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NEW    –    International Wireless Packaging Consortium
Interactive Technical Workshop

 

Limited to 100 seats
First Registered, First Served

 

 

Handset Integration Tradeoffs 
vs Margin vs Liability Sharing 
for Lowest Overall Cost

Stacked Die vs Stacked Packages vs SIP vs SOC,
Integrated Passives, Electro-Mechanical Integration
&

Tour
of Amkor/Unitive 
Die Level Processing Facility

 Hosted by: 
       

\           

Research Triangle Park ,North Carolina USA

January 17-20, 2005

 

Millennium Hotel Durham

2800 Campus Walk Avenue
Durham, NC  27705
Phone: 919-383-8575
Fax: 919-383-8495

 

Organized by the International Wireless Packaging Consortium

Click HERE to Register for Workshop

Workshop Background

The IWPC has held 8 previous workshops on advanced packaging and assembly for handsets.

We have learned about design philosophies, spec-creep, integration vs. margin-stacking, manufacturing issues, integration options, materials issues, OEM/EMS/ODM Supply Chain relationships and environmental design and manufacturing challenges.

Handsets continue to increase in functionality and decrease in size and there is continuing pressure to reduce the cost of the handsets even further, annually.

The handheld device packaging community needs to respond and adapt by developing and adopting the “appropriate” new technologies and establishing new relationships with their suppliers as well as their customers, worldwide.

This workshop will enable suppliers from all levels of the supply chain to better understand their current and future roles in responding to these pressures and to establish the relationships which they will need to maintain their positions.

Workshop Goal

The GOAL of this workshop is to continue the process of bringing the wireless industry supply chain together to explore the needs and available technologies of advanced packaging for handsets…

AND

Explore breakthrough thinking about supply chain partnering in this global industry…

TO ACHIEVE:

Appropriate cost and size effective handset packaging technologies AND supply chain partnering/relationship requirements with a clearer understanding of current and future integration vs margin-stacking tradeoffs.

OUTPUT:

Establish a group to cooperate in reviewing the handset packaging and assembly business model and how the various contributors in the supply chain can be better integrated for more efficient and cost effective handset production.

Monday, January 17, 2005

7:00 PM

Social and Networking, Reception & Registration

At

Tuesday, January 18, 2005

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks

 

8:15 AM

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

HANDSET MAKERS REQUIREMENTS

9:00 AM

KeynoteS

Handset oem

OVERVIEW of the NEEDS

From an OEM perspective:

  • What are the anticipated form, fit, function changes to future handsets which will require changes in packaging and assembly?

    • SmartPhones, Mid-Level, Low-End phone designs

  •  Will there be “cheap” versions versus sophisticated versions for different worldwide markets?

  • Tradeoffs between commodity components vs custom components and modules?

  • What are the expected changes in key specifications for future handsets

    • Which Frequency bands of operation?

    • Are multiple bands necessary per handset?

      • Single, dual, tri-band for voice, 802.11x, Bluetooth, GPS, WiMAX, others?

    • Power consumption requirements

    • Are multiple access formats necessary?

    • How will they accommodate the variability of worldwide specifications and needs?

  • What are the key expectations and anticipated requirements for future packaging in the handset industry?

  • What do they see as the impact of “ecologically sound” regulations and how will this affect their procurement?

  • What is the role responsibility of ODM/EMS’s in the specification and production of handheld devices?

 

Handset Market : What the future Holds

Walt Marcinkiewicz

Sr. Technical Advisor

CTO Office

SonyEricsson 

 

and

 

OEM Sourcing Challenges in the Consumer Electronics World

Ken Schmidt

Procurement Executive

SonyEricsson 

10:00 AM

BREAK

 

10:30 AM

Panel of OEM’s

 

Previous speakers and other OEMs present will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

 

OEMs Present

  • SonyEricsson

  • RIM

 

11:00 AM

service providers' views 

and

Panel

 

  • There is a need for the ability to assess the affect on the battery lifetime of a handset based on the choice of functions, features and suppliers -- so called "Autonomy" time.  A modeling system to allow such predictions will be described.

  • From a Service Providers' perspective, what are some usage models, which will drive the handset functionality, utility, power consumption and size?

  • Do Service Providers foresee need for or use of Software Defined Radios in handsets?  When?

    • Will the benefits of SDR be sufficient to offset cost or power consumption consequences?

 

Handset System Level Power Usage Model Development Project

John Seeman

Member Technical Staff

Verizon Wireless

 

Present

  • Bell Mobility

  • Nextel

12:00 Noon

 NETWORKING LUNCH

 

1:00 PM

KEYNOTES

DEVICE PACKAGING AND ASSEMBLY

OVERVIEW of the SOLUTIONS and CHALLENGES

From volume packager and assembler perspectives,

  • What are the key challenges?

  • What are the technologies and solutions being proposed for packaging at the device, module and assembly levels in the handset industry

  • What is needed from the OEMs/ODMs?

  • What is needed from the supply chain?

  • What elements of the supply chain do the co-hosts interface with and how do they contribute to margin stacking and responsibility sharing?

Issues to be addressed:

  • Margin stacking vs. integration
    (the REAL costs of integration?)

  • Environmental Issues and timing –
    (Lead-free/halogen free, materials declaration forms)

  • Stacked packaging vs. stacked die packaging vs. system in a package

  • Wafer level packaging (issues:  known-good-die vs. known-tested-die vs. packaged devices)

  • Custom vs. commodity devices – a procurement managers point of view

  • Electro-mechanical integration (connectors, antennas, etc embedded in the plastics)

  • Shielding

  • Design tools

  • Testing and acceptance

  • Wideband vs. narrow band antennas – cost, performance

  • Globalization issues for packaging design and manufacturing (who is the customer?

  • Similarities and differences in packaging and assembly for different markets sectors such as:

    • Cell phones

    • PDAs

    • WiFi

    • WiMAX

    •  Zigbee

    • UWB

    • Low Power Radio

    • Automotive Telematics

  • Impact of SDR on implementation of handsets;  what should the supply chain anticipate in developing volume packaging and assembly processes and facilities?

 

Enabling Cost Effective Integration through Package Stacking

Gordon Gray
Product and Technical Marketing Manager

Tessera

 

Integration of the Handset: Advanced Packaging Design and Supply Chain Solutions

Lee Smith

Senior Director

Amkor

 

Integration for Reducing Total Cost of Ownership

Ric Roetering

VP Marketing & Sales

Perlos

 

The Virtual Vertical  Solution

Bill Coker

Director Sales & Marketing

Elcoteq

 

 

2:40 PM

BREAK

 

3:10 PM

OTHER

DEVICE PACKAGING AND ASSEMBLY SUPPLIERS

 

Title TBD

Doug Mathews

Member of Technical Staff

StatsChipPac

 

Title TBD

Speaker TBD

Flextronics

 

4:00 PM

 PANEL 

DEVICE PACKAGING AND ASSEMBLY

SUPPLIERS

 

Speakers and other packaging and assembly suppliers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

 

Packagers and Assemblers Speakers

5:15 PM

Adjourn

7:00 PM

Dinner 

Southern Style

Bus Transportation provided to and from hotel

Wednesday, January 19, 2005

7:00 AM

Breakfast

 

8:00 AM

MODULE SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING

  • What are the implications of higher level functional integration on margins?

  • Who takes responsibility for reliability and liabilities?

  • What are the options for higher level integrated packages?

  • What is the business case for integrated packaging?

  • Is higher level integration worth more than the cost of the discrete parts?

  • Tradeoffs arguments between stacked die,  stacked packages, SIP and SoC, and Integrated Passives

  • What are the consequences in responsibility and reliability?

 

Title TBD

Jim Chamberlin

Sales and Marketing

Jacket Micro Devices

 

Margin Stacking -- Is Integration worth more than the cost of the discrete parts?

Mike Alferman

Director of Application Engineering

EPCOS

 

Integrated Low- Cost Thin-Film RF Filters on Glass--

A ‘Moore’s Law’ Platform for  Passive Integration

Richard Ernest Demaray

CTO

Symmorphix

 

Thin Film Integrated Passive Components for Handsets

Andrew Cervin-Lawry
Manager, Technology R&D

Gennum

 

9:40 AM  

NETWORKING BREAK

 

10:10 AM

MODULE SUPPLIERS views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING
(ConT'D)

 

Turnkey WLCSP: Why should you care?

David Hays

VP Strategic Marketing & Business Development

Unitive

 

The Impact of System in Package on the Handset Supply Chain

Joe Adam

VP Strategic Marketing

Skyworks Solutions

11:00 AM

INTEGRATED device SUPPLIERS' views  ON REDUCING MARGIN STACKING

  • What are the implications of higher level functional integration on margins?

  • Who takes responsibility for reliability and liabilities?

  • What are the options for chip level integration?

  • What components make sense for integration at the chip level?

  • Tradeoffs arguments between stacked die,  stacked packages, SIP and SoC?

  • Is higher level integration worth more than the cost of the discrete parts?

  • Tradeoffs arguments between stacked die,  stacked packages, SIP and Integrated Passives

  • What are the consequences in responsibility and reliability?

 

Silicon Transceiver Improvements drives Cost Reductions and Economic Destruction?

Tom Gratzek

Director, Product Line RF and Wireless Systems

Analog Devices

 

Size, Cost, and Flexibility Trade-offs for Package Integration of Digital and Memory Products in Cell Phones

Deborah Kaller

Manager/PCG Packaging Strategies

Intel

 

12:15 PM

 LUNCH

 

1:15 PM

Panel

DEVICE SUPPLIERS and packagers views on INTEGRATED PACKAGING TO REDUCE MARGIN STACKING

Device suppliers and packagers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions. 

 

Previous Speakers

2:15 PM

Other Enabling Technology 
Solution Suppliers' views

Enabling technology suppliers will be asked to describe their contributions to components, packaging and assembly of handsets and where they see their interfaces are to customers and suppliers. 

 

  • Automatic testing and diagnostic techniques

  • Antennas and antenna integration techniques

  • Board processing

  • Displays

  • Material options

  • Design Tools

 

Next Generation Small Displays: The Power Challenge

Tony Botzas

Director, System Applications

Clairvoyante

 

Miniature antennas: a platform technology for handsets’

Mark Dowsett

Director of Product Management & Applications

Sarantel

 

Scalable Discrete Models as Consideration Factor in Level of Integration Trade-off

Larry Dunleavy

President

Modelithics

 

3:15 PM

 NETWORKING COFFEE BREAK

 

3:45 PM

PANEL

Co-HOSTS DISCUSS IF/HOW THE WORKSHOP MET THEIR EXPECTATIONS

 

  • SonyEriccson

  • RIM

  • Amkor

  • Elcoteq

  • Perlos

  • Tessera

4:15 PM

Take Aways & Closing Remarks

And

What Can the IWPC Do To Help the Industry Move Forward?

 

5:30 PM

Adjourn

7:00 PM

Dinner (Dutch)

For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes

Thursday, January 20, 2005

9:00 AM-12:00 PM

Tour of Amkor/Unitive 
Die Level Processing Facility

(Restrictions may apply - subject to Amkor/Unitive approval)

Bus Transportation provided from and to hotel. 

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  January 7, 2005

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $471 (US) per person. 

(final cost to be determined as we get closer to the actual workshop date)

 

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL

Millennium Hotel Durham

2800 Campus Walk Avenue
Durham, NC  27705
Phone: 919-383-8575
Fax: 919-383-8495

 

 

Please contact the hotel directly for reservations.  Mention the IWPC room block rate of $109  Cut-off date for reservations is December 21, 2004.  After that date rooms cannot be guaranteed at the IWPC rate.

 

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.    No ties, please !!

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]

 

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA  18974      USA

 

 

Click HERE to Register for Workshop