make reservations before July 30, 2004.



All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested.    No ties, please !!




It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  


All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  


You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]


or by snail mail to:


610 Louis Drive, Suite 301

Warminster, PA  18974      USA



Click HERE to Register for Workshop