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NEW    –    International Wireless Industry Consortium
Interactive Technical Workshop

 

Limited to 100 seats
First Registered, First Served

 

 

 

Table of Contents

 

Agenda

 

Register

 

Deadline for Presentation Materials

 

Costs/Registration Fee for Members

 

Hotel Information

 

Dress Code

 

Handout Material Options for Members

 

Tower Mounted Electronics Reliability

Requirements and Solutions for Increased MTBF

 

Hosted by:

 

 

With Additional Carrier Presentations by:

 

And Tour:

Nokia Siemens Networks Solution Experience Center

 

May 12-15, 2009

Munich, Germany

 

Holiday Inn Munich-City Centre
Hochstrasse 3

Munich, Germany 81669
Telephone: +49-89-4803-4444
Email: [email protected]

 

 

Click HERE to Register

 

Moderated by:
Don Brown, Director, IWPC

 

Workshop Background:

As we move towards building networks with higher RF transmitter densities and power conservation is getting more and more important, mounting active electronics on tower tops offers good engineering solutions to these and other issues.

 

However, reliability issues of tower mounted electronics plague many carriers’ willingness to adopt mounting active electronics on roofs, towers or mast heads.

Workshop Goals:

The Goal of this workshop is to evaluate lessons learned and the state of the art of tower mounted electronics.

 

Clearly identify what does the industry need to do to provide reliable tower mounted electronics and communicate the viability of same.

 

AND – move the IWPC’s Tower Top Electronics Reliability (TTER) Working Group activities forward.

 

 

 

Tuesday, May 12, 2009

7:00 PM

Social and Networking
Reception & Registration

At Hotel

Wednesday, May 13, 2009

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks

 

IWPC Opening Remarks

Don Brown

Director

IWPC

 

8:20 AM

Self Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

9:00 AM

Keynote presentations

 

 

Fiber vs. Feeder

Head of Antenna Systems & Property

T-Mobile International

 

IEC 62305 Lightning Protection
Distributed Telecom Equipment & Remote Radio Heads

Vice President NT Infrastructure Systems

T-Mobile International

 

10:30 AM

Networking Break

 

11:10 AM

Carrier Views of
Tower Mounted Electronics

 

  • ROF: Radio Over Fiber systems technological and architectural milestones

    • analogic ROF

    • digital ROF

  • RAA: Reconfigurable Active Antennas

    • Reconfigurable Antenna Concept and Business Model

    • Architectural Solutions review

    • Power Distributed Digital Antenna and Digital Radiator

    • Configurations, beamforming and patterns

    • Evolution

and

  • Lessons Learned – good and bad – of tower mounted electronics

    • Engineering benefits

    • Practical realities

  • What is the MTBF Goal for Tower Mounted Electronics?

    • How is this defined?

    • Risk assessment

  • Impact of rooftop vs tower mounted electronics, in terms of acceptability?

  • Network impact of reliability issues in different geographical regions

  • Power savings benefits

  • Weight and wind load issues

  • Impact of lightening surge

  • Active vs passive cooling

  • Maintenance issues

 

 

Telecom Italia 10-year Experience: from  Radio Over Fiber (ROF) to Reconfigurable Active Antennas (RAA)

Network-Wireless Engineering

Telecom Italia

 

11:50  AM

Networking Lunch

 

1:00 PM

OEM Views

 

  • Lessons Learned – good and bad

  • What is needed from the industry to improve MTBF of tower mounted electronics.

  • Is there a better metric than MTBF?

  • CPRI vs OBSAI interface issues

 

Title TBA

Senior Marketing Manager

NEC

 

High Reliability Design for All-Outdoor Microwave Radio Systems

Product Management Director (EMEA)

DragonWave, Inc.

 

2:00 PM

Carrier Views of
Tower Mounted Electronics

(continued)

  • Lessons Learned – good and bad – of tower mounted electronics

    • Engineering benefits

    • Practical realities

  • What is the MTBF Goal for Tower Mounted Electronics?

    • How is this defined?

    • Risk assessment

  • Impact of rooftop vs tower mounted electronics, in terms of acceptability?

  • Network impact of reliability issues in different geographical regions

  • Power savings benefits

  • Weight and wind load issues

  • Impact of lightening surge

  • Active vs passive cooling

  • Maintenance issues

 

 

Title TBA

3G UTRAN Vendor Management

Telefonica/O2

 

 

2:40 PM

Networking Break

 

 

3:20 PM

Panel - Carriers and OEMs

 

 

  • Alcatel Lucent

  • Andrew

  • DragonWave, Inc.

  • Ericsson

  • NEC

  • Nokia-Siemens Networks

  • Powerwave

  • RFS

  • T-Mobile

  • Telecom Italia

 

4:30 PM

Adjourn for Day

 

 

6:30 PM

Bus leaves for:

 

Dinner

Munich Style

Bus Transportation provided to and from hotel.

Thursday, May 14, 2009

7:00 AM

Breakfast

 

 

8:00 AM

Sub-System Views

 

  • Active Sub-Systems

    • Antennas with active electronics

    • Remote radio heads

    • Multi carrier power amplifiers

    • Mast head amplifiers

    • LNAs

    • Others . . .

  • Passive Sub-Systems

    • Diplexers

    • Filters

    • Combiners

    • Passive antennas

    • Others . . .

 

 

What is Reliability and How is it Determined

Reliability Engineering Manager

Andrew Corp.

 

Architectures to Improve Remote Radio Head Reliability

Business Development Manager

PMC-Sierra

 

Reliability and Lifetime of Antennas and TMA's - Design Aspects and Tests

Head of Electrical Development

KATHREIN-Werke KG

 

Change the Way you Think about Wireless: Defying Gravity

Vice President, Marketing & Bus. Development

Ubidyne Inc.

 

10:00 AM

Networking Break

 

10:40 AM

Enabling Technologies
for Improved Reliability

 

  • Low loss RF cables

  • Enclosures

  • Connectors

  • Cooling – active vs passive for tower top electronics

  • Coatings/Paints

 

 

Real Life Tower Top Electronics Reliability Experience

Innovation Manager, RF

Spinner GmbH

 

Passive Cooling with Natural Convection from Finned Heat Sinks with/without Cover/Shroud

Chief Thermal Engineer

Huawei Technologies Co., Ltd

 

11:40 AM

Networking Lunch

 

12:40 PM

Enabling Technologies
for Improved Reliability

(continued)

  • Low loss RF cables

  • Enclosures

  • Connectors

  • Cooling – active vs passive for tower top electronics

  • Coatings/Paints

 

 

Test Procedure and Acceptance Criteria for Outdoor Installation

System and Application Manager

Harting Electronics GmbH

 

Enhanced Mean Time Before Failure for Tower Top Electronics by Climate Control with Gore PTFE Membrane Vents

W.L. Gore & Associates GmbH

 

1:40 PM

Materials, Packaging Technologies
for Improved Reliability

 

 

Design Considerations: High Frequency Material Properties and Their Impact on Reliability

Sr. Market Development Manager

Rogers Corp.

 

New Design Options to Drive MTBF and Reliability of TMA/TME's

VP Marketing

Arlon

 

2:40 PM

Networking Break

 

3:20 PM

Tower Top Electronics Reliability (TTER)
Working Group Review

  • Test methods

  • Prediction methods

  • Data collection

  • Next steps

 

 

TTER Chair and Co-Chairs

 

Ubidyne

Lorch

Andrew

 

4:00 PM

CLOSING PANEL

Panel session, OEMs and Operators

 

  • Has the workshop met your expectations?

  • If yes, how – if not, then what questions still need to be addressed?

  • What are the next steps to move this industry forward?

 

 

 

Host, OEMs and Operators

 

  • Alcatel Lucent

  • Andrew

  • DragonWave, Inc.

  • Ericsson

  • NEC

  • Nokia-Siemens Networks

  • Powerwave

  • RFS

  • T-Mobile

  • Telecom Italia

 

5:00 PM

TakeAways & Closing Remarks

 

5:45 PM

Adjourn

 

7:00 PM

Dinner (Dutch*)

 

* = in this context, Dutch is a term which means that each person will be responsible for their own dinner costs.

For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes

Friday, May 15, 2009

8:00 AM

 

Tour:

Nokia Siemens Networks Solution

Experience Center

 

 

 

     

 

DEADLINE FOR HANDOUT MATERIALS:

Deadline for electronic version of handout materials: 

Friday May 1, 2009

 

COSTS/REGISTRATION FEE:

ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus First Day breakfast/lunch/dinner plus Second Day breakfast/lunch plus 4 Breaks), booklet copying, audio/visual costs, etc.

 

We estimate that these costs will be 594,00 Euros per person. (For IWPC Members, only.)

 

ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL:

Holiday Inn Munich-City Centre
Hochstrasse 3

Munich, Germany 81669
Telephone: +49-89-4803-4444
Email: [email protected]

 

Please contact the hotel directly for reservations. Mention the IWPC room block rate of Euro 165,00 single occupancy.

 

Cut-off date for reservations is date, Monday, April 27, 2009. After that date rooms cannot be guaranteed at the IWPC rate.

 

AUDIO VISUAL:

A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.

 

BUSINESS CARDS:

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS:

Business casual suggested. No ties, please !!

 

HANDOUT MATERIALS:

IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.

 

Please send electronic materials (up to 5 MB) to:

[email protected]

 

or use this FREE FTP Site for files greater than 5 MB

http://www.iwpc.org/cal/sitedrop.asp 

 

Click HERE to Register