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NEW    –    International Wireless Packaging Consortium (tm)
Interactive Technical Workshop

 

Limited to 100 seats
First Registered, First Served

 


FINAL AGENDA

Outsourcing Trends in the Wireless Industry

The Changing Role of 
Electronic Manufacturing Service (EMS) Providers 
in the Supply Chain

 

& Tour – Celestica Facility
in Salem, NH
NOTE:  Due to customer confidentiality
the facility tour will be restricted.
Please contact IWPC for details.

Hosted by:  Celestica

 

SAME DATES ŕ June 17-20, 2003

NEW LOCATION ŕ Nashua, New Hampshire, USA

 

Sheraton Nashua Hotel
11 Tara Boulevard
Nashua, New Hampshire  03062  USA
TEL:  603-888-9970
FAX:  603-888-4112

 

 

Organized by the International Wireless Packaging Consortium (tm)

 

Click HERE to Register for Workshop

 

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC

 

Outsourcing Trends in the Wireless Industry

The Changing Role of 
Electronic Manufacturing Service (EMS) Providers 
in the Supply Chain

 

& Tour – Celestica Facility
in Salem, NH

NOTE:  Due to customer confidentiality
the facility tour will be restricted.
Please contact IWPC for details.

 

Hosted by:  Celestica

 

SAME DATES ŕ June 17-20, 2003

NEW LOCATION ŕ Nashua, New Hampshire, USA

 

Sheraton Nashua Hotel
11 Tara Boulevard
Nashua, New Hampshire  03062  USA
TEL:  603-888-9970
FAX:  603-888-4112

 

 

New SARS Developments
Require Change in Workshop Location

 

Based on recent developments relating to SARS and Toronto, and the likelihood of companies reinstating past travel restrictions, Celestica and the IWPC have decided to move the workshop, still scheduled for June 17-20, to a hotel near Celestica’s Salem NH facility.  (in the Lowell MA area -- Easy driving distance from Boston’s Logan Airport and the Manchester, NH Airport)

 

New hotel information will be forthcoming in the next few days.

 

Please call the Fairmont Hotel in Toronto Canada (Tel: 416-368-2511) to cancel your previous hotel reservations.

 

 News Sources:

Outbreak puts Toronto back on SARS list

Boston, Globe

 

Situation in Toronto,
interpretation of “areas with recent local transmission”

World Health Organization

Tuesday, June 17, 2003

Evening

Start at 7:00 PM

Social and Networking Reception & Registration

 

Wednesday, June 18, 2003

7:00 AM

Breakfast & Registration

 

8:00 AM

Opening Remarks

Don Brown, 
Director, IWPC

8:20 AM

Introductions

Each person is asked to introduce him/herself.

9:00 AM

Keynote Presentations

  • Geographical considerations to reduce costs

    •   Needs and requirements to move to the Pacific Rim

  • Current and future relationships between OEMs and EMS Providers

    • Design

    • Development

    • Manufacturing

    • Testing

  • Volume/Mix considerations

    • Low Volume/High Mix

    • High Volume/Low Mix

  • Current and future relationships between EMS Providers and the rest of the supply chain

  • Who is the “customer” from the point of view of the supply chain – the OEM, the EMS or both?

    • How is this 3-way business relationship managed, now and in the future?

  • Topics of particular interest, now and future:

    • Design services being offered

    • Design for manufacturing issues

    • Test engineering services

    • System assembly

    • Supply chain management

    • Vendor lists – how to get on the approved vendor list?

    • Repair services

    • Technology development

      • Who will do it in the future and who will pay for it?

      • Advanced materials

      • Standards

      • Advanced manufacturing processes

    • EMS PROVIDERS adoption process of new sub-system concepts, design, development and manufacturing

    • IP -- who owns it?

  • The future relationship between Outside Design Services, Electronic Manufacturing Services and the Customer?

Transformational Outsourcing in the Wireless Industry

Mike Andrade
Senior Vice President and General Manager, Telecom Group, 
Celestica

 

Wireless Outsourcing: Changes in the Technology Landscape

Dan Henes
Director, Americas Technology Center,
Celestica

 

10 AM

Break

 

10:30 AM

Views from Other Contract Design and Manufacturing Organizations

 

·      Same list of topics as above

 

Product Life Cycle Management

Daniel Boisvert
Director of Sales and Business Development
Solectron

 

Evolving Role for EMS Providers as both Contract and Original Design Partners for Mobile Phone OEM's

Ilkka Pouttu
Director Business Development
Elcoteq

 

The Role of Semiconductor Packaging in the Wireless Products Supply Chain

Chris Scanlan
Sr. Director, SiP (System in Package) Product Group
AMKOR

 

11:15 AM

Panel and Open Interactive Discussions

 

12:30 PM

Networking Lunch

 

1:30 PM

Views from Various Wireless Industry Segments

 

·      What do the Service Providers,  OEMs, Systems and Sub-Systems houses expect and need from the Outsourcing Industry of the future to drive costs down?

o       Low Volume/High Mix

o        High Volume/Low Mix

·     Handsets and other portable wireless products

·     WLAN and Bluetooth ™ industry

·      Cellular Infrastructure (basestations)

o       Macro cells

o       Micro cells

o       Pico cells

o        repeaters

·     Millimeterwave

o        Mmwave communications equipment

 

Emerging Service/Device Requirements

Javan Erfanian
Senior Associate Director
Technology Planning
Bell Mobility

 

Rapid Changes in the Telecom Market and Challenging Competition Generate Tough Requirements for the Outsourcing Industry

Herbert Merz
Sr. VP, Operations Division
Siemens, ICM Networks Operations

 

Ericsson's Supply Chain Wish List

Chris Ross
VP Operations, CDMA Systems
Ericsson

 

The Nature of Strategic Sourcing

Scott Searls
Associate VP, Supplier Management Group
Lucent Technologies

 

Making the Outsourcing Decision

Rick Landry
VP Manufacturing
Research in Motion Ltd. (RIM)

 

The Needs for Success of EMS Providers

Bob Legendre
VP Contract Assy and Supply Chain Management
Powerwave Technologies

 

Design and Supply of LTCC RF Modules

Jonathan R. Bost
Manager, Advanced Module Development Lab
Motorola

 

3:30 PM

Networking Break

 

4:00 PM

Views from Various Wireless Industry Segments

(continued)

 

5:00 PM

Panel and Open Interactive Discussions

 

6:00 PM

Adjourn

 

7:00 PM

Dinner 

New Hampshire Style

 

Thursday, June 19, 2003

7:00 AM

Breakfast

 

8:00 AM

Enabling Technology Providers for the Wireless Industry

  • Supply Chain Relationship Tools

  • Advanced Materials

    • Organic substrates

    • In-organic substrates

    • Adhesives

  • PCB/Substrate Fabrication Houses

  • Components

    • RF

    • IF

    • Baseband

    • Passives

      • Discrete

      • Integrated

    • Antennas

    • MEMs

  • RF Integrated Modules

  • Chip Scale Packaging Technologies

  • Advances in Wire Bonding, Die Bonding and Flip Chip Bonding

  • Shielding Technologies

  • Advances in Automated Assembly

  • Advances in Testing and Inspection Technology and Equipment

 

 

Is it Time for Some New Abbreviations to Replace EMS and ODM?

Ric Roetering
VP
Perlos Telecommunications and Electronics

 

SIP Supply Chain and Business Challenges

Roger Benson
Package Design Manager
Skyworks

 

A Passive Component Supplier's Perspective on Outsourcing Supply Chain Challenges and Issues

Cliff Zatz
Director of Sales
EPCOS

 

System-in-Package: The New Module Stacked-Die and Stacked-Package Solutions

Marcos Karnezos
CTO
ChipPac

 

Ceramic Solutions for the Wireless Industry Supply Chain

Jill Voss
Regional Sales Manager
DuPont Microcircuit Materials

 

Laminate Materials and the Electronics Manufacturing Food (er, Supply) Chain

Chet Guiles
Director, New Business Dev.
Arlon

 

Servicing the Global Supply Chain

Bob Nurmi
VP
Taconic

 

The CEM as a Development/Commercialization Partner

Lois Mabon
Global Product Manager
WL Gore

 

How Does A Test Company Test Their Products

Duane Lowenstein
Global Manager of Functional Test Diagnostic Technologies
Agilent Technologies

 

Tradeoffs of High-Speed Passive Component Placement versus Passive Component Integration

Guenter Schiebel
Strategic Marketing
Siemens Dematic AG

 

 

Break

 

 

Enabling Technology Providers
(Cont'd)

 

Noon

Lunch

 

1:00 PM

Set Up Break Out Sessions Working Groups

 

Questions to be answered:

 

1.   What are the gaps in:

Technology ?

Communication ?

 

2.   What is needed from the supply chain to address these gaps ?

 

3.   What can IWPC do to assist ?

 

4.   What "Special Interest Groups (*)" would you like to see set up and run by IWPC?

 

 

(*) =  Special Interest Groups means post workshop WEB based and teleconference discussions and other industry wide activities to provide value to and further the interests of IWPC Members on the topic of Outsourcing Trends in the Wireless Industry or other Wireless Industry topics.

 

The group will interactively discuss and identify opportunities for future fruitful development.

 

We will break into small working groups and allow members to interact with like and no-so-like minded professionals.

 

The goal of this process is to clarify the needs and identify new opportunities for development.

 

Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group.

 

 

Breakout Sessions

 

 

Breakout Session Reports

 

Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. 

 

Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.

 

This process dramatically expands the thinking of the attendees. 

 

 

Take Aways &
Closing Remarks

 

5:30 PM

Adjourn

 

Friday, June 20, 2003

9:00 AM

Tour of Celestica Facility

NOTE:  Due to customer confidentiality
the facility tour will be restricted.
Please contact IWPC for details.

Bus transportation will be provided to/from hotel and from/to tour location.

 

ATTENDANCE

IWPC Interactive Technical Workshops, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

 

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials:  June 5, 2003.

 

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $395. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)

 

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

 

Make checks payable to IWPC.

 

HOTEL

We have blocked 25 rooms at the 

Sheraton Nashua Hotel
11 Tara Boulevard
Nashua, New Hampshire  03062  USA
TEL:  603-888-9970
FAX:  603-888-4112

 

at a Conference Room Rate of $149. US single/double occupancy.

 

Please call the hotel before June 5, 2003  to make your reservations at this rate.  

 

After June 5, 2003 the hotel will release the un-reserved rooms and you may be charged full hotel rates.

 

AUDIO VISUAL

All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to audiotape all presentations and the interactive discussions. This tape will be transcribed and made available to all IWPC members.

 

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

 

DRESS

Business casual suggested.    No ties, please !!

 

HANDOUT MATERIALS

 

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  

 

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  

 

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]

 

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA  18974      USA

 

 

Click HERE to Register for Workshop