A Day with Elcoteq

Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC
and
Rob Ivanoff, Managing Director, Business Development

ATTENDANCE

IWPC Technology Exchange Forums, available to IWPC members only (2 persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.

DEADLINE FOR HANDOUT MATERIALS

Deadline for electronic version of handout materials: October 24, 2003

COSTS

ALL attendees AND pre-approved guests will be asked to cover out of pocket workshop costs such as food, entertainment, booklet copying, audio/visual costs, etc.
We estimate that these costs will be approximately $295.. (US) per person.
(final cost to be determined as we get closer to the actual workshop date)

Attendees AND pre-approved guests will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL

Scandic Hotel Kalastajatorppa Helsinki
Kal astajatorpantie 1
FI-00330 Helsinki
Tel: +358 9 458 11
Fax: +358 9 458 1668

Please contact the hotel directly to make reservations at the IWPC room block rate of 112 euros. Please make reservations before Monday, October 27, 2003

AUDIO VISUAL

All projector formats will be available for the speakers.

· Computer projector

· Overhead projector

In addition, we plan to video and audiotape all presentations and the interactive discussions. This tape will be posted on the IWPC WEB site.

BUSINESS CARDS

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS

Business casual suggested. No ties, please !!

HANDOUT MATERIALS

It is our intention to prepare a handout booklet. We propose its contents be as follows:

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout booklet. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

This booklet will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file or Power Point files.

Please send materials to:

[email protected]

or by snail mail to:

IWPC

610 Louis Drive, Suite 301

Warminster, PA 18974 USA

Click HERE to Register for Workshop

TECHNOLOGY EXCHANGE FORUM BACKGROUND At the previous IWPC Workshop, "Outsourcing Trends in the Wireless Industry" it became clear that there is a need by the Electronic Manufacturing Services companies, (EMSs) which represent nearly 30% of global electronic manufacturing and Original Design Manufacturer companies (ODMs) to become much more familiar with currently available materials, packaging and device technologies to better serve the needs of their OEM customers, who are asking for much more design and development work. The IWPC was asked to create a means for the technology supply companies to more closely communicate with the EMS and ODM companies. This first in a series of Technology Exchange Forums (TEF) is a means for this deep level of technology exchange.
TECHNOLOGY EXCHANGE FORUM GOAL The goal of this Technology Exchange Forum is for the supply chain to better understand Elcoteq's technology and procurement needs, for future projects. And for the supply chain to share their current technologies which will support those needs. And for the supply chain to better understand the process to be listed on Elcoteq's Qualified Vendor List.

Sunday, November 9
7:00 PM	Social and Networking Reception & Registration	At designated hotel - TBA
Monday, November 10 Bus Transportation provided to and from hotel
7:45 AM	Opening Remarks	Don Brown IWPC
8:00 AM	Introductions	Each person will be asked to introduce him/herself and share how they can contribute to this process
8:30 AM	OPENING Presentations What are the technologies and applications that Elcoteq is interested in and why? Migration path: 2D->3D->SiP Which functionalities can be incorporated in a SiP and why Is this commercially viable? Who are the players and what are the liability and IP issues? Which role does an EMS/ODM company play? What does the supply-chain look like? How is design-for-test of SiP taken into consideration? Electro-Mechanical Integration (antennas, connectors, shielding, plastics) Which electro-mechanical functionalities and/or components can be integrated? Is this commercially viable? Who are the players and what are the liability and IP issues? Which role does an EMS/ODM company play? What does the supply-chain look like? How is design-for-test of intelligent plastics taken into consideration?	Elcoteq Introduction Vice President, Sourcing Elcoteq Network Corp. Advanced Technology Trends Manager, Corporate Component Technology Elcoteq Network Corp. Elcoteq Terminal Products Technology Senior Manager, NPI & Design Elcoteq Network Corp.
9:30 AM	Supplier Presentation 1	2D --> 3D -- System in a Package Migration Tradeoffs Doug Mathews Sr. Director RF Design/Applications AMKOR
9:55 AM	Supplier Presentation 2	System in a Board Tradeoffs Speaker TBA Imbera Corp
10:20 AM	BREAK
10:35 AM	Supplier Presentation 3	Stacked Die/Package Technical & Supply Chain Tradeoffs Dr. Marcos Karnezos CTO ChipPac
11:00 AM	Supplier Presentation 4	Infineon's views of System-in-Package Speaker TBA Infineon Technology Design Centers
11:25 AM	Supplier Presentation 5	"Smart Plastics" - the next step towards Electro-Mechanical Integration Speaker TBA Perlos
11:50 AM	Supplier Presentation 6	Integrated LTCC Processes for Products such as PA's for Handsets and Bluetooth Modules Andrew Rimmer Kyocera Fineceramics Ltd
12:15 AM	NETWORKING BOX-LUNCH & Presentation QUALIFIED VENDOR LIST What is the process to become listed on Elcoteq’s qualified vendor list?	Elcoteq's Qualified Vendor List Vice President, Sourcing Elcoteq Network Corp.
1:15 PM	Supplier Presentation 7	Integrated Shielding Speaker TBA WL Gore
1:40 PM	Supplier Presentation 8	Next Generation Organic Materials for "Green" Handset Packaging Fred Hickman VP OEM Marketing-Technology Park Electrochemical Corp.
2:05 PM	BREAK
2:25 PM	Set Up Break Out Sessions Working Groups Questions to be answered: 1. What are the gaps in: Technology ? Communication ? 2. What is needed from the supply chain to address these gaps ? 3. What can IWPC do to assist ?	The group will interactively discuss and identify opportunities for future fruitful development. We will break into small working groups and allow members to interact with like and not-so-like minded professionals. The goal of this process is to clarify the needs and identify new opportunities for development. Each working group will identify a leader and at the end, the leader will make a short presentation on the findings and conclusions of their group.
2:40 PM	Breakout Sessions
4:30 PM	Breakout Session Reports & Interactive Discussion	Each Working Group Leader will make a 10 minute presentation to summarize the Wish List Items and Conclusions of his/her working group. Group will come together and have an interactive discussion to exchange and challenge ideas presented by working group leaders. This process dramatically expands the thinking of the attendees.
5:30 PM	Wrap up and Take-Aways
6:00 PM	Adjourn
7:00 PM	Dinner * Finland Style	*() Everyone is invited to a special dinner with good food and good friends. Cost not included in registration fee.**

Sunday, November 9

Monday, November 10

Introductions

Migration path: 2D->3D->SiP

Electro-Mechanical Integration (antennas, connectors, shielding, plastics)

Dinner *

Electro-Mechanical Integration
(antennas, connectors, shielding, plastics)