Monday, May 5

7:00 PM

Social and Networking 

Reception & Registration

 Stuttgart Marriott Hotel

Tuesday, May 6

7:00 AM

Breakfast & Registration

8:00 AM

Opening Remarks

8:15 AM  

Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

MILLIMETERWAVE AUTOMOTIVE SENSORS

9:00 AM

DaimlerChrysler and Guest Auto OEMs

DaimlerChrysler and Guest Auto Suppliers will  address the key Business, Market and Technology Issues from their point of view in the supply chain.

• What are varieties of MMWave Automotive Sensors?

• What is the status of regulatory issues?

• What are the volume projections? 

• What are typical functional performances and frequencies?

• What are the key technical challenges?

• Requirements and expectations: 

  • Reliability?

  • Cost?

  • Size?

  • Environmental Factors?

  • "Green" Issues

  • Volume production techniques?

  • NRE Costs?

Radar Sensors for Automotive Applications - Status and Future Perspectives

Dr. Volker Schmid

Project Leader

and

Dr. Josef Wenger

Senior Manager, Radar Systems

DaimlerChrysler

Other OEMs Confirmed

• Toyota

• Jaguar

Other OEMs Expected Not Confirmed

• BMW

• Fiat 

• Ford/Mazda

• Renault

9:50 AM

BREAK  

10:20 AM

SELECTED MMWave AUTOMOTIVE SUBSYSTEM SUPPLIERS

• Collision Warning

• Adaptive cruise control

• Side detection systems

• Reverse warning detectors

• Lane control systems

• Short Range High Definition Radars

Radar Technology For Advanced Driver Assistance In Vehicles

Rolf Adomat

Head of Technology and Mechanical Design

Driver Assistance Systems

ContiTemic

Lessons Learned from 77 GHz and 24 GHz Automotive Radar Sensors Volume Production

Carl Luck

Manager, ACC Program

M/A-COM Inc.

ACC - A Stepping Stone to Other Driver Assistance Systems

Mark Basten

UK ACC Engineering Manager

Technical Centre

TRW Automotive

76 GHz Radar Sensor for Second Generation ACC

Claudio Hartzstein

General Manager

Groeneveld

24GHz Short Range Radar Sensors with Angular Resolution

Dr. Martin Schneider

Manager

Corporate Research and Development

Rober Bosch GmbH

Others Confirmed Present 

12:00 PM

 NETWORKING LUNCH

1:00 PM 

PANEL 

The Auto OEMs and Equipment Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.

Speakers and additional OEMs and subsystem providers

MILLIMETERWAVE COMMUNICATIONS

2:00 PM

MMWave Communications Systems 

• What are varieties of MMWave Wireless Communications? 

  • 60 GHz PTP

  • Status of 70-80 GHz

  • Basestation Backhaul >20 GHz

  • PMP and LMDS

  • Ka-Band Satcom

  • Very High Speed WLANs

• What are typical expected volumes and projections for each?

• What are typical performances and frequencies?

• Requirements and expectations: 

  • Reliability?

  • Cost?

  • Size?

  • Environmental Factors?

  • "Green" Issues

  • Volume production techniques?

  • NRE Costs?

60 GHz and Above:  The Next Frontier for the Fixed Wireless Broadband Access Market

Doug Lockie

Executive Vice-President

Endwave

Near-Term Trends in Microwave Backhaul in Europe

Peter Gibson

Director Regulatory Affairs
Stratex Networks

Development and Transition-to- Production of a High-Volume Commercial Ka-Band SATCOM

Outdoor Unit (ODU) Transmit Module

Dr. Roberto Alm

Engineering Team Leader

Raytheon

3:30 PM  

NETWORKING BREAK

SELECTED MMWave COMMUNICATIONS SUBSYSTEM SUPPLIERS

60GHz Ultra-High Speed Wireless PANs and WANs

Dr. Modest Oprysko

Dept. Group Mgr, Communications Technology Research

IBM

High Frequency RF Subsystems - New Opportunities, Challenges, and Approaches for > 15 GHz Communications

Ed Weatherwax

VP, Business Development

Xytrans, Inc.

4:45 PM

Panel And Open Interactive Discussions

Speakers 

5:30 PM

Adjourn  

6:30 PM

Dinner and Entertainment

Stuttgart Style  

 Bus Transportation provided to and from hotel

Wednesday, May 7

7:00 AM

Breakfast  

MILLIMETERWAVE ENABLING TECHNOLOGIES

8:00 AM

Millimeterwave Semiconductor Devices
Hosts 

Advances In Millimeterwave Semiconductor Devices

• Low noise Devices and MMICs

• Power amplifier devices and MMICs

• Receiver/Transmitter Chips

Packaging of MMICs for Automotive and Telecom Applications

Klaus Beilenhoff

R&D Program Manager

United Monolithic Semiconductors

GaAs and InP Technologies for Millimeterwave Applications

Al Lawrence

Director, Business Development

Velocium

SiGe Technology: Millimeter Wave Design Enablement  

Dr. Modest Oprysko

Dept. Group Mgr, Communications Technology Research

IBM

Other Millimeterwave Semiconductor Devices 

High-GHz Microwave ICs in SiGe-BiCMOS Technology

Peter Wennekers

Senior Member of Technical Staff

Motorola

Ultra-High-Speed SiGe Technology for HF applications  up to 100 GHz

Rudolf Lachner

Director Technology Development
Corporate Logic

Infineon

BREAK

10:15 AM

Millimeterwave Semiconductor Device Modules and Packaging 

• High Frequency Packages

• Module Techniques

• Power amplifiers

• Receiver/Transmitter Modules

• Linearization techniques and modules

Multilithic Microsystem (MLMS) Platform:  Enabling Cost Effective Integration of Mixed Millimeter Wave Technologies for Maximum Performance

Dan Teuthorn

Director of Engineering

Endwave

Cost / Performance Benefits in Millimeterwave Components by Miniaturisation

Mohammed Usman

Strategic Marketing Manager

E2V Technologies

Capacitors and Thin Film Devices Optimized for Millimeterwave Applications

Steve Butcher

Business Manager, Capacitor Products

Dielectric Laboratories, Inc

11:00 AM

Other Enabling Technology Providers

• Antennas

• Switching and tuning elements

• Environmental management

• New RF materials

• EMI/EMC Techniques

• Testing and assembly issues

• Cables and connectors 

PTFE Microwave Substrates - Mature Products for an Emerging Market

Jim Francey
Technical Service Manager
Taconic

Novel antenna technologies for mm-wave communications applications

Martin Shelley

Business Development Executive

ERA Technology Ltd

Coaxial Cable Assemblies, Connectors And Impedance Controlled Packaging Technologies

Bernhard Rosenberger

Head of R&D

Rosenberger Hochfrequenztechnik

Direct Digital Synthesis (DDS) Applications to Automotive Radar at 77GHz, and the Additional Millimeterwave Components Require to Construct a Practical System

Jeff Keip

Product Marketing Manager

Analog Devices

 LUNCH

1:30 PM

Set Up Break Out Sessions Working Groups

Questions to be answered:

1.  What are the gaps in:

Technology ?

Communication ?

2.  What is needed from the supply chain to address these gaps ?

3.  What can IWPC do to assist ?

The group will interactively discuss and identify opportunities for future fruitful development.

We will break into small working groups and allow members to interact with like and no-so-like minded professionals.

The goal of this process is to clarify the needs and identify new opportunities for development.

Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group. 

2:00 PM

Breakout Sessions

4:00 PM 

Breakout Session Reports

Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. 

Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.

This process dramatically expands the thinking of the attendees.

Take Aways & Closing Remarks

Adjourn

Dinner (Dutch) 

Thursday, May 8

Tour of DaimlerChrysler Engine Factory 
and
Mercedes Museum 

(30 person limit, first come first served)

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  April 28, 2003

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $395. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL

We have blocked 25 rooms at the 

Stuttgart Marriott Hotel
Mahdentalstrasse 68
Sindelfingen, 71065
Baden-Wuerttemberg, Germany
Phone: 49 7031-6960
Fax: 49 7031-696880

  at a Conference Room Rate of 97.00 Euros single/double occupancy.

Please call the hotel before April 28, 2003  to make your reservations at this rate.  

After April 28, 2003 the hotel will release the un-reserved rooms and you may be charged full hotel rates.

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS

Business casual suggested.    No ties, please !!

Click HERE to Register for Workshop