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NEW    –    International Wireless Packaging Consortium
Interactive Technical Workshop


Limited to 100 seats
First Registered, First Served



Next Generation “Ecological” Handset 
Design & Manufacturing

The Global Economic Impact of Recycling
Materials, Processes, Devices


& Tour
Motorola Cell Phone Manufacturing Assembly Facility

Co-Hosted by:  Motorola, Amkor, Nextel Communications

December 9-12, 2003

Plantation, Florida  USA

Sheraton Suites Plantation
311 North University Drive
Plantation, FL  33324
Phone: 954-424-3300
Fax: 954-452-8887

Subject to change



Organized by the International Wireless Packaging Consortium


Click HERE to Register for Workshop


Moderated by
Don Brown, Director, IWPC
Rene Douville, Technical Director, IWPC


Workshop Background

The IWPC has held 6 previous workshops on handset packaging.

We have learned about design philosophies, manufacturing issues, integration options, materials issues and OEM/EMS/Supply Chain relationships.

What we now must explore is the impact of recent global regulatory rulings on handset manufacturers’ responsibilities for returned handsets.

This issue has enormous impact on the entire wireless industry supply chain in terms of new design philosophies, new materials, new components, new manufacturing processes and consumer awareness, along with the formation of new partnerships with the recycling industry.

A mental picture – 500 million returned handsets PER YEAR will fill approximately 10 miles of railroad box cars.  No kidding !  How does the industry deal with this enormous problem, on a global scale, with international, national and local regulations?

Workshop Goal

The GOAL of this workshop is to continue the process of bringing the wireless industry supply chain together to explore the needs and available technologies to support these local, national and global environmental requirements for the take-back and reuse of handsets and other wireless electronics.

Tuesday, December 9, 2003

In Sheraton Suites Plantation Hotel

7:00 PM

Social Reception


Wednesday, December 10, 2003

In Sheraton Suites Plantation Hotel

7:00 AM

Registration and Breakfast


7:45 AM

Opening remarks


8:05 AM

Attendee Introductions


8:50 AM

Keynote Presentations


Title TBA

Jim Zollo
Motorola iDEN Subscriber Group


Leadfree, RoHs and Green: The Amkor Perspective

Doug Mathews
Sr. Director RF Design Applications
Amkor Technology

9:50 AM



10:05 AM

Regulatory and consumer issues


  • North America
  • Europe
  • Asia
  • What are the current and future regulations for take-back, reuse and recycling of electronic hardware?
  • Who must take responsibility for fulfilling these regulations?
  • What are the economic impacts on all parties?


Past, Present and Future Wireless Environmental Regulations in North America, Europe and Asia

Paul Hagen, Esquire
Chair, International Environmental Practice Group
Beverage & Diamond (Law Firm)


Product Stewardship Regulatory Drivers

Craig Liska
Corp. Director Environmental Health Safety


11:05 AM

Service Providers Views

  • What are the economics and options for handling returned handsets?

  • What are the responsibilities of the Service Providers? 

  • What are the responsibilities of the Handset Makers?

Wireless Phone Programs and Environmental Stewardship -- Global Trends and U.S. Experience.

Joanne Basile
VP for External & Industry Relations
Cellular Telecommunications & Internet Association (CTIA)


Nextel Service & Repair NexR² Program

Gary Moore
Senior Manager
Nextel Communications


AT&T's View of Future Wireless Electronics Recycling

Elizabeth McCleskey
Government Relations Office
AT&T Wireless


12:30 PM



1:30 PM

Environmental Recycling Industry

  • What new technologies are available for recycling electronic hardware?

  • What future options are being considered to meet the future regulatory demands?

  • What kinds of partnerships are envisioned between the recycling industry and the handset makers/wireless service providers?


Economic Design for Recycling from a Recycler's Perspective

Craig Boswell
HOBI International, Inc.


Improving Reuse & Recycling in the Wireless Industry 

Gary A. Straus
Vice President
ReCellular Inc.


2:15 PM

Panel Session

3:15 pm


3:35 pm

eco-Handset Makers views and challenges


  • What are the reuse and take-back responsibilities from the handset makers for returned handsets?

  • What are the reuse and take-back options and the economics and tradeoffs for these options?

  • What design, materials and process technologies do the handset makers wish for from the supply chain, and when, to meet the regulatory and consumer requirements?

  • What new design/product philosophies might be useful for these new regulations?
    For example:

    • Dis-integrated handset designs separating the radio section from the digital/user interface section?

    • Removable / reusable modules and components?


Sony-Ericsson's View of Environmental Design and Manufacturing and the Relationships between OEM's, EMS's and Supply Chain

John Hubacheck
Environmental Engineering Staff
Sony Ericsson


Eco-Handset Design and Manufacturing at Elcoteq

Juha Jussila-Song
Manager/Corp.Component Tech.
Elcoteq Network Corp.


Flextronics' Current Environmental Compliance Capabilities and Future Challenges

Dr. Dongkai Shangguan
Director, Advanced Process Technologies


Environmental Legislation's Impact on Handset Manufacturing

Thilo Sack
Advisory Engineer

5:00 PM

Panel Session or interactive discussion

6:00 pm

Adjourn for day

7:00 PM


Florida Style





Thursday, December 11, 2003

In Sheraton Suites Plantation Hotel

7:00 AM



8:00 AM

Enabling eco-technologies from the wireless Industry supply chain



  • What technologies are now available to meet these environmental regulatory, take-back and reuse issues?

  • How will these take-back and reuse issues effect future unit sales of devices, modules, materials, etc.?

  • Device Technologies

  • Device Packaging Technologies

  • Module Technologies

  • Assembly and Process Technologies

  • Packaging Technologies

  • Materials Options for lead free / bromine free / halogen reduced:

    • Ceramics

    • Organic substrate materials

    • Plastic cases

    • Solders

    • Adhesives

    • Metals

  • Antennas

  • Displays

  • Shielding

  • Design Tools

  • Cabling and connectors

  • Others..

IWPC Members  

Design for Environment 

Ron Bauer, Packaging Marketing Manager

The Liquid Crystal Polymer Advantage in the Manufacture of Environmentally Friendly Semiconductor Packaging

John Roman
RJR Polymers

Environmental Status and Technical Advantages of Ceramic Modules

Dr. Christian Hoffmann
Director New Technologies

Conductive Adhesives as Solder Alternatives: Recent Advances and Applications

David Peard
Business Manager
Emerson & Cuming

Lead Free / Green Packaging Materials
A Component Supplier's Perspective

Doug Romm
Member, Group Technical Staff
Texas Instruments

10:00 AM


10:30 AM

Enabling eco-technologies from the wireless Industry supply chain




Title TBA

Cliff Roseen
Technical Service Engineer
Rogers Corp.

“Green” Epoxy Non Woven Aramid Laminate & Prepreg System For HDI and Laser Microvia Application

Brian Lynch
Vice President

Environmental Aspects of PTFE Based Laminates in Relation to "Halogen-Free"

Bob Nurmi
VP/Corporate Development


Hitachi Chemical's Technologies and Policies for Green Cell Phone Materials

Terry Fischer, VP
Hikari Murai, Engineering Manager
Hitachi Chemical Co. America, LTD.




1:00 PM

Set Up Break Out Sessions Working Groups


Questions to be answered:

1.  What are the gaps in:




 2.  What is needed from the supply chain to address these gaps?


3.  What can the IWPC do to assist?


4.  What “Special Interest Groups, SIGs” would you like to see the IWPC organize to assist in these challenges?

The group will interactively discuss and identify opportunities for future fruitful development.


We will break into small working groups and allow members to interact with like and no-so-like minded professionals.


The goal of this process is to clarify the needs and identify new opportunities for development.


Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group.

1:15 PM

Breakout sessions


4:00 PM

Breakout session reports

Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group.

Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.

This process dramatically expands the thinking of the attendees.

5:00 pm

& Closing remarks


6:00 PM



7:30 PM

Dinner (Dutch) 

 For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes  


Friday, December 12, 2003


Tour of Motorola Facility

Transportation will be provided from/to hotel and tour location.







IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.



Deadline for electronic version of handout materials:  Monday, December 1, 2003


ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $395. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)


Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



Sheraton Suites Plantation
311 North University Drive
Plantation, FL  33324
Phone: 954-424-3300
Fax: 954-452-8887


Please contact the hotel directly to make reservations at the IWPC room block rate of $89.00.  Please make reservations before November 17, 2003.



All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested.    No ties, please !!




It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  


All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  


You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  


Please send ALL presentation materials to:

[email protected]


or by snail mail to:


610 Louis Drive, Suite 301

Warminster, PA  18974      USA


Click HERE to Register for Workshop