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NEW    –    International Wireless Industry Consortium
Technology Exchange Forum


Limited to 100 seats
First Registered, First Served




Table of Contents






Deadline for Presentation Materials


Costs/Registration Fee for Members


Hotel Information


Directions to Hotel


Dress Code


Handout Material Options for Members



Preliminary Agenda - Subject to Changes




Enclosure and Cooling Technologies for
Outdoor Base Stations

Low Cost, Light Weight and Efficient Options



July 31, 2007

Chicago, Illinois, USA


Hyatt Regency Woodfield
1800 E. Golf Road
Schaumburg, IL  60173
Phone: 847-605-1234

Fax: 847-605-8641





Click HERE to Register


Moderated by:
Don Brown, Director, IWPC
Joe Madden, Senior Project Manager, IWPC



Workshop Background:   With increasing focus on size, weight, and efficiency of outdoor base stations, several IWPC members have expressed interest in a workshop to examine new cooling and enclosure technology.  This Technology Exchange Forum is intended to allow for new ideas to be shared among multiple members to spark partnerships and technology insertion opportunities.


July 31, 2007

9:00 AM

Continental Breakfast


10:00 AM

Opening Remarks


10:15 AM

Self Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

10:30 AM

Base Station & Enclosure OEM presentations

  • Base Station equipment OEMs present their needs and requirements for Outdoor Mechatronics

  • OEM trends in enclosures and packaging for bulletproofing, earthquake safety, sensors/alarms, cooling

  • Trends in use of higher temperature components

  • Lighter enclosure materials with high strength

  • Ideas for heat management and innovative heat exchanger cores

Key Challenges for Outdoor Wireless Enclosures:  from Macro to Micro systems

Sr. Manager, Infrastructure



Enclosure and Cooling Technologies for Outdoor Base Stations

          Sr. Business Manager

Next Generation Enclosures for Outdoor Base Stations

Mechanical Engineer


Reducing Cost per Watt with Advanced Cooling Technologies

Engineering Manager
Dantherm Air Handling

12:20 PM

Networking Lunch


Hosted by W.l. Gore and Associates


1:20 PM

Enclosure/Environmental Technologies


  • How to lighten an enclosure and maintain robustness

  • Salt fog, wide temperature swings, humidity and other harsh environmental conditions

  • Lightning protection trends

  • Innovative materials and techniques

High Reliability with Direct Air Cooling 

Senior Engineer
R&D Technical Leader

WL Gore & Associates


Lightning Protection and Grounding Solutions for Communication Sites

VP Business Development & Technology

Polyphaser Inc.

2:20 PM

Cooling Technologies

  • Passive Cooling technologies

  • Heat Management technologies

  • Backup cooling systems (for temporary use in power outages)

  • Heat management technologies and materials

  • Advances in cooling technology and applicability of new techniques

Advanced Heat Management Technology

Staff Scientist, R&D


Expanding the Thermal Management Tools for RF Base Stations - Low Loss Thermally Conductive PTFE Laminates

           OEM Technical Sales

Arlon, Materials for
Electronics Division


Enclosure and Cooling Technologies for Outdoor Base Stations


Supercool, a unit of Laird Technologies

3:50 PM

Networking Break


4:20 PM

Panel Session

  • How does the United States regulatory environment drive up costs for outdoor base stations?    What can be done to harmonize the regulatory environment and reduce cost through globally standardized products?

  • What are the best ways to save on OPEX in addition to CAPEX savings?

  • What will change in the Mechatronics industry as base stations migrate toward picocell/femtocell architectures?

  • What types of applications are best suited to adopting new materials and techniques?

  • What will the industry need to do for operators to become comfortable with tower-mounted electronics?


  • Almatec AG

  • Flextronics

  • GrafTech

  • Motorola

  • Nortel Networks

  • T-Mobile

  • WL Gore & Associates

5:20 PM

Take Aways & Closing Remarks



6:00 PM


7:00 PM

Social Reception

(and Registration for BaseStation Overlay Workshop)




Deadline for electronic version of handout materials: 

July 13, 2007



ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus Breaks), booklet copying, audio/visual costs, etc.


We estimate that these costs will be $ 325.00 (USD) per person. (For IWPC Members, only.)


ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



Hyatt Regency Woodfield
1800 E. Golf Road
Schaumburg, IL  60173
Pone: 847-605-1234

Fax: 847-605-8641



Please contact the hotel directly for reservations. Mention the IWPC room block rate of $165. USD single occupancy.


Cut-off date for reservations is July 13,  2007. After that date rooms cannot be guaranteed at the IWPC rate.


TRAVEL OPTIONS FROM AIRPORT TO HOTEL:  The hotel is only 9 miles from O'Hare Airport.  For transportation details:  Click Here



A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested. No ties, please !!



IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.


For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.


Please send electronic materials (any size file) to:

[email protected]


or use one of these FREE FTP Sites

IF your email system cannot send large files:






Click HERE to Register