IWPC Home Page |
NEW
– International Wireless Packaging Consortium
Interactive Technical Workshop
Limited
to 100 seats
First Registered, First Served
Handset Integration Tradeoffs Stacked
Die vs Stacked Packages vs SIP vs SOC, Hosted
by: \ Research Triangle Park ,North Carolina USA January 17-20, 2005
2800
Campus Walk Avenue
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Organized by the International Wireless Packaging Consortium
Click HERE to Register for Workshop
Workshop Background The IWPC has held 8 previous workshops on advanced packaging and assembly for handsets. We have learned about design philosophies, spec-creep, integration vs. margin-stacking, manufacturing issues, integration options, materials issues, OEM/EMS/ODM Supply Chain relationships and environmental design and manufacturing challenges. Handsets continue to increase in functionality and decrease in size and there is continuing pressure to reduce the cost of the handsets even further, annually. The handheld device packaging community needs to respond and adapt by developing and adopting the “appropriate” new technologies and establishing new relationships with their suppliers as well as their customers, worldwide. This workshop will enable suppliers from all levels of the supply chain to better understand their current and future roles in responding to these pressures and to establish the relationships which they will need to maintain their positions. |
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Workshop Goal The GOAL of this workshop is to continue the process of bringing the wireless industry supply chain together to explore the needs and available technologies of advanced packaging for handsets… AND Explore breakthrough thinking about supply chain partnering in this global industry… TO ACHIEVE: Appropriate cost and size effective handset packaging technologies AND supply chain partnering/relationship requirements with a clearer understanding of current and future integration vs margin-stacking tradeoffs. OUTPUT: Establish a group to cooperate in reviewing the handset packaging and assembly business model and how the various contributors in the supply chain can be better integrated for more efficient and cost effective handset production. |
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Monday, January 17, 2005 |
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7:00 PM |
Social and Networking, Reception & Registration |
At |
Tuesday, January 18, 2005 |
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7:00 AM |
Breakfast & Registration |
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8:00 AM |
Opening Remarks |
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8:15 AM |
Introductions |
Each person will be asked to introduce him/herself and share how they can contribute to this process |
HANDSET MAKERS REQUIREMENTS |
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9:00 AM |
KeynoteS Handset oem OVERVIEW of the NEEDS From an OEM perspective:
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Handset Market : What the future Holds Walt Marcinkiewicz Sr. Technical Advisor CTO Office SonyEricsson
and
OEM Sourcing Challenges in the Consumer Electronics World Ken Schmidt Procurement Executive SonyEricsson |
10:00 AM |
BREAK |
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10:30 AM |
Panel of OEM’s
Previous speakers and other OEMs present will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.
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OEMs Present
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11:00 AM |
service providers' views and Panel
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Handset System Level Power Usage Model Development Project John Seeman Member Technical Staff Verizon Wireless
Present
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12:00 Noon |
NETWORKING LUNCH |
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1:00 PM |
KEYNOTES DEVICE PACKAGING AND ASSEMBLY OVERVIEW of the SOLUTIONS and CHALLENGES From volume packager and assembler perspectives,
Issues to be addressed:
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Enabling Cost Effective Integration through Package Stacking Gordon
Gray Tessera
Integration of the Handset: Advanced Packaging Design and Supply Chain Solutions Lee Smith Senior Director Amkor
Integration for Reducing Total Cost of Ownership Ric Roetering VP Marketing & Sales Perlos
The Virtual Vertical Solution Bill Coker Director Sales & Marketing Elcoteq
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2:40 PM |
BREAK |
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3:10 PM |
OTHER DEVICE PACKAGING AND ASSEMBLY SUPPLIERS |
Title TBD Doug Mathews Member of Technical Staff StatsChipPac
Title TBD Speaker TBD Flextronics
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4:00 PM |
PANEL DEVICE PACKAGING AND ASSEMBLY SUPPLIERS
Speakers and other packaging and assembly suppliers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.
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Packagers and Assemblers Speakers |
5:15 PM |
Adjourn |
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7:00 PM |
DinnerSouthern Style |
Bus Transportation provided to and from hotel |
Wednesday, January 19, 2005 |
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7:00 AM |
Breakfast |
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8:00 AM |
MODULE SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING
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Title TBD Jim Chamberlin Sales and Marketing Jacket Micro Devices
Margin Stacking -- Is Integration worth more than the cost of the discrete parts? Mike Alferman Director of Application Engineering EPCOS
Integrated Low- Cost Thin-Film RF Filters on Glass-- A ‘Moore’s Law’ Platform for Passive Integration Richard Ernest Demaray CTO Symmorphix
Thin Film Integrated Passive Components for Handsets Andrew
Cervin-Lawry Gennum
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9:40 AM |
NETWORKING BREAK |
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10:10 AM |
MODULE
SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING |
Turnkey WLCSP: Why should you care? David Hays VP Strategic Marketing & Business Development Unitive
The Impact of System in Package on the Handset Supply Chain Joe Adam VP Strategic Marketing Skyworks Solutions |
11:00 AM |
INTEGRATED device SUPPLIERS' views ON REDUCING MARGIN STACKING
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Silicon Transceiver Improvements drives Cost Reductions and Economic Destruction? Tom Gratzek Director, Product Line RF and Wireless Systems Analog Devices
Size, Cost, and Flexibility Trade-offs for Package Integration of Digital and Memory Products in Cell Phones Deborah Kaller Manager/PCG Packaging Strategies Intel
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12:15 PM |
LUNCH |
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1:15 PM |
PanelDEVICE SUPPLIERS and packagers views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING Device suppliers and packagers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions. |
Previous Speakers |
2:15 PM |
Other
Enabling Technology
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Next Generation Small Displays: The Power Challenge Tony Botzas Director, System Applications Clairvoyante
Miniature antennas: a platform technology for handsets’ Mark Dowsett Director of Product Management & Applications Sarantel
Scalable Discrete Models as Consideration Factor in Level of Integration Trade-off Larry Dunleavy President Modelithics
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3:15 PM |
NETWORKING COFFEE BREAK |
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3:45 PM |
PANEL Co-HOSTS DISCUSS IF/HOW THE WORKSHOP MET THEIR EXPECTATIONS |
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4:15 PM |
Take Aways & Closing Remarks And What Can the IWPC Do To Help the Industry Move Forward? |
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5:30 PM |
Adjourn |
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7:00 PM |
Dinner (Dutch) |
For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes |
Thursday, January 20, 2005 |
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9:00 AM-12:00 PM |
Tour of Amkor/Unitive |
Bus Transportation provided from and to hotel. |
DEADLINE FOR HANDOUT MATERIALS Deadline for electronic version of handout materials: January 7, 2005 COSTS ALL
attendees AND pre-approved guests will be asked to cover out of pocket
workshop costs such as food, entertainment, booklet copying,
audio/visual costs, etc.
Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.
Make checks payable to IWPC.
HOTEL 2800
Campus Walk Avenue
Please contact the hotel directly for reservations. Mention the IWPC room block rate of $109 Cut-off date for reservations is December 21, 2004. After that date rooms cannot be guaranteed at the IWPC rate. AUDIO VISUAL All projector formats will be available for the speakers. · Computer projector · Overhead projector In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.
BUSINESS CARDS Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.
DRESS Business casual suggested. No ties, please !!
HANDOUT MATERIALS
It is our intention to prepare a handout booklet. We propose its contents be as follows: For ALL IWPC members:
For all companies who will be making a presentation at the Workshop:
Please send materials to:
or by snail mail to: IWPC 610 Louis Drive, Suite 301 Warminster, PA 18974 USA
Click HERE to Register for Workshop
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