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NEW    –    International Wireless Packaging Consortium
Technology Exchange Forum

 

Limited to 100 seats
First Registered, First Served

 

Semiconductor Transmitter Solutions
for Multi-Use, Multi-Band Handsets

 

Single/Dual/Tri Band Voice & Data, Bluetooth, WiFi, WiMAX, GPS, …

 

Co-Hosted by: 
       )
    B

 January 16-17, 2005

Research Triangle Park, NC    USA

Millennium Hotel Durham
2800 Campus Walk Avenue
Durham, NC  27705
Phone: 919-383-8575
Fax: 919-383-8495

 


Organized by the International Wireless Packaging Consortium

Click HERE to Register for Workshop

TECHNOLOGY EXCHANGE FORUM BACKGROUND

Previous IWPC Workshops and Technology Exchange Forums have addressed cellular handsets and the various ways in which suppliers at all levels of the supply chain can contribute to improving cost, performance and time to market for handsets. 

The RF transmitter electronics consistently emerge as key components and this is especially true with the move to large displays, multifunction applications and the convergence of various wireless service options in the handset—all consuming power.

New technologies and devices are needed.

This event has been organized to address the options for handset power devices.

TECHNOLOGY EXCHANGE FORUM GOALS

The goals of this Technology Exchange Forum are:

  • For the Operators and Handset OEMs to get a better understanding of power amplifier semiconductor device options and improvements and expected developments to meet their emerging needs.

  • For the power amplifier device suppliers to get a better understanding of the future requirements of Operators and Handset OEMs for Power Amplifiers for emerging 3G and multifunction handsets including cellular, WiFi, WiMAX, mobile and fixed and Bluetooth applications.

  • For the supply chain to better understand the key technology and procurement needs for future handset power amplifiers.

  • For the supply chain to share their current and key technologies, with special attention to digital and analog chipsets, packaging and thermal management.


Sunday, January 16, 2005

7:00 PM

Social and Networking  

Reception & Registration

 Hotel TBD

Monday, January 17, 2005

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks and Welcome

Don Brown, Director, IWPC

8:15 AM

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

OPERATORS and OEMs

9:00 AM

OPERATOR and OEM VIEWS on 
FUTURE PA DEVICE REQUIREMENTS

Invited Service Operators and Handset OEMs will be asked to provide their views on what will be expected of future handsets

  • Usage options which affect how much power is needed and how long the users can operate without charging.

  • Model development to allow prediction of effect of power transmitter efficiencies on autonomy time before charging.

  • Functions and air interface modes to be required which need transmitters (Cellular telephony and data, WiFi, WiMAX, Bluetooth, etc.).

  • Need or desirability of flexible air interfaces and reconfigurability of function.

  • Timing of expectations.

  • Power, Bandwidth, Linearity, Efficiency

 

System Architecture Aspects of Power Amplifier Design and Integration - A Carrier's Perspective

Ron Borsato

Member of Technical Staff

Verizon Wireless

 

Other Operators Present

  • Bell Mobility

  • Nextel

10:00 AM

NETWORKING COFFEE BREAK

 

SEMICONDUCTOR SUPPLIER KEYNOTES

10:30 AM

Co-Host Keynote Presentations
Semiconductor Transmitter Suppliers 

Host Semiconductor Transmitter Suppliers will address the major developments in handset power devices, power device/module integration and options including:

  • Transmitter Design and Architectures

  • Transmitter driver designs and chipsets

  • Multi-function/multi-band amplifiers -- one or many?

  • Efficiency Improvement Techniques

  • Semiconductor Options

    • GaAs and variants

    • SiGe

    • GaN

    • SiC

    • CMOS

  • Linearization Techniques -- on and off chip

  • Implications of reconfigurability on transmitter designs 

  • Transmitter packaging/module integration options

 

Integration Trends for Multi Band phones - A WCDMA plus Quad Band GSM Transmit Chain Discussion

Dave Osika

VP Engineering, Wireless

Anadigics

 

Power Amplifiers for Mobile Terminals: Past, Present and Future

Kevin Walsh

Business Development Manager

RF MicroDevices

 

Transmitter Implications of Multi-Use, Multi-Band Handsets

Jan-Erik Mueller

Senior Principal RF Device Manager

Mobile Communications MMICs

Infineon

 

12:00 Noon

NETWORKING LUNCH

  

1:00 PM

Co-Host Keynote Presentations
Semiconductor Transmitter Suppliers 
(Cont'd)

 

More Bands and More Modes but less PA's

Pieter Lok

Innovation Manager

Philips Semiconductors

 

CMOS Reaches the Cellular Antenna

Rodd Novak

VP Marketing & Business Development

Peregrine Semicondcutor

 

DISRUPTIVE TECHNOLOGY SUPPLIERS

2:00 PM


Software defined radio and flexible approaches to RF transceivers are emerging and could have significant impact on future handset implementation options.
Linearization solution providers will address the options for chip level linearization for handheld  Power Amplifier requirements and open a dialog on these issues.

 

DTx - a Novel Approach to Multimode, Multiband Mobile Transmitter Architectures

Finbarr McGrath

General Manager

Tyco M/A-COM

 

RF-MEMS for Handsets: Barriers and Solutions

Dr. Arthur Morris III

CTO

wiSpry

 

2:50 PM

NETWORKING BREAK

 

3:20 PM

PANEL OF ALL PRESENTERS and OTHER PARTICIPATING TRANSMITTER SUPPLIERS

All speakers and other participating Semiconductor Handset Transmitter suppliers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and panelists will be given the opportunity to ask each other and the audience questions.

 
  • Anadigics

  • RF MicroDevices

  • Infineon

  • Peregrine Semiconductor

  • Philips Semiconductor

  • Tyco M/A-COM

  • wiSpry

Others Present

  • Fairchild Semiconductor

  • SiGe Semiconductor

Others Invited

  • Freescale

  • TriQuint

 

4:45 PM

OPEN DISCUSSIONS

and

TAKEAWAYS

 

5:30 PM

Adjourn

 

 

 

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

 

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  January 7, 2005

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $253.. (US) per person. 

(final cost to be determined as we get closer to the actual workshop date)

 

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL

Millennium Hotel Durham
2800 Campus Walk Avenue
Durham, NC  27705
Phone: 919-383-8575
Fax: 919-383-8495

 

Please contact the hotel directly for reservations.  Mention the IWPC room block rate of $109. US  Cut-off date for reservations is December 21, 2004.  After that date rooms cannot be guaranteed at the IWPC rate.

 

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.    No ties, please !!

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]

 

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA  18974      USA

 

 

Click HERE to Register for Workshop