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NEW        International Wireless Packaging Consortium
Interactive Technical Workshop


Limited to 100 seats
First Registered, First Served






Where and When is the future?

Automotive Radar, Sensors and
Communications Equipment > 20 GHz

DaimlerChrysler Tour of Engine Plant and Mercedes Museum

 Hosted by:   




Stuttgart, Germany

May 5-8, 2003  

Stuttgart Marriott Hotel
Mahdentalstrasse 68
Sindelfingen, 71065
Baden-Wuerttemberg, Germany
Phone: 49 7031-6960
Fax: 49 7031-696880




Organized by the International Wireless Packaging Consortium


Click HERE to Register for Workshop


Moderated by
Don Brown, Director, IWPC
Rene Douville, Technical Director, IWPC


Monday, May 5

7:00 PM

Social and Networking 

Reception & Registration

 Stuttgart Marriott Hotel

Tuesday, May 6

7:00 AM

Breakfast & Registration


8:00 AM

Opening Remarks


8:15 AM  


Each person will be asked to introduce him/herself and share how they can contribute to this process


9:00 AM

DaimlerChrysler and Guest Auto OEMs

DaimlerChrysler and Guest Auto Suppliers will  address the key Business, Market and Technology Issues from their point of view in the supply chain.

  • What are varieties of MMWave Automotive Sensors?

  • What is the status of regulatory issues?

  • What are the volume projections? 

  • What are typical functional performances and frequencies?

  • What are the key technical challenges?

  • Requirements and expectations: 

    • Reliability?

    • Cost?

    • Size?

    • Environmental Factors?

    • "Green" Issues

    • Volume production techniques?

    • NRE Costs?


Radar Sensors for Automotive Applications - Status and Future Perspectives

Dr. Volker Schmid

Project Leader


Dr. Josef Wenger

Senior Manager, Radar Systems


Other OEMs Confirmed

  • Toyota

  • Jaguar

Other OEMs Expected Not Confirmed

  • BMW

  • Fiat 

  • Ford/Mazda

  • Renault

9:50 AM



10:20 AM


  • Collision Warning

  • Adaptive cruise control

  • Side detection systems

  • Reverse warning detectors

  • Lane control systems

  • Short Range High Definition Radars


Radar Technology For Advanced Driver Assistance In Vehicles

Rolf Adomat

Head of Technology and Mechanical Design

Driver Assistance Systems



Lessons Learned from 77 GHz and 24 GHz Automotive Radar Sensors Volume Production

Carl Luck

Manager, ACC Program

M/A-COM Inc.


ACC - A Stepping Stone to Other Driver Assistance Systems

Mark Basten

UK ACC Engineering Manager

Technical Centre

TRW Automotive


76 GHz Radar Sensor for Second Generation ACC

Claudio Hartzstein

General Manager



24GHz Short Range Radar Sensors with Angular Resolution

Dr. Martin Schneider


Corporate Research and Development

Rober Bosch GmbH


Others Confirmed Present 

  • Delphi


12:00 PM



1:00 PM 


The Auto OEMs and Equipment Providers will be given the opportunity to clarify their needs, requirements and views and will engage in a panel session where the audience is invited to ask questions and they will be given the opportunity to ask each other and the audience questions.


Speakers and additional OEMs and subsystem providers


2:00 PM

MMWave Communications Systems 

  • What are varieties of MMWave Wireless Communications? 

    • 60 GHz PTP

    • Status of 70-80 GHz

    • Basestation Backhaul >20 GHz

    • PMP and LMDS

    • Ka-Band Satcom

    • Very High Speed WLANs

  • What are typical expected volumes and projections for each?

  • What are typical performances and frequencies?

  • Requirements and expectations: 

    • Reliability?

    • Cost?

    • Size?

    • Environmental Factors?

    • "Green" Issues

    • Volume production techniques?

    • NRE Costs?


60 GHz and Above:  The Next Frontier for the Fixed Wireless Broadband Access Market

Doug Lockie

Executive Vice-President



Near-Term Trends in Microwave Backhaul in Europe

Peter Gibson

Director Regulatory Affairs
Stratex Networks


Development and Transition-to- Production of a High-Volume Commercial Ka-Band SATCOM

Outdoor Unit (ODU) Transmit Module

Dr. Roberto Alm

Engineering Team Leader



3:30 PM  



4:00 PM PM


60GHz Ultra-High Speed Wireless PANs and WANs

Dr. Modest Oprysko

Dept. Group Mgr, Communications Technology Research



High Frequency RF Subsystems - New Opportunities, Challenges, and Approaches for > 15 GHz Communications

Ed Weatherwax

VP, Business Development

Xytrans, Inc.



4:45 PM

Panel And Open Interactive Discussions


5:30 PM



6:30 PM

Dinner and Entertainment

Stuttgart Style  

 Bus Transportation provided to and from hotel

Wednesday, May 7

7:00 AM





8:00 AM

Millimeterwave Semiconductor Devices

Advances In Millimeterwave Semiconductor Devices

  • Low noise Devices and MMICs

  • Power amplifier devices and MMICs

  • Receiver/Transmitter Chips

Packaging of MMICs for Automotive and Telecom Applications

Klaus Beilenhoff

R&D Program Manager

United Monolithic Semiconductors


GaAs and InP Technologies for Millimeterwave Applications

Al Lawrence

Director, Business Development



SiGe Technology: Millimeter Wave Design Enablement  

Dr. Modest Oprysko

Dept. Group Mgr, Communications Technology Research




9:00 AM

Other Millimeterwave Semiconductor Devices 

High-GHz Microwave ICs in SiGe-BiCMOS Technology

Peter Wennekers

Senior Member of Technical Staff



Ultra-High-Speed SiGe Technology for HF applications  up to 100 GHz

Rudolf Lachner

Director Technology Development
Corporate Logic



9:45 AM



10:15 AM

Millimeterwave Semiconductor Device Modules and Packaging 

  • High Frequency Packages

  • Module Techniques

  • Power amplifiers

  • Receiver/Transmitter Modules

  • Linearization techniques and modules

Multilithic Microsystem (MLMS) Platform:  Enabling Cost Effective Integration of Mixed Millimeter Wave Technologies for Maximum Performance

Dan Teuthorn

Director of Engineering



Cost / Performance Benefits in Millimeterwave Components by Miniaturisation

Mohammed Usman

Strategic Marketing Manager

E2V Technologies


Capacitors and Thin Film Devices Optimized for Millimeterwave Applications

Steve Butcher

Business Manager, Capacitor Products

Dielectric Laboratories, Inc


11:00 AM

Other Enabling Technology Providers

  • Antennas

  • Switching and tuning elements

  • Environmental management

  • New RF materials

  • EMI/EMC Techniques

  • Testing and assembly issues

  • Cables and connectors 

PTFE Microwave Substrates - Mature Products for an Emerging Market

Jim Francey
Technical Service Manager

Novel antenna technologies for mm-wave communications applications

Martin Shelley

Business Development Executive

ERA Technology Ltd


Coaxial Cable Assemblies, Connectors And Impedance Controlled Packaging Technologies

Bernhard Rosenberger

Head of R&D

Rosenberger Hochfrequenztechnik


Direct Digital Synthesis (DDS) Applications to Automotive Radar at 77GHz, and the Additional Millimeterwave Components Require to Construct a Practical System

Jeff Keip

Product Marketing Manager

Analog Devices


12:30 PM



1:30 PM

Set Up Break Out Sessions Working Groups


Questions to be answered:


1.  What are the gaps in:

Technology ?

Communication ?


2.  What is needed from the supply chain to address these gaps ?


3.  What can IWPC do to assist ?


The group will interactively discuss and identify opportunities for future fruitful development.

We will break into small working groups and allow members to interact with like and no-so-like minded professionals.

The goal of this process is to clarify the needs and identify new opportunities for development.

Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group. 

2:00 PM

Breakout Sessions


4:00 PM 

Breakout Session Reports


Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. 


Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.


This process dramatically expands the thinking of the attendees.

5:00 PM

Take Aways & Closing Remarks

5:30 PM  


7:00 PM  

Dinner (Dutch) 

For those who desire to join us, we get together to enjoy good friends, good food, good wine and [really] bad jokes


Thursday, May 8

9:00 AM - 11:00 AM
AM -1:00 PM 

Tour of DaimlerChrysler Engine Factory 
Mercedes Museum 

(30 person limit, first come first served)

Bus Transportation provided from and to hotel (also after Factory Tour)




IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.



Deadline for electronic version of handout materials:  April 28, 2003



ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $395. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)


Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



We have blocked 25 rooms at the 


Stuttgart Marriott Hotel
Mahdentalstrasse 68
Sindelfingen, 71065
Baden-Wuerttemberg, Germany
Phone: 49 7031-6960
Fax: 49 7031-696880


  at a Conference Room Rate of 97.00 Euros single/double occupancy.


Please call the hotel before April 28, 2003  to make your reservations at this rate.  


After April 28, 2003 the hotel will release the un-reserved rooms and you may be charged full hotel rates.



All projector formats will be available for the speakers.  

         Computer projector  

         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested.    No ties, please !!




It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  


All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  


You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]

[email protected]


or by snail mail to:


610 Louis Drive, Suite 301

Warminster, PA  18974      USA

If your file is larger than 3 MB, please use  


Call or email Don Brown for instructions on how to use



Click HERE to Register for Workshop