An Overview of GaN HEMTs for Next Generation Basestation Applications - Shifting the Paradigm
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Size
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12/2006
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Infrastructure Equipment
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3.96 MB
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Ceramic Loaded PCB Materials - Thermal Impact on Design, Fabrication and Reliability
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Size
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12/2006
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Infrastructure Equipment
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2.45 MB
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Facing Thermal Challenges - Metal Backed HF-Materials
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Size
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12/2006
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Infrastructure Equipment
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0.2 MB
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GaN HEMTs for Commercial RF Applications
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Size
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12/2006
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Infrastructure Equipment
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1.09 MB
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IWPC Opening Materials: High Efficiency, High Linearity Semicondcutor Devices for Basestation Power Amplifiers-II
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Size
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12/2006
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Infrastructure Equipment
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0.26 MB
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LDMOS in High Efficiency Linear PA Concepts for W-CDMA and WiMAX
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Size
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12/2006
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Infrastructure Equipment
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0.44 MB
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NRF1 GaN-on-Silicon Technology Qualification, Reliability and Production Readiness for Wireless Infrastructure Applications
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Size
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12/2006
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Infrastructure Equipment
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0.76 MB
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Pushing the Boundaries with LD-MOS, Integration and Optimization for DPD
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Size
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12/2006
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Infrastructure Equipment
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2.12 MB
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Semiconductor Solutions for High Efficiency RF Power Amplifiers
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Size
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12/2006
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Infrastructure Equipment
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0.52 MB
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