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NEW    –    International Wireless Industry Consortium
Technology Exchange Forum


Limited to 100 seats
First Registered, First Served



Table of Contents




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Deadline for Presentation Materials


Costs/Registration Fee for Members


Hotel Information


Travel Options from Paris to Hotel


Dress Code


Handout Material Options for Members





Handset RF Front-ends & Transceivers
Integration and Interface Tradeoffs for Flexibility and Low Cost
In a complex and uncertain marketplace!


Co-Hosted by:



Novotel Grenoble Nord Voreppe

1625 Route de Veurey

38340 Voreppe, France
Phone: 33-4-76-50-5559
Fax:  33-4-76-56-7626

Email:  [email protected]


October 23-24 2006

Grenoble, France


Preliminary Agenda
Subject to Changes



Organized by the International Wireless Industry Consortium


Click HERE to Register for Workshop


Moderated by:
Don Brown, Director, IWPC
Rene Douville, Senior Technical Director, IWPC

Mike Mullineaux, Senior Program Director


Technology Exchange Forum Background:


Many previous IWPC events have addressed wireless terminal (handset) evolution and how suppliers across the value chain can contribute to the process of improving cost, performance and time to market.


RF Front-end and transceiver systems and their associated components are an important part of the cost/benefit analysis that is very important as multiband, multimode and multimedia handsets introduce greater complexity, power, cost, sensitivity and marketplace uncertainty to the supply chain.


IWPC Members requested a clear dialog (and a deeper understanding), to clarify cost vs flexibility tradeoffs across all layers of the supply chain.


This event has been organized to address these requests.


Technology Exchange Forum Goals:


For All Attendees:

  • To network, across the entire supply chain, to ask questions and share insights resulting in helping move the industry forward, profitably.

For Operators and Handset OEMs:

  • To gain a better understanding of transceiver design choices; options, improvements and developments that are available to meet their emerging needs.

For RF Front-end and Transceiver suppliers:

  • To gain a better understanding of future Operator and Handset OEM requirements as they relate to wide ranging transceiver applications (from emerging ultra low-cost to feature rich) across handset modes, bands and geographical regions.


For the supply chain:

  • To better understand the key technology lead ins and procurement needs for future handset RF Front-end and transceivers.

  • To exchange technology content, with a focus on digital and analog chipsets, packaging and thermal management.


Monday, October 23, 2006


7:00 PM

Social Reception

At Hotel


Tuesday, October 24, 2006


7:00 AM

Registration and Breakfast


8:00 AM

Opening Remarks


8:15 AM

Self Introductions

Each person is asked to introduce him/herself and what he/she is hoping to learn in the next 2 days.

9:00 AM



Issues associated with the evolution of RF Front-end and Transceiver Architectures - cost vs. features in the next 2-4 years.


Handset OEMs will provide their sense for future expectations and how these will dictate form factor and integration requirements.

  • What bands, architectures and air interface modes will be required for 2009-2012 transceiver designs?

  • How much transceiver integration is practical, and at what point does performance degrade due to integration?

  • How do Noise, Ruggedness, Bandwidth, Linearity & Efficiency requirements impact future Transceiver roadmaps?

  • What levels of integration will be required for simultaneous operation?

  • What are the cost implications of different levels of integration?




  • Nokia
    Director, New Technology Sourcing

  • Multiple Antennas:
    Assessing the Impact on Terminals
    VP, Advanced Technology


10:30 AM

Networking Break


11:00 AM

RF FRONT-END and TRANSCEIVER SUPPLIERS VIEWS on Requirements, Challenges and Solutions

Trends in Integration…


Implications of multi-band, multi-mode...

  • What mode/band scenarios are expected to emerge by 2010, and how could these scenarios impact levels of front-end integration?

  • What are the challenges, tradeoffs and proposed solutions for the next 2-3 multi-mode, multi-band Transceiver design cycles?

  • What cost reduction techniques (component and/or system redesign, function replacement, etc.) are likely to impact feature rich designs?

  • What degree of transmit chain integration is being proposed, and what risks come with 90nm and smaller integration densities?

  • What are the Implications of reconfigurable transceiver designs on timing, control, power management and interfaces to the baseband?

  • What Packaging technologies (Chip Scale, BGA, Lead frame, Flip Chip, SiP, etc) will vendors standardize on?

  • How will expanding Air Interfaces and Grades of Services (with multiple antennas) impact both integration levels and interface methods

    • What are the interface requirements and challenges between the antenna and the transceivers?

    • What are the Interface requirements and challenges from the transceiver to the baseband modules/ICs?

  • What front- end module technologies (MEMs, Silicon on Sapphire, etc.) will enable integrated multi-mode, multi-band radios?

  • What are the latest developments in front- end module components

    • Power amplifiers

    • linearisers

    • low noise amplifiers

    • filters?

  • What are recent developments in A/D and D/A components?


Trends in GaAs Product Development for Wireless Handsets

Dr. Wolfgang Bosch




RF Transmitter Integration using System in Package

Peter Bealo

Handset Product Line Manager

Fairchild Semiconductor


Reducing Complexity in Multi-Mode Handset Radios

Mathias Merkler

Manager of Technical Marketing

M/A-COM, Div. of Tyco Electronics






1:30 PM

Keynote Presentations



RFMD's SDR Vision

Duncan Pilgrim

Strategic Marketing Manager



Tradeoffs in Multi-Band/Multi-Mode Transceivers - Flexibitility vs Performance vs Costs

Jon Strange


Analog Devices


Linearizing by Avoiding Linearization

Dr. Earl McCune

Managing Director

Panasonic R&D Company of America

Panasonic Emerging Advanced RF Laboratory (PEARL)



3:00 PM

Networking Break


3:30 PM


  • Participating IC suppliers will have the opportunity to clarify views & requirements, and will engage in a discussion where the audience can ask and address each other’s questions.

  • What are the next steps for the IWPC to further address the needs of the RF Front-end and Transceiver community?





Take Aways & Closing Remarks

5:30 PM



7:00 PM

Social Reception


For the France Telecom Hosted Future Handset Technologies Technologies


Registration in this Workshop Required to attend this Social Reception

At Hotel



Deadline for electronic version of handout materials: 

Monday, October 9, 2006



ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus First Day breakfast/lunch/dinner plus Second Day breakfast/lunch plus 4 Breaks), booklet copying, audio/visual costs, bus transportation to dinner and tour.


These costs are $534. (USD) per person. (For IWPC Members, only.)


ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



Novotel Grenoble Nord Voreppe

1625 Route de Veurey

38340 Voreppe, France
Phone: 33-4-76-50-5559
Fax:  33-4-76-56-7626

Email:  [email protected]


Please contact the hotel directly for reservations. Mention the IWPC room block rate of 90,05 Euros.


Cut-off date for reservations is Monday, October 9, 2006. After that date rooms cannot be guaranteed at the IWPC rate.






A Computer Projector will be available for the speakers.


In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested. No ties, please !!



IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.


Please send electronic materials (any size file) to:


sent any size email attachment to: 
[email protected]


or use one of these FREE FTP Sites
IF your email system cannot send large files: 




and email to [email protected]


or by snail mail to:


600 Louis Drive, Suite 104

Warminster, PA 18974    USA


Click HERE to Register