Workshop Background:

The IWPC has organized 4 previous workshops on base station power amplifiers.

 

It is desired to get updated on advances in various power amplifier device technologies and circuit topographies to enhance efficiency, linearity and bandwidth for emerging high data rate networks.

Workshop Goals:

The goal of this workshop is to understand the current and future trends in power amplifier requirements for ground and tower mounted electronics for GSM thru LTE and 4G networks.  And to understand the requirements for multi-radio, RAN sharing and multi-OEM systems.

 

We also want to come to a comprehensive understanding of the current and future capabilities and costs of various power amplifier device technologies as they apply to these various applications.

Monday, May 11, 2009

7:00 PM

Social and Networking
Reception & Registration

At Hotel

Tuesday, May 12, 2009

7:00 AM

Breakfast & Registration

8:00 AM

Opening Remarks

8:15 AM

Self Introductions

Each person will be asked to introduce him/herself and share how they can contribute to this process

9:00 AM

Panel Session

High and Medium Power Requirements for Ground/Roof Based and Tower Mounted Electronics for 3G and 4G Signal Conditions

• Power levels (peak power vs average power)

• Linearization requirements

• Efficiency requirements

• Bandwidth requirements

• Reliability requirements

• Thermal performance

  • Passive vs Active Cooling requirements

• Costs

• Requirements for:

  • Multi-radio systems

  • RAN sharing

  • Multi OEM interface - from GSM thru LTE

• What metrics do OEMs or Operators use to measure amplifier "total solution effectiveness"?

  • Cost per watt?

  • Cost per function?

  • System wide performance?

  • Other?

• When will operators deploy multi-standard radios?  How many?  Where?

• Do operators desire to use tower top electronics on the ground - to minimize cabinet cooling loads?

• What are the differences in the levels of performance between tower vs ground mounted systems?

• Alcatel-Lucent

• Andrew

• Nokia-Siemens Networks

• Powerwave

• Ubidyne

10:20 AM

Networking Break

11:00 AM

Review of Power Amplifier
Semiconductor Technologies

• GaN on Silicon

• GaN on Silicon Carbide

• GaAs High Voltage HBT

• LDMOS

• What are the trends for higher efficiency and higher bandwidth products?

• Comparison between GaN vs LDMOS?

  • Are there system wide circuit solutions which benefit one technology over another?

    • Impact of switch mode designs?

    • Impact of various Doherty solutions?

    • Impact of Crest Factor Reduction solutions?

    • Impact of Pre-Distortion solutions?

    • Other?

• Impacts of higher power densities of GaN?

• What technologies and techniques are available to achieve 200 to 400 MHz bandwidth?

• What is the future of improved device efficiencies?

Technology Options for Next Generation Base Station RF Power Amplifiers

Director of EMEA Operations,

RF Division

Freescale

GaN HEMT for BWA & Mobile Telecom Applications

Business Development Manager

Cree

Fully Integrated Doherty in a Package

Project Manager

NXP Semiconductors

12:30 PM

Networking Lunch

1:30 PM

Panel

Review of Power Amplifier
Semiconductor Technologies

• GaN on Silicon

• GaN on Silicon Carbide

• GaAs High Voltage HBT

• LDMOS

• SiC

• What are the trends for higher efficiency and higher bandwidth products?

• Comparison between GaN vs LDMOS?

  • Are there system wide circuit solutions which benefit one technology over another?

    • Impact of switch mode designs?

    • Impact of various Doherty solutions?

    • Impact of Crest Factor Reduction solutions?

    • Impact of Pre-Distortion solutions?

    • Other?

• Impacts of higher power densities of GaN?

• What technologies and techniques are available to achieve 200 to 400 MHz bandwidth?

• What is the future of improved device efficiencies?

• Eudyna Devices

• Freescale

• NXP Semiconductors

2:20 PM

Networking Break

3:00 PM

Linearization and Efficiency Technologies

• Impact of switch mode designs?

• Impact of various Doherty solutions?

• Impact of Crest Factor Reduction solutions?

• Impact of Pre-Distortion solutions?

• Other?

RF Signal Processing Simplifies PA Efficiency Enhancement

VP Sales and Marketing

Scintera

Power Management Concepts to Improve Power Amplifier Efficiency

Technical Vertical Business Manager

Analog Devices

Linearization of HAT Modulators using digital pre-distortion

Design Centre Manager

Nujira

4:30 PM

Packaging Update

• What new materials and packaging solutions are being developed to enhance electrical and thermal performance and reduce overall costs of power amplifier devices and modules?

  • While maintaining long term reliability in tower and ground mounted applications.

New High Thermal Performance Package

KYOCERA Fineceramics GmbH

Microelectronics Division

5:00 PM

Closing Panel

OEMs, Device Makers

• Has the workshop met your expectations?

• If yes, how – if not, then what questions still need to be addressed?

• What are the next steps to move this industry forward?

• Alcatel-Lucent

• Andrew

• Nokia-Siemens Networks

• Powerwave

• Ubidyne
   

• Eudyna Devices

• Freescale

• NXP Semiconductors

5:40 PM

Adjourn for Day

7:00 PM

Social and Networking
Reception & Registration

for

Tower Mounted Electronics Reliability

Requirements and Solutions for Increased MTBF

At Hotel

in the Foyer Grober Saal room

DEADLINE FOR HANDOUT MATERIALS:

Deadline for electronic version of handout materials: 

Friday May 1, 2009

COSTS/REGISTRATION FEE:

ALL Hosts, Speakers, Panel Members and Attendees will be asked to cover out of pocket workshop costs such as conference room costs, food (Social Reception plus First Day breakfast/lunch/dinner plus Second Day breakfast/lunch plus 4 Breaks), booklet copying, audio/visual costs, etc.

We estimate that these costs will be 397,00 Euros per person. (For IWPC Members, only.)

ALL Hosts, Speakers, Panel Members and Attendees will be asked to pay this fee in advance with either Visa, Mastercard, American Express, cash, personal check or business check.

Make checks payable to IWPC.

HOTEL:

Holiday Inn Munich-City Centre
Hochstrasse 3

Munich, Germany 81669
Telephone: +49-89-4803-4444
Email: [email protected]

Please contact the hotel directly for reservations. Mention the IWPC room block rate of Euro 165,00 single occupancy.

Cut-off date for reservations is date,  April 27, 2009. After that date rooms cannot be guaranteed at the IWPC rate.

AUDIO VISUAL:

A Computer Projector will be available for the speakers.

In addition, we audiotape all presentations and the interactive discussions. Post workshop, presentations are made available to IWPC Members on the IWPC WEB site, along with “movies” of all presentations and panel sessions.

BUSINESS CARDS:

Business cards will be collected at the door from all attendees. We will make copies of these cards, which will be available to all who provided a business card.

DRESS:

Business casual suggested. No ties, please !!

HANDOUT MATERIALS:

IWPC prepares a handout binder with ALL presentation materials delivered to the IWPC on or before the deadline.

For ALL IWPC members:

All IWPC members are invited to submit a maximum of 4 pages of materials to include in this handout binder. These pages should NOT BE SALES MATERIALS. Rather, we suggest it contain technical information about your technology as it relates to the workshop topics.

For all companies who will be making a presentation at the Workshop:

You are invited to submit an advance copy of your presentation, complete with graphics and illustrations.

These materials will be copied and handed out at the workshop and included in the IWPC Web site.

Please submit these materials either by email, as a Word for Windows file, Power Point files or PDF files.

Please send electronic materials (up to 5 MB) to:

[email protected]

or use this FREE FTP Site for files greater than 5 MB

http://www.iwpc.org/cal/sitedrop.asp 

Click HERE to Register