Overview of 60 GHz WPANs

NEW – International Wireless Industry Consortium
Interactive Technical Workshop

Workshop Background: There is increasing interest in developing 60 GHz multi-gigabit datarate wireless systems for short range wireless communication in homes, offices and small coverage areas. Interest in this application has been stimulated by the rapid advances in Silicon based technologies where single chip solutions appear possible operating at gigahertz frequencies. Standards are still under development and major technical challenges still exist to reach the price points desired to allow broad deployment and thus the large volumes anticipated for target applications.
Workshop Goal: The Goal of this one day workshop is to bring together the entire millimeterwave supply chain, to: obtain a better understanding and appreciation of the current status of market and technology development for 60 GHz multi-gigabit short range wireless systems open dialogue on identifying and proposing ways to address and meet the technological challenges to identify ways the various levels of the supply chain can work together to move this technology forward
Sunday, September 17, 2006
7:00-9:00PM	Social Reception and Registration	At Hotel
Monday, September 18, 2006
7:00 AM	Registration and Breakfast
8:00 AM	Opening Remarks	IWPC
8:20 AM	Self Introductions	Each person is asked to introduce him/herself and help us understand what they wish to learn and contribute to this event.
9:00 AM	Host Presentations Why is multi-gigabit wireless needed? Why 60 GHz? What are the competitive alternatives and their pros and cons? What are the possible usage models and target markets? What are the activities worldwide and who are the key players What is the current status of the Standards development and what are the highlights of agreement and contention?	Multi GigaBit Wireless Communication at 60 GHz Paul Mattheijssen Research Scientist Research Group Integrated Transceivers Philips Research Laboratory Title TBD (Usage Cases) Neil Bird Department Head Philips Research Laboratory and Ali Sadri Wireless Architecture Manager Intel Corporation
10:10 AM	Networking Break
10:40 AM	Host Presentations (Cont'd) What are the key technical requirements being faced to meet the varied requirements such as: Operational distances from 2 meters to 20 meters Direction of communication Mobility of users Data rates from 0.5 Gbps to 10 Gbps Receiver challenges vs. transmitter challenges What are the key technology areas in need of special attention? Miniature, low cost, antennas and antenna arrays, both off chip and on chip, sectorial or steerable High speed processors MMIC technologies for low cost, high volume millimeterwave applications To keep the volumes up and the cost down, it will be desired to have a single solution or very few different solutions. What possible architectures might best lend themselves to this while allowing the multiple foreseeable applications requirements to be met? What options existing for partnering or working together to meet these challenges?	Technology Milestones for 60GHz Wireless Connectivity Duixian Liu Member of Research Staff Thomas J. Watson Research Center IBM Research Low Cost 60 GHz Deployment: Supply Chain Implications, Opportunities and Challenges Rudy Emrick Manager Millimeter-wave Applied Research Systems Solutions Group Motorola Labs
11:50 AM	Networking lunch
12:50 PM	PANEL of Co-HOSTS
1:50PM	Enabling Technology System architectures for high level of receiver, transmitter and processor integration. Low cost, miniature millimeterwave Integrated Antennas and antenna arrays, omni, directional and steerable or switchable 60 GHz Semiconductor Options and pros and cons. MEMS Technology Packaging and modular level integration for millimeterwave and low cost. Low cost, small, power efficient baseband processors.	Silicon Technologies: Addressing 60 GHz Wireless Communication Market Alvin Joseph Senior Technical Staff Semiconductor R&D IBM Corporation Challenges in Integration and Packaging of Millimeter-Wave IC Paul Beasly Product Manager Mimix Broadband
2:50 PM	Networking Break
3:20PM	Enabling Technology (Cont'd)	Options for Low-Cost Antenna Integration Ed Stoneham Advanced Technology Director EndWave Corporation MM-Wave Integrated Antennas on Bulk (10 ohm-cm) Silicon for Air Transmission Dr. Langis Roy Professor and Chairman Department of Electronics Carleton University
4:20 PM	Wrap Up Discussions, Takeaways and Host Workshop Assessment
5:30 PM	Adjourn

DEADLINE FOR HANDOUT MATERIALS:

Deadline for electronic version of handout materials: September 8, 2006

COSTS/REGISTRATION FEE:

ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover workshop costs such as conference room costs, food (Social Reception plus First Day breakfast/lunch/dinner plus Second Day breakfast/lunch plus 4 Breaks), booklet copying, audio/visual costs, etc.

These costs will be $489. (USD) per person. (For IWPC Members, only.)

ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL:

Hilton Washington Dulles Airport
13869 Park Center Road
Herndon, VA 20171
Phone: 703-478-2900
Fax: 703-478-9286

Please contact the hotel directly for reservations. Mention the IWPC room block rate of $189. USD

Cut-off date for reservations is September 6, 2006. After that date rooms cannot be guaranteed at the IWPC rate.

AUDIO VISUAL:

A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.

BUSINESS CARDS:

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS:

Business casual suggested. No ties, please !!

HANDOUT MATERIALS:

IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are asked to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.

Please send electronic materials (any size file) to:

sent any size email attachment to:
[email protected]

or use one of these FREE FTP Sites
IF your email system cannot send large files:
www.SendThisFile.com

www.DropLoad.com

and email to [email protected]

or by snail mail to:

IWPC

600 Louis Drive, Suite 104

Warminster, PA 18974 USA

Click HERE to Register