IWPC_Handset_2010

NEW – International Wireless Industry Consortium
Interactive Technical Workshop

Workshop Background: The IWPC has held 10 previous workshops on topics related to handset design, manufacturing, power management and supply chain relationships. As we look into the future, the Carrier handset needs are ever more complex requiring deeper communications between the Carriers, OEMs and the entire handset supply chain. While it may seem obvious that handset requirements range from the ultra-low cost to feature-rich there are MANY more business and technical variables to consider. What are the balances and tradeoffs between costs, features, power management, innovation and market timing for future handsets, globally.
Workshop Goal: The Goal of this workshop is to bring together the entire handset supply chain, including the Carriers, OEMs, ODMs/EMS’, sub-systems, components, materials, assembly and testing to have an open and frank dialog on the needs and the realities of meeting carrier needs. The Carriers will outline their handset expectations for 2008-2010 and the suppliers will discuss how they propose to meet these needs. The Carriers will get a clear understanding of what is possible. And the Supply Chain will get a clearer understanding of which technologies need special development attention and should be considered for improvement.

Tuesday, April 25
7:00-9:00PM	Social Reception and Registration	At Hotel
Wednesday, April 26
7:00 AM	Registration and Breakfast
8:00 AM	Opening Remarks	IWPC
8:20 AM	Self Introductions	Each person is asked to introduce him/herself and help us understand what they wish to learn and contribute to this event.
9:00 AM	Carrier Keynote Presentation What do Operators see as the kinds of features their customers will want and be willing to pay for in the next 2-4 years? What should the Handset Industry do to earn the Carrier's and Carrier's customers' business in the next 2-4 years? How will the market be shared between the need for Ultra-low cost handsets and Feature-Rich handsets globally? What feature sets need to be addressed? Voice and SMS Only Internet Access Fixed-Mobile Convergence Mobile TV – 1-2 way Music Email Gaming Location based services Etc. How important a role will security play in future handset development? Standardization Is there a role or value to the operator for hardware and software platform standardization (OMA, OMAPI, DigRF, OMTP etc.)? What will be the impact on the supply chain? What are the expected regional variations for the different feature sets? North America Europe China India Korea Japan Latin America Who do the Carriers prefer to have as their handset supplier and why? Handset OEM? Handset ODM? Handset EMS? Others? How do the Carriers rate the importance of these characteristics, from Handset Suppliers? Innovation Cost Power management OS and Applications software stability Security Time to market Size Weight Style Others Are carriers willing to communicate their Use Case Data to the Supply Chain to support future technology developments to meet the Future Carrier Requirements? And if so, what form would this data be available in? What can be done to reduce Time-to-Market? What can Carriers do to help enable faster implementation of Innovations into handsets?	Handset Strategies: Low-Cost to Feature-Rich Handsets Mr. Stephen Ospalak Director Subscriber Equipment Telus Mobility
9:45 AM	Networking Break
10:15 AM	Panel - Carriers Carriers have an opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and panelists will be given the opportunity to ask each other and the audience questions.	Panel Members Confirmed AllTel BT SK Telecom Sprint/Nextel T-Mobile TELUS Mobility Verizon Wireless Vodafone
12:00 PM	Networking Lunch
1:00PM	Enabling Technology Solutions to Meet Future Carrier Needs Chip-Sets and Platforms Session Single and Multi-Band and Multi-Mode Radios Mobile Connectivity Radios (Bluetooth, WiFi, WiMax) Fixed-Mobile Convergence Radio Solutions What impact does standardization efforts such as DigRF have? Antennas and dynamic matching What impact do organizations such as OMTP, OMA have? What impact does de facto standards such as OMAPI have? Does one go with dedicated or general purpose processors? Base-Band Architectures and flexibility Memory types Technology to implement Software Defined Radios Increased Integration versus Modularization Pros & Cons Design Flexibility Supply Chain Implications	The Anatomy and Challenges of Ultra-Low Cost and Feature Rich Handsets Dr. Chuck Brown Director, Handheld Strategic Platform Planning Intel Giving Voice to the World: Pushing the Envelope on Handset Integration to Support Emerging Markets Mr. Jay Srage Worldwide Product Strategy Manager Cellular Systems Texas Instruments Wireless Terminals Business Unit Digital Base-band Architectures: Trading Off Flexibility, Cost, Power and Time to Market Mr. Jorgen Krogh Director, Business Development Mobile Network Operators & OEM/ODM Analog Devices Software Radio for Handsets: Reducing Product Risk and Implementation Costs Mr. John Rayfield President & CEO Morpho Technologies DTx: A Novel Transmitter Technology for Multiband/Multimode Handsets: Enabling Higher Efficiency, Lower Cost, Smaller Size and Shorter Time to Market Mr. Mathias Merkler Business Development/ Technical Marketing Manager Tyco M/A COM
3:05PM	Networking Break
3:35PM	Enabling Technology Solutions to Meet Future Carrier Needs Chip-Sets and Platforms Session (Continued)	Handset RF Architectural Choices: From Low Cost to Feature-Rich Dr. Peter Wright Strategic Marketing Manager TriQuint Semiconductor Trade-Offs in the Handset Supply Chain: Finding the Right Balance Between Performance, Cost and Risk Mr. Joe Adam Vice President - Strategic Marketing Skyworks
4:25PM	Enabling Technology Solutions to Meet Future Carrier Needs *Materials and Packaging* Questions to be addressed: PCB substrates Shielding Device and System Level Packaging Integration (System-on-Chip) vs. System-in-Package (SiP) vs. Flexibility Size and Cost Reduction	Thermal Management Solutions for Feature-Rich Handsets Mr. Mike Gilbert Technical Applications Specialist GrafTech RF Module Assembly and Technology Integration Enabling Miniaturization Mr. Eric Gongora Director, SiP Products STATSChipPac Novel Architecture for Low Power/Feature-Rich Handset Radios Mr. L. Pierre de Rochemont Founder & Chairman Giga Circuits
5:40PM	Adjourn
7:00PM	Dinner San Jose Style	Transportation provided to/from hotel/restaurant
	Thursday, April 27
7:00 AM	Breakfast	At Hotel
8:00 AM	Handset OEMs Views on Meeting Carrier Needs and Future Supply Chain Relationships What feature sets do OEMs believe will emerge and be attractive for Carriers in the next 2-4 years? How do OEMs view the requirements and roll-out of Ultra Low-Cost Handsets? What is the balance between low costs and features? What is needed to improve Handset Security? How will OEMs address the cost and time to market requirements of Multi-Band/Multi-Mode radios? Is there a future for Software Defined Radios to meet these multi-band radio requirements? How will Fixed Mobile Convergence (FMC) impact future handsets? What are the challenges for reducing power consumption in handsets? What is needed from the supply chain to reduce Time-to-Market? Is there a role for standardization? Collaboration Other How does “innovation” get communicated to/from carriers to handset OEMs / suppliers?	Presentation TBA Mr. Jukka Kuusinen Director, Technology Collaboration Nokia Corporation Introduction of Huawei Handset and Wireless Terminal Mr. Roy Luo Director, North American Region Huawei
9:00AM	Handset ODM/EMS’ Views on Meeting Carrier Needs and Future Supply Chain Relationships How to contribute to lowering costs? How to reduce Time-to-Market? Views on how to speed up Testing Standardization of Testing Interfaces Design-for-Test (DFT) Improving collaboration with Handset OEMs Increased Automation	Ultra Low Cost Phones: 3G and Beyond Dr. Folkert Wierda Senior Business Development Manager Elcoteq SE Ultra Low Cost: ODMs Go Beyond a Low Bill of Materials Mr. Martin Fichter Vice President, Mobile Communications Technology Flextronics
10:00AM	Networking Break
10:30AM	OEM/ODM/EMS Panel	Confirmed Panel Members Elcoteq Flextronics Haier Huawei Kyocera Wireless Nokia
11:30 PM	Networking Lunch
12:30 PM	Enabling Technology Solutions to Meet Future Carrier Needs *Multi-Media Sub-Systems and User-Interface* Displays Keypads Cameras and Camera Modules MP3 Players TV Tuners/Demodulators Others	Overcoming Critical Power Issues for Mobile TV and Feature-Rich Handsets Mr. Tony Botzas Director, System Applications Clairvoyante, Inc Enabling Discover, Access and Usage of Today's Mobile Services: Dropping Barriers with Advanced Keypad Technologies Mr. Mark Connon CEO Digit Wireless
1:20 PM	Enabling Technology Solutions to Meet Future Carrier Needs *Energy* Sources and Power Management How will the Power Management Technology keep up with the needs of Future Handsets? Roadmaps of Power Sources Chemical batteries Fuel cells How will Operating Systems help address the Power Management challenge? What is the role of Handset Architecture in Reduction of Power Consumption?	Current and Future Applications of Dynamic Power Management Mr. Michael Laflin Marketing Director Enpirion, Inc. RF Integration for Improved Talk-Time Mr. Joe Madden Corporate Technology Avago Technologies
2:10 PM	Enabling Technology Solutions to Meet Future Carrier Needs *Benefits of Multi-Antenna Signal Processing for Client Devices*	Multi-Antenna Processing for Substantially Improved Coverage and Data Rates Mr. David Ford Handset Activity Manager ArrayComm
2:35 PM	Networking Break
3:05 PM	Closing Panel with Carriers Did this workshop meet the Carrier's expectations? What can the IWPC do help move this process forward?
3:45 PM	Take-Aways and Closing Remarks
4:30 PM	Adjourn
7:00 PM	*Dinner (Dutch )** * = in this context, Dutch is a term which means that each person will be responsible for their own dinner costs.	For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes.