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International Wireless
Industry Consortium
NEW – Technology Exchange Forum
Limited to 100 seats
First Registered, First Served
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High Efficiency, High Linearity Semiconductor Devices for
Basestation Power Amplifiers
Devices and Packaging for RF Power Generation and
Co-Hosted
by:
November 7-8, 2005 Munich, UK Kempinski Hotel Vier Jahreszeiten Munich Maximilianstrasse 17 80539 Munich, Germany Phone: +49-89-2125-2711 Fax: +49-89-2125-2720 Online-Reservation: www.kempinski-vierjahreszeiten.de
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Organized by the
International Wireless Industry
Consortium
Click HERE to Register for Workshop
Moderated by
Don Brown, Director, IWPC
and
Rene Douville, Technical Director, IWPC
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TECHNOLOGY EXCHANGE FORUM BACKGROUND The last IWPC Workshop on basestations hosted by T-Mobile was preceded by a very successful and popular one day workshop hosted by several Basestation Power Amplifier companies. As the key and limiting component in these amplifiers are the semiconductors and the semiconductor packaging, it was decided to focus a full one day event on these to address how they are evolving to meet the stringent demands being imposed both by the need for higher efficiency and powers, but also for use in mast head located radios. |
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TECHNOLOGY EXCHANGE FORUM GOALS The goals of this Technology Exchange Forum are:
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Monday, November 7, 2005 |
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7:00PM |
Social and Networking Reception & Registration |
Kempinski Hotel |
Tuesday, November 8, 2005 |
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7:00AM |
Breakfast & Registration |
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8:00AM |
Opening Remarks |
Don Brown |
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8:15AM |
Introductions |
Each person will be asked to introduce him/herself and share how they can contribute to this process |
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THE PA SEMICONDUCTOR TYPES AND PERFORMANCE |
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9:00AM |
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RF Power Technology for High Efficiency BTS Power Amplifiers, potentials, limitations and benchmarking Gordon Ma Infineon Technology Challenges for Future Systems, How Can This Be Addressed with LDMOS Mark Murphy Program Manager MST RF Power/Base Station BL Cellular Systems Philips Semiconductors RF Power integration in plastic packages: A cost effective system solution for distributed basestations Jean-Claude Loirat Director of EMEA Operations RF Division. Freescale
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10:15AM |
BREAK |
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10:40AM |
HOST PRESENTATIONS (Cont'd) |
GaAs Amplifiers for High Efficiency Dr. Richard Ranson Chief Engineer Filtronic Semiconductors Evaluation of HBT devices for BTS Linear PA Applications Elias Reese Business Director TriQuint
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11:30AM |
NETWORKING LUNCH |
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12:30PM |
HOST PRESENTATIONS (Cont'd) |
GaN Power Transistors for Next Generation High Efficiency Amplifiers Walter Nagy Senior RF Engineer Nitronex Wide Bandgap Device Capabilities Ray Pengelly VP/Chief Technology Officer Cree Microwave High Power, High Efficiency GaN HEMT Devices for High Linearity (WCDMA) Basestation Applications Matthew Poulton
Director,
Design Engineering RF Micro Devices
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1:45PM |
PANEL OF CO-HOSTS Co-hosts PA device suppliers will be given the opportunity to clarify
their needs, requirements and views and will engage in a panel session where
the audience is invited to ask questions and panelists will be given the
opportunity to ask each other and the audience questions. |
Co-Hosts Cree,
Filtronic,
Freescale, Infineon, Nitronex, Philips, |
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2:45PM |
NETWORKING BREAK |
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DEVICE PACKAGING TECHNOLOGY SUPPLIERS |
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3:15PM |
KEY ENABLING TECHNOLOGY PRESENTATIONS Suppliers will address the most important technologies and their key developments and expectations to address the emerging Power Amplifier requirements.
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(3 speakers) IWPC Members Next generation RF Power Amplifier Packaging Lisa Hamel Engineering Manager Technology Development Group Kyocera Thermal Management and Materials in the Packaging of Power Devices Stephan Martin Thermal Expert Dow Corning |
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4:45PM |
TAKEAWAYS |
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5:30PM |
Adjourn |
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DEADLINE FOR HANDOUT MATERIALS Deadline for electronic version of handout materials: Wednesday, October 26, 2005
COSTS/REGISTRATION FEE ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus One Day breakfast/lunch/2 Breaks), booklet copying, audio/visual costs, etc. We
estimate that these costs will be $TBD. (USD) per person. (For
IWPC Members, only.) Make checks payable to IWPC. HOTEL Kempinski Hotel Vier Jahreszeiten Munich Maximilianstrasse 17 80539 Munich, Germany Phone: +49-89-2125-2711 Fax: +49-89-2125-2720 Online-Reservation: www.kempinski-vierjahreszeiten.de
Please contact the hotel directly for reservations. Mention the IWPC room block rate of Single room Euro 205 Double room Euro 250 Cut-off date for reservations is October 7, 2005. After that date rooms cannot be guaranteed at the IWPC rate. AUDIO VISUAL A Computer Projector will be available for the speakers. In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions. BUSINESS CARDS Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card. DRESS Business casual suggested. No ties, please !! HANDOUT MATERIALS IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline. For ALL IWPC members:
For all companies who will be making a presentation at the Workshop:
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