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NEW    –    International Wireless Packaging Consortium
Technology Exchange Forum


Limited to 35 seats
First Registered, First Served


A Day with 
Elcoteq Network Corp.

A Day Long Interactive Discussion with
Design Engineering and Procurement Professionals
about future needs for:

2D Pkg --> 3D Pkg --> System-in-Package Migration
Electro-Mechanical Integration

(antennas, connectors, shielding, plastics)

 Hosted by: Elcoteq Network Corp.

November 9-10, 2003  

Scandic Hotel Kalastajatorppa Helsinki
Kal astajatorpantie 1
FI-00330   Helsinki
Tel: +358 9 458 11
Fax: +358 9 458 1668

Organized by the International Wireless Packaging Consortium


Click HERE to Register for Workshop

Moderated by
Don Brown, Director, IWPC
Rene Douville, Technical Director, IWPC
Rob Ivanoff, Managing Director, Business Development



At the previous IWPC Workshop,

"Outsourcing Trends in the Wireless Industry"

it became clear that there is a need by the Electronic Manufacturing Services companies, (EMSs) which represent nearly 30% of global electronic manufacturing and Original Design Manufacturer companies (ODMs) to become much more familiar with currently available materials, packaging and device technologies to better serve the needs of their OEM customers, who are asking for much more design and development work.

The IWPC was asked to create a means for the technology supply companies to more closely communicate with the EMS and ODM companies.

This first in a series of Technology Exchange Forums (TEF) is a means for this deep level of technology exchange.


The goal of this Technology Exchange Forum is for the supply chain to better understand Elcoteq's technology and procurement needs, for future projects.

And for the supply chain to share their current technologies which will support those needs.

And for the supply chain to better understand the process to be listed on Elcoteq's Qualified Vendor List.


Sunday, November 9

7:00 PM

Social and Networking 

Reception & Registration

 At designated hotel - TBA

Monday, November 10

Bus Transportation provided to and from hotel

7:45 AM

Opening Remarks

Don Brown

8:00 AM  


Each person will be asked to introduce him/herself and share how they can contribute to this process

8:30 AM

OPENING Presentations

What are the technologies and applications that Elcoteq is interested in and why?

Migration path: 2D->3D->SiP

  • Which functionalities can be incorporated in a SiP and why
  • Is this commercially viable?
  • Who are the players and what are the liability and IP issues?
  • Which role does an EMS/ODM company play?
  • What does the supply-chain look like?
  • How is design-for-test of SiP taken into consideration?

Electro-Mechanical Integration
antennas, connectors, shielding, plastics)

  • Which electro-mechanical functionalities and/or components can be integrated?
  • Is this commercially viable?
  • Who are the players and what are the liability and IP issues?
  • Which role does an EMS/ODM company play?
  • What does the supply-chain look like?
  • How is design-for-test of intelligent plastics taken into consideration?


Elcoteq Introduction

Vice President, Sourcing
Elcoteq Network Corp.


Advanced Technology Trends

Manager, Corporate Component Technology
Elcoteq Network Corp.


Elcoteq Terminal Products Technology

Senior Manager, NPI & Design
Elcoteq Network Corp.


9:30 AM

Supplier Presentation 1

2D --> 3D -- System in a Package Migration Tradeoffs

Doug Mathews
Sr. Director RF Design/Applications

9:55 AM

Supplier Presentation 2

System in a Board Tradeoffs

Speaker TBA
Imbera Corp

10:20 AM


10:35 AM

Supplier Presentation 3

Stacked Die/Package Technical & Supply Chain Tradeoffs

Dr. Marcos Karnezos

11:00 AM

Supplier Presentation 4

Infineon's views of

Speaker TBA

Infineon Technology Design Centers

11:25 AM Supplier Presentation 5

"Smart Plastics" - the next step towards Electro-Mechanical Integration

Speaker TBA

11:50 AM

Supplier Presentation 6

Integrated LTCC Processes for Products such as PA's for Handsets and Bluetooth Modules

Andrew Rimmer
Kyocera Fineceramics Ltd

12:15 AM


  • What is the process to become listed on Elcoteq’s qualified vendor list?

Elcoteq's Qualified Vendor List

Vice President, Sourcing
Elcoteq Network Corp.

1:15 PM 

Supplier Presentation 7

Integrated Shielding

Speaker TBA
WL Gore

1:40 PM

Supplier Presentation 8

Next Generation Organic Materials for "Green" Handset Packaging

Fred Hickman
VP OEM Marketing-Technology
Park Electrochemical Corp.


2:05 PM BREAK  

2:25 PM

Set Up Break Out Sessions Working Groups


Questions to be answered:


1.  What are the gaps in:

Technology ?

Communication ?


2.  What is needed from the supply chain to address these gaps ?


3.  What can IWPC do to assist ?


The group will interactively discuss and identify opportunities for future fruitful development.

We will break into small working groups and allow members to interact with like and not-so-like minded professionals.

The goal of this process is to clarify the needs and identify new opportunities for development.

Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group. 

2:40 PM

Breakout Sessions


4:30 PM

Breakout Session Reports
Interactive Discussion

Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. 


Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders.


This process dramatically expands the thinking of the attendees.

5:30 PM Wrap up and Take-Aways  

6:00 PM



 7:00 PM

Dinner *

 Finland Style

(*)  Everyone is invited to a special dinner with good food and good friends.  Cost not included in registration fee.




IWPC Technology Exchange Forums, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.



Deadline for electronic version of handout materials:  October 24, 2003


ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc. 
We estimate that these costs will be approximately $295.. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)


Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.


Make checks payable to IWPC.



Scandic Hotel Kalastajatorppa Helsinki
Kal astajatorpantie 1
FI-00330   Helsinki
Tel: +358 9 458 11
Fax: +358 9 458 1668


Please contact the hotel directly to make reservations at the IWPC room block rate of 112 euros.  Please make reservations before Monday, October 27, 2003



All projector formats will be available for the speakers.  

·         Computer projector  

·         Overhead projector  

In addition, we plan to video and audiotape all presentations and the interactive discussions. This tape will be posted on the IWPC WEB site.



Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.



Business casual suggested.    No ties, please !!




It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:  


All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:  


You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.  

Please submit these materials either by email, as a Word for Windows file or Power Point files.  

Please send materials to:

[email protected]


or by snail mail to:


610 Louis Drive, Suite 301

Warminster, PA  18974      USA


Click HERE to Register for Workshop